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smart card attendance system

smart card attendance system

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Published by sunil
smart card attendance system based project
smart card attendance system based project

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Published by: sunil on May 25, 2009
Copyright:Attribution Non-commercial

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09/03/2013

 
 Smart card attendance systemBy sunil panjeta jagadhriHecPanjeta_5262@yahoo.co.in+919466669662
1
 
CHAPTER-1 INTRODUCTION
1.1SMART CARD ATTENDANCE SYSTEM
CHAPTER-2 LITERATURE REVIEW
2.1 EMBEDDED SYSTEMS2.2 INTRODUCTION TO MICROCONTROLLERS
2.2.1 FEATURES OF MICROCONTROLLER 2.2.2 TYPES OF MICRO CONTROLLERS2.2.3 BLOCK DIAGRAM2.2.4 PIN DIAGRAM2.2.5 CRYSTAL OSCILLATOR’S CONNECTION2.2.6 MEMORY ORGANISATION2.2.7 8051 REGISTERS2.2.8 SPECIAL PURPOSE REGISTERS2.2.9 APPLICATIONS OF MICROCONTROLLERS
2.3 LCD DISPLAY
2.3.1 LCD PIN DESCRIPTION2.3.2 INTERFACING OF MICRO CONTROLLER WITH LCD DISPLAY
2.4 DIODE2.5 CAPACITOR 
2.5.1 THEORY OF OPERATION2.5.2 CAPACITANCE2.5.3 ELECTROLYTIC CAPACITORS2.5.4 CERAMIC CAPACITOR 2.5.5 SILVER MICA CAPACITOR 2.5.6 TANTALUM CAPACITOR 
2.6 RESISTOR 
2.6.1 TYPES OF RESISTORS2.6.2 RESISTOR COLOR CODE2.6.3 CALCULATING RESISTOR VALUES
2.7 LED
2.7.1 LED TECHNOLOGY2.7.2 LIGHT EXTRACTION2.7.3 COLOR AND MATERIALS2.7.4 EFFICIENCY AND OPERATIONAL PARAMETERS2.7.5 CONSIDERATIONS IN USE2.7.6 TYPES OF LED’S2.7.7 ADVANTAGES OF USING LEDS2.7.8 DISADVANTAGES OF USING LEDS
2.8 RELAY
2
 
2.8.1 BASIC DESIGN & OPERATION2.8.2 SOLID STATE RELAY2.8.3 SOLID STATE CONTRACTOR RELAY2.8.4 APPLICATIONS
2.9 BUZZER 2.10 TRANSISTOR 
2.10.1 TYPES:
2.10.2 BIPOLAR JUNCTION TRANSISTOR 2.10.3 FIELD-EFFECT TRANSISTOR 2.11 VOLTAGE REGULATOR (78XX):
2.12 POWER SUPPLY:2.13 INTERFACING MATRIX KEYPAD TO 8051:
2.12 POWER SUPPLY
:
2.13 INTERFACING MATRIX KEYPAD TO 80512.14 TRANSFORMER 
2.14.1 BASIC PRINCIPLE2.14.2 IDEAL POWER EQUTION
2.15 OPTOCOUPLER 
KEY PARAMETERSHOW THEY’RE USED
2.16 MAX 232 
CHAPTER-3 PROJECT WORK 
3.1 INTRODUCTION
3.1.1 BLOCK DIAGRAM (SMART CARDACCESS SYSTEM)3.1.2 CIRCUIT DIAGRAM OF SMARTCARD ATTENDANCE SYSTEM3.1.3 PCB LAYOUT OF SMART CARDATTENDANCE SYSTEM
3.2 FABRICATION PROCESS
3.2.1 PCB LAYOUT3.2.2 DEVELOPING OF PCB (ETCHING)3.2.3 DRILLING3.2.4 SOLDERING3.2.5 DESOLDERING & RESOLDERING3.2.6 SOLDERING DEFECTS
CHAPTER-4 CONCLUSION & FUTURE SCOPE
3

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Ritesh Goel added this note
can u plz send me smart card attendance system based project report on riteshgoel1992@gmail.com
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