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  • Formip 1

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    boren11
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    This document is a request form for written authority to file a patent application outside of Kenya. The applicant provides their name and address, as well as the name and address of any agents. They also include the title of the invention. The applicant signs the form to request authority to file for a patent outside of Kenya, as required by Section 28(1) of the Industrial Property Act, 2001.

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    This document is a request form for written authority to file a patent application outside of Kenya. The applicant provides their name and address, as well as the name and address of any agents. They also include the title of the invention. The applicant signs the form to request authority to file for a patent outside of Kenya, as required by Section 28(1) of the Industrial Property Act, 2001.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    264 views1 page

    Formip 1

    Uploaded by

    boren11
    This document is a request form for written authority to file a patent application outside of Kenya. The applicant provides their name and address, as well as the name and address of any agents. They also include the title of the invention. The applicant signs the form to request authority to file for a patent outside of Kenya, as required by Section 28(1) of the Industrial Property Act, 2001.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
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    of 1

    FORM IP 1 Regulation 10 THE INDUSTRIAL PROPERTY ACT, 2001

    The Managing Director, Kenya Industrial Property Institute. REQUEST FOR WRITTEN AUTHORITY REFERRED TO IN SECTION 28(1) OF THE ACT

    Name and address of applicant(s)

    Name and address of agent (if any) Title of invention

    I/We, the applicant(s) identified above, apply for authority to file a patent application outside Kenya. My/Our reasons for making this request are as follows

    Dated at ........................... this ...................................... day of ......................., 20...........

    Signature.................................

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