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Engineering Project

Recommendations (11)

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At a recent meeting, members discussed
ways in which to curtail the high wire bonding defect rate and
subsequent customer complaints Wire bonding
of IC packages is a critical process for both breakdown yield and
product reliability. Although intension of first wire
bonding has been used to determine the quality of wire bonding,
most analyses of wire bonding defects inline and customer
complaints with wire bonding defect indicate that the failure
location was not located on first wire bonding. (NOTE : Add 3-4
more sentences that describe characteristics of the problem or
statistics that reflect its severity)
For instance, the defect rate caused by
wire bonding was 0.2% and three customer complaints were
related to wire bonding fault in 10Mpcs production output.
The inability to identify the root cause of wire
bonding defects and eliminate them makes it impossible to
identify the optimal process parameters, exacerbating the high
wire bonding defect rate and customer complaints.
Therefore, we recommend developing a
measurement method capable of determining the process
capability, thus reducing the defect rate and customer complaints
by optimizing the process parameters. To do so,
a measurement method for wire bonding tension can be reviewed
based on replies from the wire bonding defect inline and analysis
of customer complaints. Process capability can then be estimated
accurately. Additionally, process parameters can be optimized by
using the Taguchi method to enhance quality of wire bonding.
As anticipated, the proposed measurement method can
reduce the wire bonding defect rate from 0.2% to 0.1%.
In addition to contributing to efforts to develop a feasible
measurement method of wire bonding tension, the proposed
method can simulate the root cause of wire bonding defects,
ultimately providing a solution for rising wire bonding tension in the
IC packaging industry in order to enhance assembly yield and
wafer quality.
Our management supervisors recently expressed
concern over how to lower production costs and sustain or even
enhance product quality of integrated circuit components.
As the semiconductor industry rapidly evolves, integrated circuit
components continuously develop in line with consumer requirements
for thinner and miniaturized electronic products. Wafer chips and
system boards have a limited link distance when using a lead frame in
conventional semiconductor package technologies, making it
impossible for them to conform to high speed communication and high
channel density requirements. A collaborative effort between
manufacturers of chip packages and carriers has devised a new
package technology, i.e., tape automated bonding, a new wafer chip
carrier and tape. As a promising alternative to the above limitations, a
tape can contain thinner channels with a shorter electrical connection
distance between chip and system board to comply with high speed
communication and numerous channel requirements.
Process capacity index-Cpk is used to determine
the capability performance and equipment stability of the tape
manufacturing process. Additionally, process capacity index
should, in theory, be positively related to production yield.
However, production yield is insufficient even when the tape
process has an acceptable Cpk value and stable trend chart in
statistical process control. Short, open and etching defects are
major defect items identified during analysis of yield loss during
final visual inspection. For instance, the
final visual inspection yield of tape is under 75%. Moreover,
major three defect rates are -8.5% for short, -4.3% for open and
-2.8% for etching processes. The inability
to enhance the production yield of the tape process makes it
impossible to achieve a satisfactory production yield owing to the
lack of a good Cpk, ultimately incurring high production costs
and low product quality.
Therefore, we recommend identifying the root causes
incurring low production yield in tape manufacturing by analyzing
process parameters and possible causes of major visual defects.
To do so, the leading three defect items can be determined
from production yield data. Possible causes of major visual defects can
then be simulated based on the cause and effect diagram method. Next,
parameter combination from crossing processes can be optimized by
using the Taguchi method to reduce the defect rate of the tape process.
As anticipated, the proposed Taguchi method can reduce
the occurrence of the leading three defects by 10% and increase the
production yield above 80%. In addition to providing
further insight into how process performance index and production yield
in the tape process are related, results of this study can contribute to
efforts to increase production yield and enhance industrial
competitiveness. (NOTE : Add 2-3 more sentences that describe more
thoroughly how the proposed method contributes to a particular field or
Further details can be found at