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Engineering Project

Recommendations (15)

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At a recent meeting, members discussed ways in
which to ensure reliable wireless sensor networks (WSNs).
WSNs have been extensively studied owing to the potential
applications such as in military surveillance, elderly health care and
house security. WSN devices largely operate under resource-limited
conditions. Computing capability, energy, and communication
bandwidth are the most precious resources. However,
a secure and energy-aware communication protocol on WSN is still
unavailable for practical applications. (NOTE : Add 3-4 more
sentences that describe characteristics of the problem or statistics that
reflect its severity) Although the S-MAC protocol
developed by We Ye et al. presents an example of specific research
interests, the protocol addresses only energy conservation and self-
configuration-related issues. Applying the S-MAC
protocol to conjugate with other security protocols increases the
connection delay of WSN by roughly 30-50%, making it impossible to
establish a reliable and efficient WSN.
Therefore, we recommend developing a
novel security protocol, capable of cooperating efficiently
with other energy-conserving communication protocols.
To do so, a complex WSN can be constructed
to function as the operating platform. Next, the performance
of three communication protocols can be evaluated when
operating with several security protocols, including the
proposed one. Moreover, the drained energy and timing
cost can be compared statistically to yield the simulation
results. As anticipated, the power consumption
does not increase, and the overhead on connection delay is
under 20%. Importantly, the proposed protocol
can be adopted to establish the foundation of energy-
efficient and dependable WSNs. (NOTE : Add 2-3 more
sentences that describe more thoroughly how the proposed
method contributes to a particular field or sector)
Our management supervisors recently expressed
concern over how to ensure smooth time-to-market delivery of
advanced technology products. Time-to-market delivery
in semiconductor manufacturing is of priority concern in advanced R&D
technology development. Ensuring that products reach time-to-market
delivery goals requires that operational managers and fabrication (fab)
personnel fully support R&D experimental lots (R&D Lot). Nevertheless,
capacity shortage in a wafer fab fails to comply with output
requirements of customers, leading to delays in the R&D lot schedule
and the overall project. Although an output-driven fab
normally adopts Move and Turn Rates as key performance indicators
(KPI), such indicators fail to assess the actual performance of R&D lots
in monitoring R&D experiments and ensuring (exact OR prompt)
experimental delivery. Fab managers are also interested in the overall
R&D cycle time instead of local movement and turn rate indices,
subsequently creating a conflict among indices between R&D and fab
For instance, the error rate exceeds
25% when using the conventional method of T/R or Cycle
time per mask layer (days). Although managers are also
concerned with solutions, the long cycle time of a R&D lot
creates vague responsibilities the wafer fab and R&D,
necessitating the development of a feasible cycle time
model. As for the total cycle time of
a R&D Lot, TCTRD, consists of fab-run RD lot time
(TCTFab) and R&D development handling time (HT_RD).
Restated, TCTRD= TCTFab + HT_RD. Vague
responsibilities and inadequate indices may delay the lot
schedule and impede time-to-market delivery of advanced
technology products.
Therefore, in addition to constructing an effective
performance index, we recommend developing an optimal R&D
Lot cycle time reduction model capable of executing timely,
effective and clearly defined measures to achieve project cycle
time, regardless of whether in R&D or in a wafer fab.
To do so, X-factors can be modified to determine the
R&D cycle time and derive the F-factor. Based on the two factors,
a model can then be constructed to shorten technology
development time, and continuously improve quality control by
using the SPC chart as a monitoring mechanism. Next, the X-
factor (XFab), excluding R&D handling time (HT_RD), can be
used to determine the on-time delivery performance of a wafer
fab for an advanced R&D technology. Additionally, the F-factor
can be used to monitor the maturation process of advanced R&D
technology manufacturing and reduce lot inventory costs.
As anticipated, the proposed performance
indices can be used to accurately forecast the R&D lot
schedule, shorten lot cycle time and ensure time-to-market
delivery of advanced technology products. KPI design
provides global optimization benefits that link R&D and the
wafer fab. The proposed performance index
can ultimately shorten R&D cycle time and enhance the on-
time delivery of advanced technology products by fab-run
R&D Lots. Given R&D technology trends to enhance
product quality and manufacturing maturity through KPI
design, enterprises can exploit these factors to upgrade
operational performance in semiconductor manufacturing.
(NOTE : Add an addition 1-2 more sentences that
describe more thoroughly how the proposed method
contributes to a particular field or sector)
Further details can be found at