TFT-LCD Process and

Fab Design

Hendry Chang
 What is TFT-LCD?
Thin-Film Transistor (TFT) Liquid Crystal Display
(LCD)
 LCD application

1950s “niche” research Multi-Billion industry today!!!

Application of TFT-LCD

Monitor Notebook PC

TV Other application
How TFT-LCD works
 LCD Display Theory
上偏光 片

彩色濾 光片
光源經 液晶
層扭轉 90°
液晶層
TFT Turn OFF
TFT Turn ON
~ ~ TFT 基板

下偏光 片

背光源
 Basic Components of TFT-LCD

 基本 構造

背光板 (BACK LIGHT)

下偏光片 (DOWN POLARIZER)

薄膜基板 (TFT SUBSTRATE)

液晶 (LIQUID CRYSTAL)

彩色濾光 片 (COLOR FILTER )

上偏光片 (UP POLARIZER)
 How color display works

DATA DRIVER IC

R G B R G B
紅
R G B R G B
黃 紫
白 R G B R G B
綠 青 藍 R G B R G B

R G B R G B

SCAN DRIVER IC TFT

 TFT-LCD Process

TFT(Array) Array: 電晶體

Thin-Film Transistor ( 矩形陣列 )
TFT 基板生成
LC(Cell) Cell: 面板生成
Liquid Crystal
(Panel)

LCM Module: 產品模組

Module 組裝
 TFT-LCD Process

TFT Process
基板投入 薄膜
Substrate Thin Film

Color
蝕刻 黃光
Filter
Etch Photo

OK
CELL 測試
Array Test
 TFT Process

5 道光罩

薄膜
素玻璃
Glass 蝕刻 黃光
Substrate

TFT 基板
BOX
 TFT Process
酸,
去光阻液
氣體
鍍 stripper
下
一 去光阻
層
膜 蝕刻 (etch)
鍍膜 (sputter,cvd)
顯影
光罩 (reticle) 液

上光阻 (coater) 顯影 (developer)

對準 , 曝光 (stepper)
 TFT Process (1)

空白玻璃 鍍第一層膜 上光阻 (coating)

酸, 顯影
氣體 液
光罩

蝕刻 (etching) 顯影 (developing) 對準 , 曝光 (stepping)

 TFT Process (2)
去光
阻液

鍍第二層膜 上光阻
去光阻 (striping)
酸, 顯影
氣體 液
光罩

蝕刻 顯 影 對準 , 曝光
 TFT Process (3)

去光 鍍第三層膜 ,
阻液
請依之前所
示範的方法
舉一反三 , 自
行模擬想像
光阻剝離
 CELL Process (1)
TFT 基板 (TFT Substrate)

彩色濾光片
(Color Filter)
 CELL Process (2)

Spacer 灑佈 PI 塗佈
熱壓
Hot press
對位
Misalignment Spacer Spray
配向
Rubbing PI Coating
TFT

PI 塗佈
點銀膠
Ag Dispenser
框膠
Sealant
配向
Rubbing PI Coating
CF
Dispenser

偏光片貼片
切割裂片 液晶注入 再配向 Polarizer Cell 測試
Scribe & Break LC injection Isotropic Attachment Cell test

封口 加壓脫泡
End sealing Auto Clave
Color Filter in TFT-LCD

上偏光片

彩色濾光片

液晶

線路
電晶體

薄膜 (TFT) 基板

下偏光片
 TFT-LCD Section

偏光板

Color Filter

液晶 層

TFT Array

偏光板

背光模組

螢光 灯泡
What is “Pixel”? 畫素結構圖
 Pixel and Color Filter

畫素 (PIXEL)
★ 構成螢 幕上所有顏 色的單位
主要以三元色為 主 ( 紅、綠、 藍 )

★ 其中紅 、綠、藍三 色則稱為子 畫素

720mm 彩色濾 光片
Color Filter

畫素

子畫 素
610 mm
 RGB- 3 Basic colors

紅
黃 紫
白
綠 青 藍
 Sub-Pixel Types

Mosaic Triangle Strip

常 用 於 Monitor ，
適合 AV 動畫 ，小尺 NB 等大尺寸
寸 panel 之設計。 Panel 。
 CF Process

基板投入 受入洗淨 Black Matrix R/G/B

UnPacker INC BM RGB

研磨 ITO 鍍膜 切割/裂片 出貨包裝

Polish ITO Cutting Packer

 Cr Glass Input
CF Process

B Negative resist Coating,

Positive resist Coating, Dosing,
Black Matrix Developing, Post-baking, Etching, B sub-pixel Dosing, Developing, Post-
baking.
Stripping.

R Negative resist Coating, Dosing,

R sub-pixel Developing, Post-baking. and then ITO

G Negative resist Coating, Dosing, Cutting Final Inspection

Developing, Post-baking.
G sub-pixel
Color Filter Output
CF Profile
 CF Process and Material Flow

STK STK STK

基板投入 受入洗淨 Black Matrix R/G/B
Cr BM RGB
UnPacker INC
Resin BM Backup Line

研磨 ITO 鍍膜 切割/裂片 出貨包裝

Polish ITO Cutting Packer

STK STK
 CF Process and QC Flow

BMI RGI
基板投入 受入洗淨 Black Matrix R/G/B

UnPacker INC BM RGB

研磨 ITO 鍍膜 切割/裂片 出貨包裝

Polish ITO Cutting Packer

抽檢
ITI 最終檢 OQC
 What is a TFT-LCD Fab?
Fab is the abbreviation of “Fabrication”
TFT-LCD Fab is a fabrication plant that
fabricate the TFT-LCD panel.
Usually a TFT-LCD Fab is the
combination of “ Main Fab”, “Supporting
Area” and “Central Utility Building (CUB)”.
 What make a Fab?
Building
Main Process System
Facility System
 3 Major Process Groups
Array (TFT) Process
The Array Process is similar to the semiconductor manufacturing process,
except that transistors are fabricated on a glass substrate instead of a silicon
wafer.
Cell (LC) or (Panel) Process
The Cell Process joins the arrayed back substrate and the front substrate that
is fitted with a color filter. The space between the two substrates is filled with
liquid crystal.
 Module (LCM) Assembly Process
The Module Assembly Process involved connecting additional components,
such as driver integrated circuits and backlight units, to the fabricated glass
panel.

Some Fabs are CF in-house; Some manufacturers have LCM in different

Fab.
TFT Process Plan
CF Process Plan
Module Process Plan
 A Fab Project includes
 C/S/A (Civil, Structure and Architecture
MEP ( Mechanical, Electrical and Plumbing)
Process Utility Systems
UPW&WWT
Chemical Distribution Systems
Bulk & Specialty Gas Systems
Clean Room System
I.E.
S.M. (Space Management)
Utility Hook-Up
Typical Fab Design Process
Integrating Design Process
Flat Panel Fab Design Team
Flat Panel Factory
Manufacturing Flow Optimization
Cleanroom Cost Saving
Determine Utility Requirement
Space Coordination
Space Management
Cleanroom
Cleanroom Air System
 Air Flow in Cleanroom
Laminarity in main airstream < 10°

Velocity, m/s

3.80

3.26

2.71

2.17

1.63 Large slow moving vortices between FFU’s

1.08
Partial Coverage Cleanroom Airflow without Diffusion Device
0.54
Laminarity < 10°
Small vortices at the ceiling between FFU’s
0

Partial Coverage Cleanroom Airflow with Diffusion Device

Building Section
Chilled Water System of a FAB
Conventional Layout
New Fab Layout