ITRS MEMS

San Francisco, CA July 12, 2012

Presentation by Michael Gaitan, NIST

MEMS Technology Working Group

Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Akihiro Koga Arthur Morris Asif Chowdhury Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Christian Rembe Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Goro Nakatani Hebert Bennett Toshiba Henne van Heeren Wispry Hiroshi Yamada Analog Devices Ingrid De Wolf SB Microsystems Jae Sung Yoon MEMSCAP Jim Spall National U of Singapore Jim Mrvos Promeus Jianmin Miao IMEC John Rychcik PolyTec Josh Molho iNEMI Karen Lightman Jazz Semiconductor Kevin Chau Perdue Koji Fukumoto Acutronic Marcie Weinstein University of MD Mark Crockett Asian Pacific Micro Mary Ann Maher ST Micro Michel Brillouet KFM Technology Monica Takacs Fujitsu Patric Salomon Rohm Pete Loeppert NIST Raj Gupta enablingMNT Raji Baskaran Toshiba Rakesh Kumar IMEC Randy Wagner KIMM Robert De Nuccio Delphi Ron Lawes Lexmark Sacha Revel NTU Scott Bryant Solidus Shawn Blanton Caliper Stephane Donnay MEMS Industry Group Steve Breit MEMStaff Steve Greathouse Sony Steve Walsh Akustica Takashi Mihara SEMI, MEMSmart Tetsu Tanaka SoftMEMS Tony Stamper LETI Veljko Milanovic MEMS Industry Group Wei-Leun Fang 4m2c Wendy Chen Knowles Acoustics Xiaoming Wu Volant Technologies Yasutaka Nakashiba Intel Global Foundries NIST ST Micro Imperial College Accutronic MANCEF Carnegie Mellon University IMEC Coventor Plexus MANCEF Micromachine Center Tohoku Univ. IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics

MEMS Technology Working Group Chair: Mike Gaitan (NIST), Chair Group Co-Chairs: MEMS Robert Tsai Industry (TSMC) and Philippe Robert (LETI)
Akihiro Koga Arthur Morris Asif Chowdhury Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Christian Rembe Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Goro Nakatani Hebert Bennett Toshiba Henne van Heeren Wispry Hiroshi Yamada Analog Devices Ingrid De Wolf SB Microsystems Jae Sung Yoon MEMSCAP Jim Spall National U of Singapore Jim Mrvos Promeus Jianmin Miao IMEC John Rychcik PolyTec Josh Molho iNEMI Karen Lightman Jazz Semiconductor Kevin Chau Perdue Koji Fukumoto Acutronic Marcie Weinstein University of MD Mark Crockett Asian Pacific Micro Mary Ann Maher ST Micro Michel Brillouet KFM Technology Monica Takacs Fujitsu Patric Salomon Rohm Pete Loeppert NIST Raj Gupta

MEMS TWG
Subgroups: Devices, Design and Simulation, Packaging and Integration, and Testing

enablingMNT Raji Baskaran Toshiba Rakesh Kumar IMEC Randy Wagner KIMM Robert De Nuccio Delphi Ron Lawes Lexmark Sacha Revel NTU Scott Bryant Solidus Shawn Blanton Caliper Stephane Donnay MEMS Industry Group Steve Breit MEMStaff Steve Greathouse Sony Steve Walsh Akustica Takashi Mihara SEMI, MEMSmart Tetsu Tanaka SoftMEMS Tony Stamper LETI Veljko Milanovic MEMS Industry Group Wei-Leun Fang 4m2c Wendy Chen Knowles Acoustics Xiaoming Wu Volant Technologies Yasutaka Nakashiba

Intel Global Foundries NIST ST Micro Imperial College Accutronic MANCEF Carnegie Mellon University IMEC Coventor Plexus MANCEF Micromachine Center Tohoku Univ. IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics

Focus: MEMS in Mobile Devices

Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012

ITRS MEMS
MEMS Device Technologies
Accelerometers Gyroscopes Microphones RF MEMS Emerging MEMS

Technology Requirements
Device Performance Design and Simulation Packaging and Integration Device Testing

MEMS Inertial Sensors

MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost. The integration of functionalities (tri axis accelerometer, gyroscope, magnetometer, and pressure sensor) towards the IMU has advanced to 9 DOF in the package. Driving down the cost of testing of the IMU continues to be a challenge.

Example - 9 DOF IMU Package Level

ST Microelectronics Feb 12, 2012

http://www.st.com/internet/com/press_release/p3273.jsp

MEMS Microphones
MEMS microphones are expected to incrementally increase in performance and lower in cost. As the sensitivity of microphones advances to 68 db, testing in the factory environment is an issue. Advances in the ASIC include digital output and adaptive signal processing (such as noise cancellation). Testing of MEMS Microphones with adaptive signal processing is a challenge.

RF MEMS
RF MEMS are intended to lower the power dissipation of the radio. RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices. RF MEMS are expected to increase in performance and reliability.
The biggest challenge in RF MEMS is enhancing reliability and lifetime (# of operations) Some of the future performance metrics have no known solutions, (e.g., signal isolation requirements)

Grand Challenges
Difficult Challenges Potential Solutions
Standardization for MEMS packaging to support integration. Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity. Package data that can be used to accurately predict the effect of the package on device performance.

Integration of MEMS in the Package

Testing of MEMS

More testing towards the wafer level. Validated tools to predict device device performance from wafer tests. Methodologies for Design for Test or Design for NO Test. More knowledge of the physics of failure is required to develop accelerated life tests. Need to share information. Individual solutions exist but are not being generalized across the industry.

Validated accelerated life testing for MEMS

MEMS Manufacturing
MEMS Manufacturing Cost R&D Investment
Packaging and Testing

Device Fabrication Packaging and Testing Device and Process Development

 The MEMS Technology Working Group is also affiliated with iNEMI.

ITRS and iNEMI

The iNEMI MEMS will be expanded to include consumer health applications: the "Worried Well."
TWG discussions include the concept of integration node.

An iNEMI project on MEMS Testing Requirements is in discussion. The focus will likely be on defining performance metrics in data sheets.

MEDICAL MARKET- High Potential

Bubble Chart Ref: IBM Institute for Business Value, The future of connected health devices

3 BILLION POTENTIAL CUSTOMERS FOR

CONNECTED HEALTH DEVICES

Integration Node
Accelerometer Tri-Axis Accelerometer 6 DOF Sensor Gyroscope Tri-Axis Gyroscope

9 DOF Sensor
10 DOF Sensor

Magnetometer

Tri-Axis Magnetometer

Pressure Sensor

 Opportunities for industrial collaboration exist around issues at the back end (packaging and test)

Conclusions

MEMS Sensor Fusion creates challenges for testing in increasing complexity while still lowering cost.
MEMS Testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).

Our road mapping has so far been on near term (5 years). The concept of integration node might facilitate longer term road mapping of MEMS and other More than Moore Technologies.