History and Overview of SEMI S2

Lauren Crane Applied Materials
Rev 1

S2 Time Line
1985 – 1988 – 1991 – 1993 –
Work begins on a SEMI sponsored safety guideline to help unify equipment safety criteria in the industry and hopefully prevent outside agency involvement A draft document is circulated which is taken up for informal use while its contents continue to be developed. The first version is published as “S2-93”. With this increased profile, and subsequent official impact, opportunities for improvement are quickly identified an revision work begins again. The second version is published as “S2-93”, now 20 pages long. North American standards comprise most of the normative references.

2

Jan 1, 2006

Event, Venue information

S2 Time Line 199? – 1995 – 1996 – The SEMATECH (user) organization publishes an S2 “Interpretive” guide. which is soon revised and re-titled an S2 “application” guide which addresses many perceived gaps in the SEMI S2 document The European Machinery Directive become mandatory A related information section is added to S2-93 comparing its criteria to that of the Machinery Directive’s Annex I Essential Health and Safety Requirements. begin work on “S2-98” with some key drivers: •More international (fewer NA-centric references) •Less interpretive (consider “gaps” from the SEMATECH guide) •Specific assessment method •Expand issues covered •Reference other S-guidelines •Leverage lessons learned Event. a task force forms to 3 Jan 1. Venue information 1996/7 – Anticipating the SEMI 5-yr rewrite deadline. 2006 . This slightly expanded document is published as S2-93A.

First of several small revisions addressing fire protection criteria. 2006 Event.S2 Time Line 2000 – 2002 – 2004 – After more than 3 years of work and expanding the task force structure into ‘working groups’ S2-0200 is published. Venue information . now some 75 pages long. EMO circuit fault tolerance Began use of ‘Delayed Effectivety’ sections to better manage change • Laser Data Sheet & Changes to laser criteria • Risk assessment terminology to align with S10 2006 – First round of delayed effectivity sections become mandatory along with some additional small revisions 4 Jan 1. FECS topic. electrical test references.

Venue information . and test semiconductor products 3 – Limitations Doesn’t cover all possible EHS design criteria Not intended to verify compliance with local regulatory requirements 4 – Reference Standards Both normative and informative standards are referenced 5 Jan 1. measure. 2006 Event. assemble. Please read S2 for full details 1 – Purpose Performance based considerations 2 – Scope Equipment used to manufacturer.S2 Sections 1 thru 4 – Introduction The following slides are intended to indicate S2 topics only and might not accurately express the exact S2 criteria.

49 – Operator {Operation} run the equipment to perform its intended function 5.2.63 – Service {Service Personnel} tasks intended to fix broken equipment NFPA 704 H F R S Fire Health Reactivity 6 Risk Special Code OX 0 Lo Oxidizer 1 SA 2 Simple Asphixiant 3 W 4 Hi Water Reactive Event.2.2. Venue information 5.41 – Maintenance {Maintenance Personnel} tasks that keep working equipment working PM 5.26 – HPM – Hazardous Production Material A material with a hazard class of 3 or 4 per NFPA 704 Jan 1.S2 Section 5 – Terminology 5. 2006 .2.

reasonably foreseeable failures do not endanger personnel. Venue information . facilities or the community 7 – General Provisions Provide special hardware and tools needed for safety The official values of S2 are metric 8 – Evaluation Process Evaluation report should include only sections 9.S2 Sections 6 thru 9 – Basics 6 – Safety Philosophy Consider installation. maintenance. 2006 Event. operation. service & disposal Ensure single point.6 and 10 thru 27 Non-conformances should be risk ranked per SEMI S10 Note: “Should” criteria are for evaluation 9 – Documents Provided to User Manuals should conform to SEMI S13 lists of information for user and evaluator 7 Jan 1.

Venue information .S2 Section 10 – Hazard Warning Labels ▪ Hazard warning labels should conform to SEMI S1 Exception – labels dictated by law should conform to law 8 Jan 1. 2006 Event.

2006 Event. a PLC) or solid state but additional testing is required. but should “auto-restore when leaving the maintenance mode. ▪ Tool-only bypass for interlocks protecting operator tasks ▪ Protect adjustable interlock set points from change ▪ Electromechanical systems are preferred.g. Can also be FECS (Fail to Safe Equipment Control System – e. ▪ Ensure ungrounded control contacts ▪ Enclosures of hazards should be interlocked or Tool-accessible w/ label (plus internal barriers) 9 Jan 1. Venue information ..S2 Section 11 – Safety Interlock Systems ▪ Alert the operator on when activated ▪ Bypasses are okay.

data logging equipment circuits under certain conditions ▪ No intended bypass Hazardous AC ▪ Provide instructions for connecting to any EMO interface ports ▪ Electromechanical systems are preferred – can be FECS or solid state with extra testing ▪ Actuators no more than 10 ft of travel from operation and maintenance positions 10 Jan 1.4 kVA with accessible main disconnect if there are only electrical hazards Exception .EMO. Venue information .S2 Section 12 – Emergency Shutdown VA 240 30 V 60 V 30 current Hazardous AC & DC 20 10 OK 8 16 voltage 24 32 60 68 ▪ Remove hazardous voltage and 240 VA power beyond main enclosure Exception . safety device.not needed for ≤ 2. 2006 Event.

2006 Event. Venue information . liquid leaks x ▪ Prevent access and top D entry per Appendix 1 Dmax ~ x ▪ Use ATL certified parts if they are safety critical ▪ Use a color code for conductor insulation ▪ Multiple feeds okay if labeled ▪ Opening main disconnect kills all power (even UPS) 11 Accredited Testing Laboratory Jan 1.S2 Section 13 – Electrical Design ▪ Limit the need for work w/ live hazardous potentials ▪ Conform to an appropriate electrical design standard SEMI S22 NFPA 79 UL 508A UL 61010 ▪ Provide barriers against accidental contact. dropped tools.

g. notify the operator shut down tool after current wafer is done signal the facility 12 ▪ Design fire systems to be always on (incl. 2006 Event. time to escape may be needed..S2 Section 14 – Fire Protection ▪ Provide fire systems (detection or suppression) per a SEMI S14 fire risk assessment [or provide locations for end users to install their own devices ▪ Provide a summary report to the user ▪ Fire system activation should cause an audible and visual alarm at the tool and shut down chemical feeds ▪ Manual activation capability is required for suppression. asphyxiation. noise). and inspection methods Jan 1. Venue information . optional for detection ▪ If suppressant release is hazardous (e. ▪ If fire system faults. 24 hr battery) ▪ Document safe work practices.

Venue information . 2006 Event.S2 Section 15 – Heated Chemical Baths ▪ Use SEMI S3 to assess “heated chemical baths” S3 title is now “Safety Guideline for Process Liquid Heating Systems” 13 Jan 1.

S2 Section 16 – Ergonomics and Human Factors ▪ Conform to SEMI S8 Summary of SEMI S8 Supplier Ergonomic Success Criteria (SESC) 1 Manual Material Handling Assess any parts > 10 lbs or > 5lbs & lifted 1x/5min 2 Product Loading in a JDEC trays. Standing Posture 3 Wafer Cassette Loading Load port dimensions 4 Work in Process Storage Wafer cassette shelves 5 Manual Wafer Cassette Section 3 limits hand rotations to 10° Rotation Device Design 6 Handle Design Specs & force limits for various handle types 7 Maintainability and Lighting & dimensions for various working postures Serviceability 8 Display Location Video display parameters 9 Hand Control Location Operation & maintenance (not service) Height and reach based on frequency of use 10 Workstation Design Seated & standing body fit. 2006 Event. reticle cassettes…not wafers. control locations 14 Jan 1. Venue information . magazines.

Hazardous Energy Isolation ▪ Sub-assembly isolation may be provided for sub-assembly work (instead of total tool isolation) ▪ Manuals should identify hazardous energies and how to Shut down Isolate Affix Lock Verify Restore ▪ Isolation devices should be readily accessible and only lockable only in the de-energized (“off”) position 15 Jan 1. Venue information . 2006 Event.S2 Section 17 .

Venue information . aging. installation and operating. corrosion and abrasion ▪ Ensure possible rupture fragments will be contained ▪ Pipes & tubing designed with ‘appropriate’ safety factor ▪ Excessive temperatures “Cold” = -10° C Accessible Parts ▪ Provide guards for hazardous moving parts “Hot” varies with material.S2 Section 18 – Mechanical Design ▪ Stable during shipping. 10° Tilt test for unanchored equipment ▪ Consider fatigue. Parts held for < 5s in normal use. 2006 Parts that might be touched. Parts held continuously in normal use. Max Temp °C Polymer Ceramic Metal 95 85 60 80 70 56 65 60 51 16 Jan 1. Event.

Venue information .S2 Section 19 – Seismic Protection ▪ Control risks resulting from seismic events (it may not be feasible to eliminate them) ▪ Make safety critical parts accessible for assessing damage ▪ Design equipment and anchorage points to withstand… Equip w/ HPMs Equip w/o HPMs Horizontal loading of Horizontal loading of 94% of weight 63% of weight 85% of weight is available to resist overturning ▪ Clearly identify the location of anchorage points ▪ Provide in user documents dimensions and weight of each module drawing of equipment location and type of feet weight distribution on each foot location of CG in each module acceptable anchorage points 17 Jan 1. 2006 Event.

provide personnel safeguarding based on a hazard assessment ▪ Asses Industrial Robots to an appropriate standard (e.. 2006 Event.S2 Section 20 – Automated Material Handlers ▪ Scope: ►Substrate Handlers ►Industrial Robots ►Unmanned Transport Vehicles (UTVs) ▪ For general devices and substrate handlers. ANSI/RIA 15.06) ▪ For UTVs (both floor and space traveling) provide Collision avoidance Interlocks to ensure a secure load Unsafe conditions detection 18 Jan 1. Venue information .g.

Venue information .S2 Section 21 – Environmental Considerations ▪ To the extent practicable do not use Ozone Depleting Substances or Perflourocarbons ▪ Facilitate decommissioning and disposal (See SEMI S12) ▪ Consider conservation Re-use or recycle (H2O & chemicals) Reduce flows (e. 110% secondary containment & leak sensors Access to inspect and remove spills Ref Means to check fill levels Appendix 3 Accept shut off signal from remote monitor ▪ For effluents. wastes and emissions… Prevent hazardous mixtures Make point of use collection accessible Consider point of use abatement 19 Jan 1.. 2006 Event. maintenance and packaging materials ▪ Prevent unintended releases. when idle) Minimize service.g.

1 in. H2O (-1.0 in H2O for pump exhaust) 20 Jan 1. ▪ Provide exhaust interlocks for equipment handling HPM’s ▪ Design exhaust interlock alarms to be capable of interfacing with the user facility. ▪ Per Appendix 2 exhaust for a gas box must dilute flammables below 25% of LEL ▪ Optimize exhaust flow. Venue information . Target pressure: -0.S2 Section 22 – Exhaust Ventilation Supplemental control Primary Control Secondary Control ▪ Exhaust systems should be assessed per Appendix 2 and SEMI S6. 2006 Event.

Jan 1. Venue information .g. 2006 Event.. fittings.S2 Section 23 – Chemicals ▪ Create an inventory of chemicals and identify them as HPM or ODOROUS or IRRITANT ▪ Perform a hazard analysis which addresses potential Mixing of incompatibles Routine emissions Maintenance emissions Ref Appendix 3 Failure points (e. pumps) ▪ Label hazardous gas enclosure doors ▪ Exposure Limit Criteria Scenario Criteria Normal Operation 1% of OEL Maintenance 25% of OEL Equipment Failure 25% of OEL 21 ▪ Appendix 2 also addresses some chemical leak limits.

2006 Event. ▪ Minimize need to remove shielding.S2 Section 24 – Ionizing Radiation ▪ Limits 2 μS/hr 10 μS/hr normal operation maintenance & service x . ▪ Provide a phone number and address for radiation safety support personnel Jan 1. at tool surface or closest approach to source. ▪ Conduct a tool radiation survey per Appendix 4.ray γ . Venue information 22 .ray As Low As Reasonably Achievable ▪ Prevent access to radioactive materials.

contains test methods and limits for operation and service/maintenance scenarios for various frequency regimes 3 kHz 100 MHz 0 Hz Electric & Magnetic Fields Pacemaker Warning levels 0 Hz .3 – 300 GHz 400nm 180nm UV ▪ Direct values for Irradiance 23 Jan 1.3 kHz 1 Hz 300 MHz ▪ Direct values for induced & contact current 50/60 Hz ▪ Direct values and 20% of the IEEE C95. 2006 .S2 Section 25 – Non-ionizing Radiation & Fields ▪ Appendix 5. Venue information Power Density 0.1-1991 values for ‘controlled’ & ‘uncontrolled’ access ▪ 20% of the IEEE C95.1-1991 values 1nm -700nm 400nm IR ▪ 20% of the ACGIH values for Irradiance and Radiance (1996) Event.

S2 Section 26 – Lasers ▪ Design the equipment to be no greater than laser class 2 (higher class lasers may be incorporated) ▪ Label product w/ laser class (usually not required for class 1) ▪ Provide the end user certain laser data including… Energy/Power Temporal Mode Pulse Rep Rate Pulse Duration Pulse Waveform Physical Location Description of laser hazards Administrative controls for safety during maintenance & service Necessary PPE ▪ Have proof of laser certification. Venue information . 2006 Event. and justification if engineering controls are not used to protect personnel 24 Jan 1.

7 1. Venue information Object 25 Jan 1.5 m 1.5 m ▪ Limits: 80 dBA continuous 120 dB impulse 1. 2006 .4 dBA Y= Event.2 m Ambient ▪ Correction to determine object noise when object + ambient noise is measured.0 2.3 1.5 1.S2 Section 27 – Sound Pressure Level 360° 1m 3.0 0.8 0.6 0. If (A + O) – A = X Then O = (A+O) – Y For X = 3 4 5 6 7 8 9 10 dBA 3.

2006 Event.S2 Section 28 and RI’s 28 – Related Documents Reference material with no impact on assessment Related Information 1 Equipment/Product Safety Program 2 Additional Standards That May Be Helpful 3 Hazard Labels 12 Light Tower Color and 4 EMO Reach Considerations Audible Alert Codes 5 Seismic Protection 13 Surface Temperature 6 Continuous Hazardous Gas Detection Documentation 7 Documentation of Ionizing Radiation 14 Recommendations for FECS Design 8 Documentation of Non-ionizing Radiation 9 Laser Checklist 10 Laser Certification Requirements by Region of Use 11 Other Requirements by Region of Use 26 Jan 1. Venue information .

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