Professional Documents
Culture Documents
Abstract
Introduction
Steps of project making
Block diagram
Circuit diagram
Working
Frame format
Flow chart
Hardware section
Pcb manufacturing process and pcb layout
Components used
Components description
Microcontroller programming(ASM)
Software section
Introduction to visual basic
Mscomm control
Visual basic window
Software coding
Precautions
Applications
Softwares used
References
Datasheets of ICs
Abstract:-
Now-a-days every institution needs automation. As a part of
college automation, we have decided to do a project “Voice
Interactive System for College Automation”.
Working model
The whole system is design around two parts
DTMF. Decoder: -
Its function is to decode the up coming hardware tones from the telephone line in a
binary format. To decode this tone we use a DTMF. Tone decoder which
is 8870. This is inbuilt IC for decoding the tones.
Microcontroller:-
this is a medium between decoder and a pc to communicate. In this software first
we when the ring is coming from the circuit is given by comparator
pulses .its asm software count the ring when the ring is greater than 4 its
energized the relay to pick up the phone. When phone is pick up It gives
command to the pc which is shown in frame the communication is
established. if user input the no then microcontroller continues scan the
dtmf ic if it found any code the transfer to the pc.
Led indication is used to see the dtmf outputs and the ring signal.
Comparator:- comparator is used to detect the ring signal . when the ring is
coming comparator circuit gives output is high otherwise low which is pick
from dtmf ic.
Max232:-
This is providing in the system is to convert the level of 0 to 5 to -12 to +12v. But
practically its work in between (-8.5 to +8.5).
a. Full wave rectifier: - The full wave Bridge rectifier is used to convert 12 ac
to the pulsating dc which is equal to average value.
Filter is a used to convert pulsating dc to constant dc. It may me capacitor, RC
network, a. 12 v step down transformer (500m amp)
b. Full wave rectifier.
c. Filter.
d. linear regulator.
b. 12 v step down transformer(500m amp):- Step down transformer is used
to convert 230v ac to 12v ac. With current rating of 500 mump.
inductance. depends upon the current following in the circuit or impedance of
circuit. But in this system we use capacitor.
d.Linear regulator:- regulator are used the system is used to convert high
voltage to +5v constant dc.
Second is software section:- In this section software is build around the visual
basic. When it received command from the system its gives the response
in a voice for from the sound port which is fed to the speaker of phone. if
no any command received in 25 second it sends a command to
disconnect the phone.
Steps of project making
The following steps have been followed in carrying out the
project
BLOCK DIAGRAM:-
CIRCUIT DIAGRAM
WORKING:-
When the incoming call comes, the First pin of DTMF8870 senses the
incoming call, voltage of second no. pin of 8870 will change from 2.5V to
1V.
The comparator senses the change in voltage of second no. pin and its
output goes up, this out put is connected to the microcontroller which
senses this change in comparator state and gives an instruction to relay to
switch on the telephone hook switch.
Now caller is asked to press the specific keys as per the menu options.
Now user dials student pin no.which is sensed by DTMF 8870 and
converted into equivalent binary no. now these binary values sensed by
MAX 232 through microcontroller and converted to RS232 format which is
compatible with our pc. Now pc is able to understand these logics via
RS232 connectorAs per the key pressed the software decides what action
should be taken. And the corresponding student details will be
delivered.As for example when the incoming calls comes the ring is
detected by the hardware circuit and a welcome message “WELCOME TO
ORIENTAL INSTITUTE OF SCIENCE & TECHNOLOGY” is played.
Then it asks to enter the single digit roll no., after dialing the roll no. again
a message “PRESS 1 FOR ATTENDANCE DETAILS, PRESS 2 FOR
MARKS DETAILS, PRESS 3 FOR ACCOUNTS DETAILS AND PRESS 9
FOR EXIT” is played.
As per the key pressed corresponding data is fetched from the database
and the message is played.
FRAME FORMAT:-
FLOW CHART:-
Lay out of the desired circuit is the most important in any circuit board
manufacturing process. The following points are to be observed while performing
the layout of the PCB
PREPARATION OF SCREEN:
Nylon bolting cloth (Silk screen cloth) is stretched and attached to a wooden
frame. Photosensitive chemical (silcot-6) and ammonium bicarbonate is spread
on cloth and dried in total darkness. The screen is exposed to UV light and is
developed in water.
PRINTING:
The screen is placed on suitable copper laminated sheet on copper side and
circuit black printing ink (acid resistant paint) is spread on it. After printing the
PCB should be allowed to dry for at least 10 hrs. in a dust proof chamber.
ETCHING:
The removal of excess copper on the copper laminated PCB apart from the
printed circuit is known as etching. Generally PCB is placed in F3C13 solution
and kept for one hour.
DRILLING:
Under this operation drilling should be done as per circuit lay with the suitable
drill and high speed machine. Drilling should always be done from copper side to
avoid possibility of coming out of copper circuit and chipping out of Bakelite.
GREEN MAKING:
It is done with special epoxy paint and special thinner is requited for cleaning the
screen. It provides as better and also prevents frequency overlapping between
the tacks at high frequency operation.
THINNING:
COMPONENT MOUNTING:
All components are mounted at their respective position as per the components
layout. Proper precautions should be taken during mounting process.
ETCHING PROCESS:
Etching process requires the use of chemicals acid resistant dishes and running
water supply Ferric chloride is maximum used solution but other enchants such
as ammonium per sulfate can be used. Nitric acid can be used but in general it is
not used due to poisonous fumes. The pattern prepared is glued to the copper
surface of the board using a latex type of adhesive that can be cubed after use.
The pattern is laid firmly on the copper use a very sharp knife to cut round the
pattern carefully a remove the paper corresponding to the required copper
pattern areas. Then apply the resist solutions, which can be kind of ink proportion
fort the purpose maintaining smoothing clean outlines as far as possible. While
the board is drying test all the components.
Before going to next stage, check the whole gotten and cross cheek against the
circuit diagram check for any freeing matte on the copper. The etching bath
should be in a galls or enamels disc. If using crystal of ferric-chloride these
should be thoroughly dissolved in water to the proportional suggested. There
should be 0.5 Lt. Of water for 125 Gm. of crystal.
Water liquid should be thoroughly deflated and druid in water land; never pour
down the drain. To prevent particles of copper hindering further etching, agitate
the solutions carefully be gently twisting or rocking the tray.
The board should not be left in the bath a moment longer than is needed to
remove just the right amount of copper. In spite of there being a resist coating
there is no protection against etching away through exposed copper edges; this
leads to over etching. Have running water ready so that etched board can be
removed properly and rinsed; this will hall etching immediately.
Drilling is one of those operations that call for great care because most of the
holes will be made a very small drill. For most purposes a 1 mm drill is used Drill
all holes with this size first those that need to be larger can be easily drilled again
with the appropriate lager size.
COMPONENT ASSEMBLES:
From the greatest variety of electronic components available today, which runs
into tent of thousands of different types it is often a perplexing task to know which
the right task for a given job is. There should be damage such as hair line crack
intuit opera on PCB that could age a seriousfiec on the operational ability to the
completed assemble. If there are than they can and should be repaired fiesta bye
soldering a short link of bare copper wire over the affected part.
The most popular method of holding all the items is to been the wires future apart
after they even been indebted in the appropriate holes. This will hold the
component in position ready for soldering.
Some components will be considerably larger than other occupying and possible
partially obscuring neighboring components. Because of this best to start by
mounting the smallest first and progressing through to the largest. Before starting
make certain that no further drilling I likely to be necessary because access may
be impossible later.
Next will probably be the resistor small signal diodes of other similar size
components some capacitor are very small but it would be best to fit these after
words when fitting each group of components marks of each one on the
components its as it is fitted and if we have to leave the job we know where to
recommence. Although transistor & integrated circuit are small items there are
good reasons for leaving the soldering of these until the last step the main pint is
that these components are sensitive to heart and is subjected to prolonged
application to the soldering iron they could be internally damaged.
All the components before mounting are rubbed with sandpaper so that oxide
layer is removed from their tips. Now they are mounted according to the
components layout.
SOLDERING TECHNIQUES:
Soldering iron
Soldering wire
Soldering procedure
Replacing components
Soldering Iron :
Soldering iron is an essential tool for soldering. A. Soldering iron should give
sufficient heat a melt solder by heat transfer when the iron tip is applied to a
connection to be soldered.The selection of the soldering iron can be made as
regard to its tips size shape and wattage. Soldering iron temperature is selected
and controlled according to the work to be performed. Generally two types of
soldering irons are available: Soldering Pencil and Soldering Gun.
Soldering Pencils :
These are light weight soldering iron which can generate around 12 watts to 50
watts of heat. Modular soldering
Soldering Materials :
Most commonly used solder wire consists of 60% of Tin 40% Lead. This is in the
from of a hollow wire whose center is filled with an organic paste like material
called rosin. Its melting temperature is 190 degree centigrade.
FLUX :
Flux is a material used to aid soldering process. Flux is needed to scratch away
the small film of oxide on the surface of metals to be soldered. This flux forms a
protective film that prevents reoxiadation while the connection is heated to the
point at which the solder melts. Flux is very helpful on old dusty, eroded joint.
SOLDERING PROCEDURE
CMOS Devices are sensitive to static charges. So care has to be taken while
handling this device. Static charge is generated by rubbing cloth with human
body or by any other friction of human body. Before string or handling CMOS
Devices touching the ground or metallic chassis of the equipment. One can wear
a metallic band in hand which is connected to ground. The working table should
be either of wood or should have rubber sheet. The soldering iron tip should be
static charge free.
DESOLDERING TECHNIQUES
Disordering wick is made of fine copper wire mesh. When this is applied to the
heated components, the molten solder gets attached to the wire mesh by
capillary action. Disordering pump has a suction pump. The nozzle of the
disordering pump is kept to the heated component. The molten solder is sucked
by a spring action. Insertion in the PCB, the lead should be properly cleaned.
After component has been inserted it can be soldered. The oxide on the PCB can
be removed by using flux, sandpaper. The tip of the soldering iron should be
clean and should have proper shape. The shape of the tip normally gets bad over
a period of time. The shape can be made proper by filling. During soldering
excessive heat is generated at the soldering iron tip. If the soldering iron tip is in
contact with component for a longer time then there is possibility of damaged or
may loose its characteristics. Place iron tip at 45 degree to the PCB and
component joint. Place the solder near the iron and let it flow. Smoothen the area
of joint by the soldering iron tip. By doing this, the molten solder alloy flows into
the PCB hole. Soldering should be done when the equipment is off.
REPLACEMENT OF COMPONENT
DIODES :-
COMPONENTS
Number Quantity
IC’s
Pic16f876a 1
LM7805 1
MT8870 1
MAX232 1
Transistor
BC547B 2
Light Emitting Diodes (LED’s)
Red 7
Diodes
1N4007 6
Crystal
16MHz 2
Capacitors
1000mF/25V 4
100mF/25V 3
Resistors
Preset 10k 1
10k 4
4.7k(Resistor network) 4
1k 4
Transformers
0-12v 500mA 1
PCB
4” X 6” 1
Display
LCD(16*2) 1
Relay
Relay(12) 2
Miscellaneous
IC Base (40pin) 28
Ferric Chloride 100gms.
Soldering Wire 20gms.
Soldering Paste 10gms.
Connecting wires 2metres
Main cable
COMPONENT DESCRIPTION
Description
8-Bit
Microcontroller IC
Controller
Family/Series:PIC16F
Memory Size,
Flash:14336Byte
Memory Size,
EEPROM:256Byte
No. of I/O Pins:22
No. of PWM
Channels:5
Clock Speed:20MHz
Interface:I2C, SPI, USART
Package/Case:28-SOIC RoHS Compliant: Yes
features:
Output current in excess of 1A
The "Visual" part refers to the method used to create the graphical
user interface (GUI). Rather than writing numerous lines of code to
describe the appearance and location of interface elements, you simply
add prebuilt objects into place on screen. If you've ever used a drawing
program such as Paint, you already have most of the skills necessary to
create an effective user interface.
Whether your goal is to create a small utility for yourself or your work
group, a large enterprise-wide system, or even distributed applications
spanning the globe via the Internet, Visual Basic has the tools you need.
Every computer comes with one or more serial ports. They are named
successively: COM1, COM2, and so on. On a standard PC, the mouse is
usually connected to the COM1 port. A modem may be connected to
COM2, a scanner to COM3, etc. Serial ports provide a channel for the
transmission of data from these external serial devices.
MSComm Control:-
The MSComm control provides serial communications for our application
by allowing the transmission and reception of data through a serial port.
The MSComm control provides the following two ways for handling
communications:
Properties Description
Although the MSComm control has many important properties, there are a
few that we should be familiar with first.
precautions
1) Frist check all component as per the circuit.
2) Check transistor.
Applications:-
Softwares used:-
Microsoft visual basic 6.0
Express PCB for PCB designing
Assembler for PIC16F876A microcontroller
Program downloader
References:-
Books:
Electronic projects.
Microelectronic circuits.
WEBSITES:
1) www.efyindia.com
2) www.nationalsemiconductor .com
3) www.electroprojectindia.com
4) www.alldatasheet.com
5) www.howstuffworks.com
6) www.datasheet.com
7) www.programmer’sheaven.com