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MEMS GYROSCOPE
Abhishek Garg (10020) Sanjeev Kumar (10645) Shobhit Yadav (10695) Guided by : Prof. N S Vyas Dept. of Mechanical Engineering IIT Kanpur
Gyroscopes
Gyroscope is a device used for measuring and maintaining orientation and works on the principle of angular momentum. Working :- The device consists of a spinning wheel or a disc whose axle is free to take any orientation and this orientation changes much less in response to a given external torque. Since the external torque is minimized by mounting the device in gimbals, its orientation remains nearly fixed, regardless of any
http://www.youtube.com/watch?v=cquvA_IpEsA
MEMS Gyroscope
MEMS gyroscope is based on Coriolis force which is induced in it due to the combination of vibration of a proof mass and an orthogonal angular rate input. The proof mass is generally suspended above the substrate by a suspension system consisting of flexible beams and overall dynamic system can be realized as a 2 degrees of freedom mass spring damper system. Prior works on MEMS gyroscope:- Tuning fork gyroscopes, torsional gyroscopes, ring gyroscopes, piezoelectric vibrating gyroscopes and clover leaf gyroscope. Application:- Spacecraft orientation, automotive sensors, image stabilization
When gyroscope is subjected to an angular rotation a Coriolis force having a frequency same as drive mode oscillation is generated in the sense
mode direction. This force excite the sense mode accelerometer causing
the proof mass to respond in the sense direction. Equations of motion can be expressed as :-
+ + =
+ + = 2
(1)
(2)
The resonant frequency of the sense mode accelerometer is designed closed to the frequency of the coriolis force. Then the coriolis force excites the system into resonance in the sense direction.
Drive mode operation :- The drive mode oscillator is a 1 DOF resonator, which can be modelled as a mass-spring-damper system consisting of the drive proof-mass , drive mode suspension system providing the drive stiffness and the drive damping consisting of viscous and thermal elastic damping. + + = sin t = 0 sin( + ) (3) (4)
0 =
(5)
+
2 2
and = =
( )
( )
+(
(6)
= (
If = and =
+ ) where =
to achieve the maximum possible gain in sense mode it is generally desirable to operate at or near the peak of sense mode response curve i.e. = . Note:- the sense mode phase becomes -900 from the drive velocity
Phase relations
The sense mode position phase depends on the drive and sense frequency separation ( f ) and damping. The drive mode oscillator is usually operated at resonance and drive mode position phase is -900 relative to the applied drive signal. from equation () = 0 sin( + ), () = 0 sin( + ),
Design Aspects
Linear suspension system :- The flexure system that suspends the proof mass above the substrate consists of thin flexible beams. Common suspension structures include crab-leg suspensions, serpentine suspensions, hair-pin suspensions, H-type suspensions and U-beam suspensions. The same beams experience deflections in both modes, resulting in undesired coupling between the drive and sense modes. A solution to this problem is to
Electrical design of MEMS gyroscope (Actuation and detection mechanisms): In many MEMS applications, capacitive detection and electrostatic actuation is mostly used because they provide good DC response, noise performance, high sensitivity, low drift and low temperature sensitivity. Electrostatic Actuation :- Actuation and sensing electrodes are modelled as a combination of moving parallel-plate capacitors. capacitance 0 =
electrostatic force =
Variable gap actuation :- Two plates of the parallel plate capacitor are movable in the normal direction. =
The electrostatic spring constant of parallel-plates is a negative spring constant, and always reduces the resonant frequency with increasing net DC bias across the electrodes. Variable area actuation :- Two plates of the parallel plate capacitor are movable in the lateral direction. =
Since the force is independent of the initial overlap length, a good practice in comb-drive design is to keep the overlap length minimum, while greater than the expected actuation peak amplitude.
desired the drive force can be linearized with respect to actuation voltages by
appropriate selection of voltages applied to opposite electrode sets. The net electrostatic force generated by two opposing capacitors 1 2 is =
A balanced actuation scheme is a common method to linearize the force with respect to a constant biased voltage and time varying voltage
= +
=
Comb drive actuator :- Since comb drive force in the x-direction is not a function of displacement in the x-direction its partial derivative with respect to x is zero which means that comb drive do not result in negative electrostatic spring constant.
Comb drive actuators make use of lateral electrostatic driving force to activate
the movable mass. Effect of normal force is eliminated by arranging stationary electrodes symmetrically on both sides of each movable comb finger. Lateral driving force from both side electrode which are same in direction and equal in magnitude will not cancel out but the normal driving forces which are equal in magnitude and opposite in direction cancel out each other. Movable fingers are activated in horizontal direction only.
For a comb drive structure with N fingers on each side, structural thickness t
and finger distance d =
For a parallel plate actuator structure with N plates on each side, thickness t, overlap length l and plate gap d =
Capacitive Sensing :- A change in gap distance d and overlap area S will cause a change in capacitance and by measuring this change we know the value of
becomes
=
+
They are used for detection of small displacement. Variable area capacitive sensing :- They are used when the deflections are larger than minimum gap or when variable gap capacitance become nonlinear. =
( )
where x is displacement
= =
( ( +
) )
Damping
Damping is the energy dissipation effect in an oscillatory system
Viscous damping :- is the viscous effects of the gas trapped between the proof mass surfaces and the stationary surfaces.
effects.
Proposed Design
Design constraints :- Resonant frequencies should lie in the range 3-10 kHz, as ambient noises and vibration lie in the range 1-3 kHz and sensitivity of
should be less than 3 m and gap between any two feature should not be less
than 3 m. Proposed design :- The design comb driving plate differential capacitance sensing vibratory gyroscope. The device can be fabricated through bulk micromachining process and DRIE (deep reactive ion etching) technique can be used for comb finger etching. The device is based on glass-silicon compound structure through silicon-glass anodic bonding technique.
Proposed structure: 1. Glass substrate 2. Anchors 3. Fixed driving fingers 4. Movable driving fingers 5. Folded driving beams 6. Folded sensing beams 7. Decoupling frame 8. Central movable mass 9. Bonding anchors
Features :-
The folded beam structures in driving portion and sensing portion increases
the amplitude driving and sensing vibration which helps in increasing the device sensitivity. Decoupling frame weakens the coupling between two bonds . Due to insulating substrate the parasitic capacitances are less which is helpful for signal detection.
Using single piece silicon crystal as structure helps to achieve high quality
factor for both driving and sensing modes, also there is no residual stresses. Variable area actuators are used for driving the structure and variable gap
Working principle :-
AC driving voltage with same magnitude but 1800 phase difference are applied to the left and right fixed driving fingers which introduces alternating electrostatic forces on the movable driving fingers along x-direction. The frame along with central mass will vibrate along x-direction in a push-pull
VALUES
10 m 5 m 5 m 400 m 4 m 3 m 3 m 900*60 m
DESIGN PARAMETERS
Driving beam length Sensing beam length Central mass length Comb finger length Total number of finger pairs Finger overlapping length Sense electrode length Frame vertical arms
VALUES
285 m 310 m 400 m 40 m 35 20 m 350 m 1000*30m
should be equal to for large sensing amplitude hence a DC biasing voltage is used to tune down in differential capacitance sensing to precisely match . This technique is called electrostatic tuning.
We apply a DC biasing voltage between top and bottom frequency tuning electrodes. =
( )
( ++)
(+)
if k the effective resonance frequency in sensing mode after electrostatic tuning can be expressed as =
+
= (
= =
2 3
Biasing voltage can be calculated by using above equation and using the values
= 8
( = 17.8 106 . )
= .
Damping ratios
= 3.96 103
= 126
The damping ratio for both the modes meet the requirement of light damping ( < 0.7).
Dynamic Analysis : Drive displacement :The main design criterion is that we want approximately 2.5 micron drive displacement. Using force equation for comb drive and design parameters = .
. .
For = 2.5
= for = (atmospheric conditions) = . for = 000 (vacuum conditions)
Sense displacement :Using design parameters frequency values and drive displacement for = / , = . = . for = (vacuum conditions) = . for = (atmospheric conditions)
Sensitivity Analysis : Displacement sensitivity :- The gyroscope displacement sensitivity is defined as sensing vibration amplitude of the central mass in response to unit angular velocity =
When = , =
(vacuum conditions)
Fabrication
MEMS process flows can be classified into two primary categories: bulk
micro-machining and surface micro-machining. Bulk micro machining means that three dimensional features are etched into the bulk of the crystalline and
gyroscope.
MEMS fabrication consists of following steps : Oxidation :- This process involves the deposition of Si2 layer on the top of a
Doping :- The two means of doping silicon are diffusion and ion-implantation.
Diffusion is a method of introducing impurities into the silicon wafer. The dopants used are boron (p-type) and phosphorus (n-type). The rate of diffusion is a function of temperature. Photolithography :- It is a method of transferring patterns to the surface of silicon wafers. Components involved are : Mask :- It is a stencil used to generate a desired pattern on photoresist coated wafers. It is a optically flat glass (transparent to near UV) or
sensitive to UV radiation.
When UV light falls on it their solubility gets altered. There are of two types negative and positive.
Types of photoresist
After the base pressure is achieved gases are introduced into the chamber. When the pressure is in the appropriate range RF power is applied to the anode due which electrons are emitted from the anode. The negatively charged particles collide with gas atoms and molecules creating free radicals and stripping of electrons creating ions. These electrons combine with ions and create photons to conserve energy. The substrate is placed on the cathode and heated to an appropriate temperature for etching. The direction of the species hitting the substrate surface is random. Hence ion flux changes as a function of depth. As a
result RIE is not suitable for high aspect ratio. The etching via RIE is isotropic and
rate is very fast. Deep Reactive-Ion Etching - ICP Reactor :- This type of system is used for Deep-RIE.
In an ICP Reactor the AC current in the coil creates a magnetic field. The charge particles are accelerated by the magnetic force. The DRIE process is an alternation of short time isotropic etches in S6 plasma and short time polymer deposition using 4 8 plasma. DRIE process is now called Bosch Process.
Principle of Bosch Process :- A single short time etching step is applied to the
patterned silicon substrate in 6 plasma and the exposed silicon is etched in an almost isotropic manner. The process switches to a polymerization step and a 4 8 polymer layer is deposited on the exposed silicon surface as well as on mask. The polymer layer on the bottom of the structure is rapidly removed by ion
bombardment and the etchant continues to react with the exposed silicon.
The combination of etching and polymerization results in good anisotropy. High etching rate, high selectivity, ultra large etching depth, high aspect ratio
can be achieved.
Wafer Bonding:- Silicon can be bonded to the glass by anodic bonding process.
Fabrication Flow
The MEMS gyroscope proposed is to be fabricated with the bulk micro
machining process. The fabrication flow is developed in IntelliFAB . The fabrication process is done in 4 steps:-
Mask Designing
The masks used in the process flow are designed for negative photoresists.
The fabrication step for this MEMS gyroscope are simple and only three photolithography masks are needed. The masks are designed in IntelliMask.
10
40,650 41,250 1.5 40
10
4,800 4,900 3 15
130
2 500
130
2.5 126
Advantage of proposed design over previous design : Previous design cannot be operated for drive displacement more than 2 m whereas the proposed design can be operated for large drive displacements. The previous design utilizes variable area sensing elements which is not suitable to measure small displacement change whereas the proposed design utilizes the variable gap sensing element which is more suitable for smaller displacement changes. The biasing voltage is low in the proposed design. Although the quality factor is greater in previous design the sense capacitance is same.
Thanks