Metal Matrix Composites

(MMC)
 Purpose of using MMCs
• higher specific modulus and strength
• better properties at elevated temperature
• lower CTE
• better wear resistance

Disadvantages of using MMCs:

• less toughness
• more expensive
Applications of MMCs

Mid-fuselage structure of Space

Shuttle Orbiter showing boron-
aluminum tubes. (Photo courtesy of
U.S. Air Force/NASA).

Cast SiCp/Al attachment

fittings: (a-top) multi-inlet
fitting for a truss node
 MMC processing
• solid-state processing: suitable for composite
with large surface area of high energy solid-
gas interface, e.g. matrix in particle or fail form.
– diffusion bonding:
using foil matrix Fig 3.1
e.g. Ti, Ni, Cu, Al reinforced with boron
– power metallurgy:
using particle materials, suitable for particle or whisker
reinforced composites, Vf < 25%
– co-extrusion, drawing
limited to ductile reinforcement and matrix
Diffusion bonding
• liquid-state processing
– Casting
Difficulties:  wetting
 chemical reaction
 non-uniform mixing (due to density difference)
,  can be improved by
• using precoating on reinforcements, e.g. pyrolitic graphite
coating
• modifying the melt, e.g. add Li in Al melt
– compo casting, rheocasting:
– infiltration on perform:
– squeeze casting: Fig 3.2
Squeeze Casting
Liquid Melt Infiltration on Preform
• Deposition processing
– spray co-deposition, Fig 3.4
– chemical and physical vapour deposition
(e.g. tungsten)
– electroplating (e.g. nickel)
– sputtering and plasma spraying
Spray Co-deposition
• In-situ processing
Unidirectional laminar or rod-like eutectic alloys, Fig
3.5 (in-situ composites)
 Interface reactions
Interdiffusion between matrix and reinforcement:
x  Dd t

Where x = extent of interdiffusion

Dd = diffusion coefficient

Interdiffusion  interfacial layer (Fig 3.6)

 mechanical properties are degraded (Fig 3.7)
Effect of Interfacial layer
Mechanical properties of MMCs
 lower CTE than metals (Fig 3.8)
 lower coefficient of thermal and electrical conductivity (Table 3.2)
 higher thermal deformation resistance
thermal conductivi ty

thermal expansion coefficien t
 improvement in stiffness (Fig 3.9, Fig 3.10)
 strength and ductility
Reinforcement-matrix interface:
Strong  high strength
Extensive interaction  low strength,
low fatigue resistance Fig 3.12～Fig 3.17
 creep (Fig 3.18, Fig 3.19)
 fatigue (Table 3.4, Fig 3.20)
Thermal Expansions of MMCs
Thermal Conductivity of MMCs
Young’s Modulus of MMCs
Strength of MMCs
Temperature Effect on MMCs
Creep Curves of MMCs
Fatigue of MMCs
 Commercial MMCs
• Multi-filamentary superconductor
• Aluminum reinforced with silicon carbide
particles
Tuning of CTE
Ageing Hardening of MMCs
Improvement in Creep Resistance