4 Marks: 1. Explain the process of epitaxial growth. 2. Discuss how ion implantation is done. 3.

How a p-type crystal is prepared using epitaxial growth? 4. What is meant by dry oxidation? 5. Compare Si and Ge as raw materials for IC fabricator. 6. Write a note on wire bonding. 7. How, using epitaxial growth a n-type silicon crystal can be obtained? 8. What is meant by wet oxidation? 9. Compare electron beam lithography and X-ray lithography? 10. What is Dry oxidation? What are its advantages? 11. Explain about lithography. 12. State Ficks II law of diffusion. 13. Explain Fick's Laws of diffusion. 14. Discuss the process of photolithography. 15. What is twinning? How is it different from grain boundary? 16. State Ficks second law of diffusion. 17. Draw a schematic of polishing process and explain. 18. State Fick's I law of diffusion.

12 Marks: 1. Explain in detail the diffusion process. Discuss the physical mechanism and laws governing this process. 2. Discuss the various ways in which lithography can be performed. 3. Explain the physical mechanism of diffusion of impurities. Also state and explain Flick's 1 and II law of diffusion. 4. Discuss about: a. Chemical Vapour deposition. b. Metallisation. 5. Explain the epitaxial growth process. What are its features? 6. Explain ion implantation. What are its advantages? 7. Discuss about the following with reference to diffusion of Impurities: a. Complementary error function. b. Gaussian Distribution profile. c. Diffusion coefficients. 8. Explain the following: a. Photolithography. b. Electron beam and X-ray lithography. 9. Explain Czochralski process? What are its advantages? 10. Explain different printing techniques in lithography? 11. Draw a schematic of crystal grower and explain its operation. 12. Explain about Fine line lithography. 13. Explain the steps in a Silicon wafer preparation. Discuss the Czochralski process. 14. Explain the chemical wafer deposition process with the help of diagram showing the equipment. 15. Discuss the different steps involved in silicon shaping. 16. Briefly explain the process of X-ray lithography. 17. Briefly explain the process steps in IC fabrication. 18. Explain the following terms : a. Patterning b. Wire bonding.