Device Control Using GSM Mobile Phone Project Electronics

Department of Electronics & Communication.
Year -2011
Table of Content
1. Project Introduction 2. Literature Review 3. Project Plan 3.1 Problem Statement 3.2 Operating Environment 3.3 Intended Users & Uses 3.4 Assumptions 4. Proposed Approach 4.1 Functional Requirements 4.2 Constraint Considerations 4.3 Technology Considerations 4.4 Technical Approach 5. Testing Requirements 5.1 GSM Receiver 5.2 GSM to Microcontroller 5.3 Decoding of Remote Users commands 5.4 I/O Commands Voltage 5.5 I/O Command Storage 5.6 Circuits Power Surge Protection 5.7 End Product Functionalities 6. System Block diagram 7. Circuit Diagram 7.1 Circuit Diagram 7.2 Power Supply Section 7.3 Relays 8. PCB Layout 9. Microcontroller Programming 10. Component List
GLOBUS ENGINEERING COLLEGE, BHOPAL
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11. Component Description 11.1 Resistors -------------------------------------------18 11.2 Capacitors -------------------------------------------19 11.3 LED -------------------------------------------19 11.4 Transistors -------------------------------------------20 11.5 Transformer -------------------------------------------21 11.6 Diodes -------------------------------------------22 11.7 Relay -------------------------------------------22 11.8 Microcontroller ATtiny2313 11.8.1 Features -------------------------------------------23 11.8.2 Pin Out -------------------------------------------24 11.8.3 Block Diagram -------------------------------------------25 11.9 DTMF Decoder MT8870 11.9.1 Description & Features -------------------------------------------26 11.9.2 Pin Out Description -------------------------------------------27 11.10 ULN 2003 IC -------------------------------------------28 11.11 Voltage Regulator IC MC7812 & LM7805 -------------------------------------------29 11.12 Diode IN4007 -------------------------------------------30 12. PCB Manufacturing Process -------------------------------------------31 13. Design Specification 13.1 PCB Designing -------------------------------------------33 13.2 LAYOUT Design -------------------------------------------34 13.3 Etching Process -------------------------------------------35 13.4 Component Assembly -------------------------------------------36 13.5 Soldering -------------------------------------------38 14. Working -------------------------------------------39 15. Application -------------------------------------------40 16. Chronology --------------------------------------------41 17. Bibliography --------------------------------------------42
Year -2011
1.
PROJECT INTRODUCTION
Our project Device Control Using GSM Mobile Phone is a setup or system in which we can easily ON/OFF the appliances using in home. The appliances are connected through a circuit which is connected to a GSM mobile phone via a DTMF Tone Decoder IC. It often happens that we forget to switch off some electric devices while leaving home for a journey. This will result in wastage of energy and even the device may get damaged due to overheating. Even if we remember that we have not switched off some devices, it may be difficult for us to come back and switch them off. Also, if we are away from home we may have to turn on the lights at night. These are normally not possible in present condition. Our project offers a novel solution for this problem by using a GSM mobile phone, a common electronic gadget. This device is build around PSoC, a powerful system-on-chip. This uses DTMF (Dual Tone Multi Frequency) signals from mobile phone keypad to attain its functionality. For decoding the DTMF tones, we are using MT8870, CMOS Integrated DTMF Receiver. FEATURES The main features of our device control system are:Easy control of devices through mobile phone Can control (on/off) a maximum of 8 devices (by using decoder we can increase this number to 256)
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2.
Literature Review
Smart home is one of the recent fields in the context of computer science. The paper named as Remote mobile control of home appliances by F. Meija, M. Nikolova and P. Voorwinden depicts on the home controlling using WAP protocol. The architecture mentioned by them is much complex but it gives an initial idea about the remote home appliance controlling. Smart home studies sometimes affected by the concern about the possible harms to the humans health. A great research was done by Toril Laberg, Directorate for Health and Social Affairs of the Delta Centre, Norway. He later publish in his paper named Smart Home Technology: Technology supporting independent living - does it have an impact on health? that there is no harm on humans health by the technical setup required to support smart home technologies. Scott Davidoff, Min Kyung Lee, Charles Yiu, John Zimmerman, and Anind K. Dey in their journal named Principles of Smart Home Control describe the control that families want and suggest seven design principles that will help end-user programming systems deliver that control. Tatsuya Yamazaki in his journal The Ubiquitous Home suggests that automation should not become a goal of the smart home technologies. In this paper he represents a real-life test bed, called the Ubiquitous Home. In the Ubiquitous Home, a robot plays a role of interface for the residents. Three kinds of context-aware services have been implemented and a real-life living experiment was conducted. The experimental results were also reported.
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Recently some projects are organized for building the architecture of controlling home appliance using voice commands. VoiceXML is used for that purpose. A smart house system named NETVOX [18] based on the ZigBee standard is introduced recently. The system can use for home automation and industrial controls. It provides security, temperature, humidity, lighting, sensor, and multimedia control for comfort, convenience, and safety wirelessly. The system may be accessed and controlled over the telephone or over the Internet.
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3.
Project Plan
This section will state the basic problem, and the basic characteristics of the project, such as operating environment, users, etc. 3.1 Problem Statement The objective of this project is to develop a device that allows for a user to remotely control multiple home appliances using a cellular phone. This system will be a powerful and flexible tool that will offer this service at any time, and from anywhere with the constraints of the technologies being applied. Possible target appliances include (but are not limited to) climate control systems, security systems, and lights; anything with an electrical interface. The proposed approach for designing this system is to implement a microcontroller-based control module that receives its instructions and commands from a cellular phone over the GSM network. The microcontroller then will carry out the issued commands. 3.2 Operating Environment The control system will include two separate units: the cellular phone, and the receiving control unit. There will therefore be two operating environments. The cellular phone will operate indoors and outdoors whereas the receiving control unit will operate indoors within the temperature and humidity limits for proper operation of the hardware.
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3.3 Intended Users and Uses This product is aimed toward average consumers who wish to control household appliances remotely from their cell phones provided that the appliances are electrically controllable. Example of feasible appliances and applications under consideration include; enable/disable security systems, fans, lights, kitchen appliances, and a heating/ventilation/air conditioning system. 3.4 Assumptions The following is a list of assumptions for the project:1. The user and receiver control unit will establish communication via GSM. 2. The cell phone and service provider chosen will support calling service. 3. The user is familiar with the call process & IVRS on cell phone. 4. All service charges from service provider apply. 5. The controlled appliances will have to have an electrical interface in order to be controlled by microcontroller.
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4.
Proposed approach
This section outlines the criteria that will be considered in the development of the control system. 4.1 Functional Requirements The following is a list of functional requirements of the control unit/module. The Cellular Unit will have the ability to connect to the cellular network automatically. The Cellular Unit will be able to receive call and will be able to send DTMF tone to the DTMF Decoder IC. The DTMF Decoder IC will decode the (pressed no. by users cell phone & received on Cellular Unit) DTMF tone into the 4bit BCD output signal. The microcontroller connected to the DTMF decoder IC will receive the BCD output. The logic programmed in microcontroller drive the signal to the O/P ports of microcontroller as per the BCD O/P. Microcontroller will issue its command to the electrical appliances through a simple control circuit.
4.2 Constraint Considerations The following is a list of constraint considerations:The controlled appliances will need an electrical control interface. This simple system is only capable of controlling electrical devices. The control module will need to be shielded against electrostatic discharges. This will increase reliability of the system.
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4.3 Technology Considerations The considerations for this system will include a choice of networks, communication protocols, and interfaces. 1) Cellular Networks: The widely available networks are based on GSM. This network provides a wide area of coverage and can be utilized more cost-effectively for this project. 2) Communication protocols: The available communication protocols are DTMF, GPRS and SMS. The DTMF is the most efficient because this project requires a cellular communication and only by pressing keys we can control appliances. 3) I/O interfaces between microcontroller and devices: Serial or parallel I/O will be considered as options for connection between the GSM receiver and the microcontroller. Using the microcontroller, a control circuit will be implemented to control the electrical appliances. 4.4 Technical Approach Assuming that the control unit is powered and operating properly, the process of controlling a home device will proceed through the following steps:The remote user makes a call to the GSM cellular unit and commands to the receiver. GSM receiver receives call automatically from user cell phone by auto answering mode. After receiving call by GSM cellular unit user press the keys on his cell phone. GSM receiver receives the appropriate DTMF tone. The DTMF decoder IC connected to GSM receiver detects the pressed DTMF tone & converts it to the 4 bit BCD O/P. DTMF decoder IC sends the BCD O/P to the microcontroller. Microcontroller issues commands to the appliances via relays connected to its O/P ports.
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5.
Testing Requirements
The following testing requirements will be indicators that the system can successfully be implemented. 1) The GSM receiver will be tested for successful communication with network. This will test include automation and consistency of the connection and will be conducted by team members in the following way: The cellular phone will dial the GSM receivers number. Once the connection is established a stream of data will be send to the GSM receiver. The GSM receiver will be given data to be transmitted to the cellular phone. Success/Failure criteria: The data received will be observed on both ends to verify its consistency. The test will be considered successful if the integrity of the sent and received data is maintained upstream. It will be considered a failure otherwise. 2) The GSM to microcontroller driver will be tested by verifying the integrity of command strings sent from the remote user. The following procedure will be performed by team members for this phase: The remote user will send a command to the control module. The contents of the data stream will be observed at the GSM communication port. These contents will be compared with those received and stored at the microcontrollers corresponding communication port. Success/Failure criteria: The test will be considered successful if the integrity of the data sent upstream is maintained. It will be considered a failure otherwise.
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3) Proper decoding of the remote users commands and issuance of the equivalent commands to the controlled device will be performed by team members using the following procedure: A simulated instruction will be fed to the microcontroller communication port. The output command at the I/O interface with the corresponding controlled device will be observed. Success/Failure criteria: The test will be considered a success if the resulting command issued from the microcontroller is sent to the right I/O address for the desired controlled device and if that command is consistent with the command which is expected. The test will be considered a failure otherwise. 4) The I/O commands voltage will be tested to meet the levels required to actuate the individual devices. The following procedure will be performed by team members: A simulated command from the microcontroller will be written to its I/O port. The output voltage at the desired devices control interface will be measured to verify its strength. Success/Failure criteria: The test will be considered successful if the simulated command from the microcontroller causes the proper voltage to be observed at the desired devices control interface. 5) The ability of I/O to detect an input voltage and store a value in the microcontrollers memory will be tested by team members: Test voltages to the input of the I/O will be applied. The contents of the memory shall be checked for validity. Success/Failure criteria: The testing will be considered successful if the values of the memory are as expected. The test will be considered a failure otherwise.
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6) The circuits power surge protection will be tested for acceptable performance by EE team members using the following procedure: The circuits power supply will be removed from the circuit and connected to a dummy load. A simulated voltage spike will be inputted by using a step signal from a signal generator. The output voltage and current will be measured at the load. Success/Failure criteria: The success of the test will be determined by verifying that the output signal to the dummy load falls with the tolerance indicated by the microcontroller and the GSM chips manufacturers. The test will be considered a failure if the measured characteristics of the power supplys output do not meet the manufacturers requirements. 7) The end-product functionalities will be tested by team members and non-team members in the following way: Team members will ensure that all subsystems function properly together from remote user command to execution and back to completion status notification. Non-team members from the general public will be allowed to access and use the control unit for a frame of time. Afterward, the non-team member testing subjects will fill out a survey on the end-products functionalities, ease of use, difficulties, etc. Success/Failure criteria: The testing will be considered a success if the testing subjects find the end-product user friendly, and easy to figure out.
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6.
System Block Diagram
The block diagram of the system is given below:
Receiving Cell Phone Unit
RELAY1
DEVICE1
ATtiny2313 Microcontroller
RELAY2
DEVICE 2
RELAY3 DTMF Decoder MT8870
DEVICE3
RELAY4
DEVICE4
RELAY5
DEVICE5
RELAY6
DEVICE6
RELAY7
DEVICE7
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7.
CIRCUIT DIAGRAM
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POWER SUPPLY SECTION
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RELAYS
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8.
PCB LAYOUT
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9.
Microcontroller Programming
ATtiny2313 is programmed by the BASECOM-AVR IDE [1.11.9.5]. We have used this Integrated Development Environment Software for program the 4 bit input coming into microcontroller to drive the appropriate relays.
LOGIC
The basic logic used that configure the IC MT8870 through making the port D as input. The 4 bit BCD input taken from PinD0, PinD1, PinD3, PinD4. The O/P port is PORTB to drive the relays are port pins PORTB 1 PORTB 7. As depending on input signals we used the IF ELSE conditions to drive the relays 1-7, when signal input is 1. Whereas there is no signal input means no BCD input to microcontroller.
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10.
COMPONENT LIST
Quantity 1 1 1 1 1 1 1 7 4 1 1 1 6 2 1 1 8 1 9 1 1 2 1 1 50 gram 1 50 gram 1 1 5 1 Price(Amount) `1000 `190 `150 `38 `35 `20 `18 `126 `8 `25 `20 `15 `30 `4 `15 `15 `16 `2 `4.50 `0.50 `0.50 `1 `25 `30 `75 `40 `35 `100 `120 `30 `35 `2223.50
Component Name GSM Mobile Phone Transformer [0-15V, 750mA] Microcontroller IC ATtiny2313 DTMF Decoder IC Driver IC ULN2003 Regulating IC MC7812 Regulating IC LM7805 Relays [SPDT, 12V] Diode IN4007 Capacitor [1000F, 25V] Capacitor [100F, 25V] Capacitor [10F, 25V] Capacitor [0.1F, 50V] Capacitor [22pF] Crystal Oscillator 11.0592 MHz Crystal Oscillator 3.57MHz Red LED Green LED Resistance 1k Resistance 560 Resistance 330k Resistance 100k Wire main cord Connecting Wires bundle Solder Wire CCB -18 [6x6] FeCl3 Soldering Iron Hand Drill 0.8 mm bit 1mm bit Total
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11.
11.1 RESISTORS: -
COMPONENT DESCRIPTION
A Resistor is a heat-dissipating element and in the electronic circuits it is mostly used for either controlling the current in the circuit or developing a voltage drop across it, which could be utilized for many applications. There are various types of resistors, which can be classified according to a number of factors depending upon: (I) (II) Material used for fabrication Wattage and physical size
(III) Intended application (IV) Ambient temperature rating (V) Cost
Basically the resistor can be split in to the following four parts from the construction viewpoint. (1) Base (2) Resistance element (3) Terminals (4) Protective means. Resistors may be classified as (1)Fixed (2)Semi variable (3)Variable resistor. (4)In our project carbon resistors are being used.
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11.2 CAPACITORS The fundamental relation for the capacitance between two flat plates separated by a dielectric material is given by:C=0.08854KA/D Where: C= capacitance in pf. K= dielectric constant A=Area per plate in square cm. D=Distance between two plates in cm Design of capacitor depends on the proper dielectric material with particular type of application. The dielectric material used for capacitors may be grouped in various classes like Mica, Glass, air, ceramic, paper, Aluminum, electrolyte etc. The value of capacitance never remains constant. It changes with temperature, frequency and aging. 11.3 LED (Light Emitting Diodes)
As its name implies it is a diode, which emits light when forward biased. Charge carrier recombination takes place when electrons from the N-side cross the junction and recombine with the holes on the P side. Electrons are in the higher conduction band on the N side whereas holes are in the lower valence band on the P side. During recombination, some of the energy is given up in the form of heat and light. In the case of semiconductor materials like Gallium arsenide (GaAs), Gallium phoshide (Gap) and Gallium arsenide phoshide (GaAsP) a greater percentage of energy is released during recombination and is given out in the form of light. LED emits no light when junction is reverse biased.
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11.4 TRANSISTOR: A transistor consists of two junctions formed by sandwiching either ptype or n-type semiconductor between a pair of opposite types. Accordingly, there are two types of transistors namely: (1) n-p-n transistor (2) p-n-p transistor
(NPN)
(PNP)
An n-p-n transistor is composed of two n-type semiconductors separated by a thin section of p type. However a p-n-p transistor is formed by two p sections separated by a thin section of n-type. In each type of transistor the following points may be noted.
1.
There are two p-n junctions; therefore a transistor may be regarded as combination of two diodes connected back to back.
2. 3.
There are three terminals taken from each type of semiconductor. The middle section is a very thin layer, which is the most important factor in the functioning of a transistor.
Transistor can be used as an Amplifier also. A transistor raises the strength of a weak signal and thus acts as an amplifier. The weak signal is applied between emitter base junction and output is taken across the load RC connected in the collector circuit (in common emitter configuration).
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11.5 TRANSFORMER
Definition: - The transformer is a static electro-magnetic device that transforms one alternating voltage (current) into another voltage (current). However, power remains the same during the transformation. Transformers play a major role in the transmission and distribution of ac power. Principle: - Transformer works on the principle of mutual induction. A transformer consists of laminated magnetic core forming the magnetic frame. Primary and secondary coils are wound upon the two cores of the magnetic frame, linked by the common magnetic flux. When an alternating voltage is applied across the primary coil, a current flows in the primary coil producing magnetic flux in the transformer core. This flux induces voltage in secondary coil. Transformers are classified as: (a) Based on position of the windings with respect to core i.e. (1) (2) (b) Core type transformer Shell type transformer
Transformation ratio: (1) (2) Step up transformer Step down transformer
(a)
Core & shell types: Transformer is simplest electrical machine, which consists of windings on the laminated magnetic core. There are two possibilities of putting up the windings on the core.
(1) (2) (b)
Winding encircle the core in the case of core type transformer Cores encircle the windings on shell type transformer. Step up and Step down: In this Voltage transformation takes place according to whether the Primary is high voltage coil or a low voltage coil.
(1) (2)
Lower to higher-> Step up Higher to lower-> Step down

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11.6 DIODES +
It is a two terminal device consisting of a P-N junction formed either of Ge or Si crystal. The P and N type regions are referred to as anode and cathode respectively. Commercially available diodes usually have some means to indicate which lead is P and which lead is N.
11.7 RELAY
In this circuit a 12V magnetic relay is used. In magnetic relay, insulated copper wire coil is used to magnetize and attract the plunger .The plunger is normally connected to N/C terminal. A spring is connected to attract the plunger upper side. When output is received by relay, the plunger is attracted and the bulb glows.
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Features
Utilizes the AVR RISC Architecture AVR - High-performance and Low-power RISC Architecture
- 120 Powerful Instructions - Most Single Clock Cycle Execution - 32 x 8 General Purpose Working Registers - Fully Static Operation - Up to 20 MIPS Throughput at 20 MHz Data and Non-volatile Program and Data Memories - 2K Bytes of In-System Self Programmable Flash Endurance 10,000 Write/Erase Cycles - 128 Bytes In-System Programmable EEPROM Endurance: 100,000 Write/Erase Cycles - 128 Bytes Internal SRAM - Programming Lock for Flash Program and EEPROM Data Security Peripheral Features - One 8-bit Timer/Counter with Separate Prescaler and Compare Mode - One 16-bit Timer/Counter with Separate Prescaler, Compare and Capture Modes - Four PWM Channels - On-chip Analog Comparator - Programmable Watchdog Timer with On-chip Oscillator - USI - Universal Serial Interface - Full Duplex USART Special Microcontroller Features - debugWIRE On-chip Debugging - In-System Programmable via SPI Port - External and Internal Interrupt Sources - Low-power Idle, Power-down, and Standby Modes - Enhanced Power-on Reset Circuit - Programmable Brown-out Detection Circuit - Internal Calibrated Oscillator I/O and Packages - 18 Programmable I/O Lines - 20-pin PDIP, 20-pin SOIC, 20-pad QFN/MLF Operating Voltages - 1.8 - 5.5V (ATtiny2313V) - 2.7 - 5.5V (ATtiny2313) Speed Grades - ATtiny2313V: 0 - 4 MHz @ 1.8 - 5.5V, 0 - 10 MHz @ 2.7 - 5.5V - ATtiny2313: 0 - 10 MHz @ 2.7 - 5.5V, 0 - 20 MHz @ 4.5 - 5.5V Typical Power Consumption - Active Mode 1 MHz, 1.8V: 230 A 32 kHz, 1.8V: 20 A (including oscillator) - Power-down Mode < 0.1 A at 1.8V
8-bit Microcontroller with 2K Bytes In-System Programmable Flash ATtiny2313/V Preliminary
Rev. 2543I-AVR-04/06
Pin Configurations
Figure 1. Pinout ATtiny2313
PDIP/SOIC
(RESET/dW) PA2 (RXD) PD0 (TXD) PD1 (XTAL2) PA1 (XTAL1) PA0 (CKOUT/XCK/INT0) PD2 (INT1) PD3 (T0) PD4 (OC0B/T1) PD5 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC PB7 (UCSK/SCL/PCINT7) PB6 (MISO/DO/PCINT6) PB5 (MOSI/DI/SDA/PCINT5) PB4 (OC1B/PCINT4) PB3 (OC1A/PCINT3) PB2 (OC0A/PCINT2) PB1 (AIN1/PCINT1) PB0 (AIN0/PCINT0) PD6 (ICP)
MLF
(TXD) PD1 XTAL2) PA1 (XTAL1) PA0 (CKOUT/XCK/INT0) PD2 (INT1) PD3
1 2 3 4 5
15 14 13 12 11
PB5 (MOSI/DI/SDA/PCINT5) PB4 (OC1B/PCINT4) PB3 (OC1A/PCINT3) PB2 (OC0A/PCINT2) PB1 (AIN1/PCINT1)
NOTE: Bottom pad should be soldered to ground.
Overview
The ATtiny2313 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny2313 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
ATtiny2313/V
2543I-AVR-04/06
ATtiny2313/V
Block Diagram
Figure 2. Block Diagram
XTAL1 PA0 - PA2
XTAL2
PORTA DRIVERS
VCC
DATA REGISTER PORTA
DATA DIR. REG. PORTA
INTERNAL CALIBRATED OSCILLATOR
8-BIT DATA BUS GND PROGRAM COUNTER STACK POINTER
INTERNAL OSCILLATOR
OSCILLATOR
WATCHDOG TIMER MCU CONTROL REGISTER MCU STATUS REGISTER
TIMING AND CONTROL
RESET
PROGRAM FLASH
SRAM
ON-CHIP DEBUGGER
INSTRUCTION REGISTER
GENERAL PURPOSE REGISTER
TIMER/ COUNTERS INTERRUPT UNIT
INSTRUCTION DECODER
EEPROM CONTROL LINES ALU USI STATUS REGISTER
PROGRAMMING LOGIC
SPI
USART
DATA REGISTER PORTB
DATA DIR. REG. PORTB
DATA REGISTER PORTD
DATA DIR. REG. PORTD
PORTB DRIVERS
PORTD DRIVERS
PB0 - PB7
PD0 - PD6
3
2543I-AVR-04/06
ISO -CMOS
MT8870D/MT8870D-1
Integrated DTMF Receiver
Features
Complete DTMF Receiver Low power consumption Internal gain setting amplifier Adjustable guard time Central office quality Power-down mode Inhibit mode Backward compatible with MT8870C/MT8870C-1
ISSUE 3
May1995
Ordering Information MT8870DE/DE-1 18 Pin Plastic DIP MT8870DC/DC-1 18 Pin Ceramic DIP MT8870DS/DS-1 18 Pin SOIC MT8870DN/DN-1 20 Pin SSOP MT8870DT/DT-1 20 Pin TSSOP -40 C to +85 C
Description
The MT8870D/MT8870D-1 is a complete DTMF receiver integrating both the bandsplit filter and digital decoder functions. The filter section uses switched capacitor techniques for high and low group filters; the decoder uses digital counting techniques to detect and decode all 16 DTMF tonepairs into a 4-bit code. External component count is minimized by on chip provision of a differential input amplifier, clock oscillator and latched three-state bus interface.
Applications
Receiver system for British Telecom (BT) or CEPT Spec (MT8870D-1) Paging systems Repeater systems/mobile radio Credit card systems Remote control Personal computers Telephone answering machine
VDD VSS VRef
INH
PWDN
Bias Circuit
VRef Buffer Q1
Chip Chip Power Bias IN + IN GS Dial Tone Filter
High Group Filter Zero Crossing Detectors Low Group Filter
Digital Detection Algorithm
Code Converter and Latch
Q2 Q3 Q4
to all Chip Clocks
St GT
Steering Logic
OSC1
OSC2
St/GT
ESt
STD
TOE
Figure 1 - Functional Block Diagram

4-11
MT8870D/MT8870D-1
1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10
ISO -CMOS
IN+ INGS VRef INH PWDN OSC1 OSC2 VSS
VDD St/GT ESt StD Q4 Q3 Q2 Q1 TOE
IN+ INGS VRef INH PWDN NC OSC1 OSC2 VSS
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
VDD St/GT ESt StD NC Q4 Q3 Q2 Q1 TOE
18 PIN CERDIP/PLASTIC DIP/SOIC
20 PIN SSOP/TSSOP
Figure 2 - Pin Connections
Pin Description
Pin # 18 1 2 3 4 5 6 7 8 9 10 20 1 2 3 4 5 6 8 9 10 11 Name IN+ INGS VRef INH PWDN OSC1 OSC2 VSS TOE Q1-Q4 Non-Inverting Op-Amp (Input). Inverting Op-Amp (Input). Gain Select. Gives access to output of front end differential amplifier for connection of feedback resistor. Reference Voltage (Output). Nominally VDD/2 is used to bias inputs at mid-rail (see Fig. 6 and Fig. 10). Inhibit (Input). Logic high inhibits the detection of tones representing characters A, B, C and D. This pin input is internally pulled down. Power Down (Input). Active high. Powers down the device and inhibits the oscillator. This pin input is internally pulled down. Clock (Input). Clock (Output). A 3.579545 MHz crystal connected between pins OSC1 and OSC2 completes the internal oscillator circuit. Ground (Input). 0V typical. Three State Output Enable (Input). Logic high enables the outputs Q1-Q4. This pin is pulled up internally. Three State Data (Output). When enabled by TOE, provide the code corresponding to the last valid tone-pair received (see Table 1). When TOE is logic low, the data outputs are high impedance. Delayed Steering (Output).Presents a logic high when a received tone-pair has been registered and the output latch updated; returns to logic low when the voltage on St/GT falls below VTSt. Early Steering (Output). Presents a logic high once the digital algorithm has detected a valid tone pair (signal condition). Any momentary loss of signal condition will cause ESt to return to a logic low. Steering Input/Guard time (Output) Bidirectional. A voltage greater than VTSt detected at St causes the device to register the detected tone pair and update the output latch. A voltage less than VTSt frees the device to accept a new tone pair. The GT output acts to reset the external steering time-constant; its state is a function of ESt and the voltage on St. Positive power supply (Input). +5V typical. No Connection. Description
11- 1214 15 15 17
StD
16
18
ESt
17
19
St/GT
18
20 7, 16
VDD NC
4-12
2003 2024
THRU
HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON ARRAYS

1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
Ideally suited for interfacing between low-level logic circuitry and multiple peripheral power loads, the Series ULN20xxA/L high-voltage, high-current Darlington arrays feature continuous load current ratings to 500 mA for each of the seven drivers. At an appropriate duty cycle depending on ambient temperature and number of drivers turned ON simultaneously, typical power loads totaling over 230 W (350 mA x 7, 95 V) can be controlled. Typical loads include relays, solenoids, stepping motors, magnetic print hammers, multiplexed LED and incandescent displays, and heaters. All devices feature open-collector outputs with integral clamp diodes. The ULN2003A/L and ULN2023A/L have series input resistors selected for operation directly with 5 V TTL or CMOS. These devices will handle numerous interface needs particularly those beyond the capabilities of standard logic buffers. The ULN2004A/L and ULN2024A/L have series input resistors for operation directly from 6 to 15 V CMOS or PMOS logic outputs.
Dwg. No. A-9594
Note that the ULN20xxA series (dual in-line package) and ULN20xxL series (small-outline IC package) are electrically identical and share a common terminal number assignment.
The ULN2003A/L and ULN2004A/L are the standard Darlington arrays. The outputs are capable of sinking 500 mA and will withstand at least 50 V in the OFF state. Outputs may be paralleled for higher load current capability. The ULN2023A/L and ULN2024A/L will withstand 95 V in the OFF state. These Darlington arrays are furnished in 16-pin dual in-line plastic packages (suffix A) and 16-lead surface-mountable SOICs (suffix L). All devices are pinned with outputs opposite inputs to facilitate ease of circuit board layout. All devices are rated for operation over the temperature range of -20C to +85C. Most (see matrix, next page) are also available for operation to -40C; to order, change the prefix from ULN to ULQ.
ABSOLUTE MAXIMUM RATINGS

Output Voltage, VCE (ULN200xA and ULN200xL) ... ........ 50 V (ULN202xA and ULN202xL) ... ........ 95 V Input Voltage, VIN ....................................30 V Continuous Output Current, IC ... ...................................................... 500 mA Continuous Input Current, IIN ... ............ 25 mA Power Dissipation, PD (one Darlington pair) ... ...................... 1.0 W (total package) ....................... .. See Graph Operating Temperature Range, TA ... .......................................... -20C to +85C Storage Temperature Range, TS ... .................................... -55C to +150C
FEATURES
TTL, DTL, PMOS, or CMOS-Compatible Inputs Output Current to 500 mA Output Voltage to 95 V Transient-Protected Outputs Dual In-Line Plastic Package or Small-Outline IC Package
x = digit to identify specific device. Characteristic shown applies to family of devices with remaining digits as shown. See matrix on next page.
www.fairchildsemi.com
MC78XX/LM78XX/MC78XXA
3-Terminal 1A Positive Voltage Regulator
Features
Output Current up to 1A Output Voltages of 5, 6, 8, 9, 10, 12, 15, 18, 24V Thermal Overload Protection Short Circuit Protection Output Transistor Safe Operating Area Protection
Description
The MC78XX/LM78XX/MC78XXA series of three terminal positive regulators are available in the TO-220/D-PAK package and with several fixed output voltages, making them useful in a wide range of applications. Each type employs internal current limiting, thermal shut down and safe operating area protection, making it essentially indestructible. If adequate heat sinking is provided, they can deliver over 1A output current. Although designed primarily as fixed voltage regulators, these devices can be used with external components to obtain adjustable voltages and currents.
TO-220
1 D-PAK
1 1. Input 2. GND 3. Output
Internal Block Digram
Rev. 1.0.1
2001 Fairchild Semiconductor Corporation
1N4001 - 1N4007
Features Low forward voltage drop. High surge current capability.
DO-41
COLOR BAND DENOTES CATHODE
General Purpose Rectifiers (Glass Passivated)

Absolute Maximum Ratings*
Symbol
VRRM IF(AV) IFSM
T
A
= 25C unless otherwise noted
Parameter
4001
Peak Repetitive Reverse Voltage Average Rectified Forward Current, .375 " lead length @ TA = 75C Non-repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave Storage Temperature Range Operating Junction Temperature 50
Value
4002
100
Units
4005
600
4003
200
4004
400 1.0 30
4006 4007
800 1000 V A A C C
Tstg TJ
-55 to +175 -55 to +175
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Thermal Characteristics
Symbol
PD RJA
Parameter
Power Dissipation Thermal Resistance, Junction to Ambient
Value
3.0 50
Units
W C/W
Electrical Characteristics
Symbol
VF Irr I
R
= 25C unless otherwise noted

A
Parameter
4001
Forward Voltage @ 1.0 A Maximum Full Load Reverse Current, Full = 75 C Cycle TA Reverse Current @ rated VR TA = 25C = 100 C TA Total Capacitance VR = 4.0 V, f = 1.0 MHz
Device
4002 4003 4004
1.1 30 5.0 500 15
Units
4005 4006 4007
V A A A pF
C
T
2001 Fairchild Semiconductor Corporation
1N4001-1N4007, Rev.
Year -2011
12
P.C.B. MANUFACTURING PROCESS
It is an important process in the fabrication of electronic equipment. The design of PCBs (Printed Circuit Boards) depends on circuit requirements like noise immunity, working frequency and voltage levels etc. High power PCBs requires a special design strategy. The fabrication process to the printed circuit board will determine to a large extent the price and reliability of the equipment. A common target aimed is the fabrication of small series of highly reliable professional quality PCBs with low investment. The target becomes especially important for customer tailored equipments in the area of industrial electronics. The layout of a PCB has to incorporate all the information of the board before one can go on the artwork preparation. This means that a concept which clearly defines all the details of the circuit and partly defines the final equipment, is prerequisite before the actual lay out can start. The detailed circuit diagram is very important for the layout designer but he must also be familiar with the design concept and with the philosophy behind the equipment.
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Year -2011
PCB BOARD TYPES: The two most popular PCB types are: 1. Single Sided Boards
The single sided PCBs are mostly used in entertainment electronics where manufacturing costs have to be kept at a minimum. However in industrial electronics cost factors cannot be neglected and single sided boards should be used wherever a particular circuit can be accommodated on such boards.
2.
Double Sided Boards
Double-sided PCBs can be made with or without plated through holes. The production of boards with plated through holes is fairly expensive. Therefore plated through hole boards are only chosen where the circuit complexities and density of components does not leave any other choice.
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Year -2011
13.
(I)
DESIGN SPECIFICATION
STEPS TAKEN WHILE PREPARING CIRCUIT
13.1 PCB DESIGNING The main purpose of printed circuit is in the routing of electric currents and signal through a thin copper layer that is bounded firmly to an insulating base material sometimes called the substrate. This base is manufactured with integrally bounded layers of thin copper foil which has to be partly etched or removed to arrive at a pre-designed pattern to suit the circuit connections or other applications as required. From the constructors point of view, the main attraction of using PCB is its role as the mechanical support for small components. There is less need for complicated and time consuming metal work of chassis contraception except perhaps in providing the final enclosure. Most straight forward circuit designs can be easily converted in to printed wiring layer the thought required to carry out the inversion cab footed high light an possible error that would otherwise be missed in conventional point to point wiring .The finished project is usually neater and truly a work of art. Actual size PCB layout for the circuit shown is drawn on the copper board. The board is then immersed in FeCl3 solution for 12 hours. In this process only the exposed copper portion is etched out by the solution. Now the petrol washes out the paint and the copper layout on PCB is rubbed with a smooth sand paper slowly and lightly such that only the oxide layers over the Cu are removed. Now the holes are drilled at the respective places according to component layout as shown in figure.
Page 33
Year -2011
13.2) LAYOUT DESIGN: When designing the layout one should observe the minimum size (component body length and weight). Before starting to design the layout we need all the required components in hand so that an accurate assessment of space can be made. Other space considerations might also be included from case to case of mounted components over the printed circuit board or to access path of present components. It might be necessary to turn some components around to a different angular position so that terminals are closer to the connections of the components. The scale can be checked by positioning the components on the squared paper. If any connection crosses, then one can reroute to avoid such condition. All common or earth lines should ideally be connected to a common line routed around the perimeter of the layout. This will act as the ground plane. If possible try to route the outer supply line to the ground plane. If possible try to route the other supply lines around the opposite edge of the layout through the center. The first set is tearing the circuit to eliminate the crossover without altering the circuit detail in any way. Plan the layout looking at the topside to this board. First this should be translated inversely; later for the etching pattern large areas are recommended to maintain good copper adhesion. It is important to bear in mind always that copper track width must be according to the recommended minimum dimensions and allowance must be made for increased width where termination holes are needed. From this aspect, it can become little tricky to negotiate the route to connect small transistors.
Page 34
Year -2011
There are basically two ways of copper interconnection patterns underside the board. The first is the removal of only the amount of copper necessary to isolate the junctions of the components to one another. The second is to make the interconnection pattern looking more like conventional point wiring by routing uniform width of copper from component to component.
13.3) ETCHING PROCESS: Etching process requires the use of chemicals. Acid resistant dishes and running water supply. Ferric chloride is mostly used solution but other etching materials such as ammonium per sulphate can be used. Nitric acid can be used but in general it is not used due to poisonous fumes.
The pattern prepared is glued to the copper surface of the board using a latex type of adhesive that can be cubed after use. The pattern is laid firmly on the copper using a very sharp knife to cut round the pattern carefully to remove the paper corresponding to the required copper pattern areas. Then apply the resistant solution, which can be a kind of ink solution for the Purpose of maintaining smooth clean outlines as far as possible. While the board is drying, test all the components.
Before going to next stage, check the whole pattern and cross check with the circuit diagram. Check for any free metal on the copper. The etching bath should be in a glass or enamel disc. If using crystal of ferric- chloride
Page 35
Year -2011
these should be thoroughly dissolved in water to the proportion suggested. There should be 0.5 lt. of water for 125 gm of crystal.
To prevent particles of copper hindering further etching, agitate the solutions carefully by gently twisting or rocking the tray.
The board should not be left in the bath a moment longer than is needed to remove just the right amount of copper. Inspite of there being a resistive coating there is no protection against etching away through exposed copper edges. This leads to over etching. Have running water ready so that etched board can be removed properly and rinsed. This will halt etching immediately.
Drilling is one of those operations that call for great care. For most purposes a 0.5mm drill is used. Drill all holes with this size first those that need to be larger can be easily drilled again with the appropriate larger size.
13.4) COMPONENT ASSEMBLY: -
From the greatest variety of electronic components available, which runs into thousands of different types it, is often a perplexing task to know which is right for a given job.
Page 36
Year -2011
There could be damage such as hairline crack on PCB. If there are, then they can be repaired by soldering a short link of bare copper wire over the affected part.
The most popular method of holding all the items is to bring the wires far apart after they have been inserted in the appropriate holes. This will hold the component in position ready for soldering. Some components will be considerably larger .So it is best to start mounting the smallest first and progressing through to the largest. Before starting, be certain that no further drilling is likely to be necessary because access may be impossible later.
Next will probably be the resistor, small signal diodes or other similar size components. Some capacitors are also very small but it would be best to fit these afterwards. When fitting each group of components mark off each one on the circuit as it is fitted so that if we have to leave the job we know where to recommence.
Although transistors and integrated circuits are small items there are good reasons for leaving the soldering of these until the last step. The main point is that these components are very sensitive to heat and if subjected to prolonged application of the soldering iron, they could be internally damaged.
Page 37
Year -2011
All the components before mounting are rubbed with sand paper so that oxide layer is removed from the tips. Now they are mounted according to the component layout.
13.5) SOLDERING: This is the operation of joining the components with PCB after this operation the circuit will be ready to use to avoid any damage or fault during this operation following care must be taken.
1. A longer duration contact between soldering iron bit & components lead can exceed the temperature rating of device & cause partial or total damage of the device. Hence before soldering we must carefully read the maximum soldering temperature & soldering time for device. 2. The wattage of soldering iron should be selected as minimum as permissible for that soldering place. 3. To protect the devices by leakage current of iron its bit should be earthed properly. 4. We should select the soldering wire with proper ratio of Pb & Tn to provide the suitable melting temperature. 5. Proper amount of good quality flux must be applied on the soldering point to avoid dry soldering.
Page 38
Year -2011
14. WORKING HOW TO USE? We have to maintain the uninterrupted power supply to the receiver unit. The mobile phone is connected with the control unit via DTMF decoder IC by means of Headphone of mobile phone. The battery of mobile phone should regularly charge and mobile phone with control unit is kept at the pace where the receiver gets perfect signal strength. The appliances connected are also kept connected with power supply. WORKING: The user dials the mobile number of the receiver unit cell phone by his mobile phone. Once the connection is established by the GSM service provider the call is automatically attended by receiving unit cell phone because of auto answering mode. When the call connected user presses the key from 1-7 one by one & send control to the receiving unit. The receiving unit cell phone is connected with DTMF decoder MT8870 hence received DTMF signals are decoded & converted into 4 bit o/p. The 4bit converted O/P sent to microcontroller IC where it drives appropriate relay & hence connected appliance. The appliances connected are being ON/OFF by pressing same keys. We could ON/OFF all appliances at once by pressing key * & 0.
Page 39
Year -2011
15.
applications are listed below-
APPLICATIONS
Our project is very useful in controlling home appliances. Some other
1. As a complementary option of Industrial Automation. 2. For security & other equipment control. 3. Military & Intelligence operations for switching equipments at distance. Advantages: 1. No need to go on field. 2. Higher reliability. 3. Cost effective. 4. Fast efficient. 5. Seven devices can be controlled by single key command
FURTHAR DEVELOPEMENT The device can be used in very advance manner. It can develop the device as data saving facility, remote applications & user authentication and with smart biometric access services.
Page 40
Year -2011
16. CHRONOLOGY
The following steps have been followed in carrying out the project.
1. 2. 3. 4.
Study the books on the relevant topic. Understand the working of the circuit. Prepare the circuit diagram. Prepare the list of components along with their specification. Estimate the cost and procure them after carrying out market survey.
5. 6. 7. 8. 9. 10.
Plan and prepare PCB for mounting all the components. Fix the components on the PCB and solder them. Test the circuit for the desired performance. Trace and rectify faults if any. Give good finish to the unit. Prepare the project report.
Page 41
Year -2011
17.
BIBILIOGRAPHY
REFERENCE FOR TECHNICAL INFORMATION FROM FOLLOWING BOOKS:
1. DTMF Based Remote Control System - R. Sharma, K. Kumar, and S. Viq, IEEE International Conference ICIT, pp. 2380-2383, December 2006. 2. A phone based Remote Controller for Home- I. Coskun and H. Ardam IEEE Trans.Consumer , vol.44,no. 4,pp. 1291-1297, November 1998 3. Electronics For You 4. Integrated Electronics by Millman & Hawlkiwas. 5. Basic Electronics by J. B. Gupta 6. High Performance Printed Circuit Board Charles Harper 7. Industrial automation Magazine
REFERENCE FOR ARTICLES & TECHNICAL INFORMATION ON REMOTE ACCESS TERMINAL FROM FOLLOWING SITES:
http://www.google.co.in (Google search engine) http://www.whereisdoc.com http://www.electronicsforu.com http://electrosofts.com/dtmf http://www.electronicprojects.com www.atmel.com/dyn/resources/prod_documents/doc2543.pdf www.datasheetcatalog.net/
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Device Control Using GSM Mobile Phone Project Electronics

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Device Control Using GSM Mobile Phone Project Electronics

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Department of Electronics & Communication.

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

System Block Diagram

The block diagram of the system is given below:

Receiving Cell Phone Unit

RELAY3 DTMF Decoder MT8870

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

POWER SUPPLY SECTION

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

(III) Intended application (IV) Ambient temperature rating (V) Cost

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

Transformation ratio: (1) (2) Step up transformer Step down transformer

(1) (2) (b)

Lower to higher-> Step up Higher to lower-> Step down

GLOBUS ENGINEERING COLLEGE, BHOPAL

Department of Electronics & Communication.

GLOBUS ENGINEERING COLLEGE, BHOPAL

8-bit Microcontroller with 2K Bytes In-System Programmable Flash ATtiny2313/V Preliminary

Figure 1. Pinout ATtiny2313

NOTE: Bottom pad should be soldered to ground.

XTAL1 PA0 - PA2

DATA REGISTER PORTA

DATA DIR. REG. PORTA

INTERNAL CALIBRATED OSCILLATOR

8-BIT DATA BUS GND PROGRAM COUNTER STACK POINTER