2SJ539

Silicon P Channel MOS FET

REJ03G0886-0300 (Previous: ADE-208-657A) Rev.3.00 Sep 07, 2005

Description
High speed power switching

Features
Low on-resistance RDS (on) = 0.16 typ. Low drive current 4 V gate drive devices High speed switching

Outline
RENESAS Package code: PRSS0004AC-A (Package name: TO-220AB)
D

1. Gate 2. Drain (Flange) 3. Source

Rev.3.00 Sep 07, 2005 page 1 of 7

2SJ539

Absolute Maximum Ratings

(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tc = 25C 3. Value at Tch = 25C, Rg 50 Symbol VDSS VGSS ID ID (pulse) IDR
Note 1

Value 60 20 10 40 10 10 8.5 40 150 55 to +150

Unit V V A A A A mJ W C C

IAP Note 3 EAR Pch Tch

Note 2

Note 3

Tstg

Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltage drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 4. Pulse test Symbol V (BR) DSS V (BR) GSS IDSS IGSS VGS (off) RDS (on) RDS (on) |yfs| Ciss Coss Crss td (on) tr td (off) tf VDF trr Min 60 20 1.0 3.5 Typ 0.16 0.23 5.5 400 220 75 10 45 65 50 1.2 70 Max 10 10 2.0 0.21 0.36 Unit V V A A V S pF pF pF ns ns ns ns V ns Test Conditions ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 VDS = 60 V, VGS = 0 VGS = 16 V, VDS = 0 ID = 1 mA, VDS = 10 V Note 4 ID = 5 A, VGS = 10 V ID = 5 A, VGS = 4 V Note 4 ID = 5 A, VDS = 10 V VDS = 10 V VGS = 0 f = 1 MHz VGS = 10 V ID = 5 A RL = 6 IF = 10 A, VGS = 0 IF = 10 A, VGS = 0 diF/dt = 50 A/s
Note 4

Rev.3.00 Sep 07, 2005 page 2 of 7

2SJ539

Main Characteristics
Power vs. Temperature Derating
80 100 50

Maximum Safe Operation Area

10 s
10 0 s

Pch (W)

ID (A)

60

20 10 5 2 1 0.5 0.2
DC

PW

Channel Dissipation

40

20

10 s O pe ms ra tio (1 s ho n (T t c= ) Operation in 25 C this area is ) limited by RDS (on)

Drain Current
0 50 100 150 200

Ta = 25C 0.1 0.1 0.3 1

10

30

100

Case Temperature

Tc (C)

Drain to Source Voltage

VDS (V)

Typical Output Characteristics

10 10 V 6 V 5 V 4 V Pulse Test 10

Typical Transfer Characteristics

VDS = 10 V Pulse Test

ID (A)

3.5 V

ID (A) Drain Current

Drain Current

3 V

VGS = 2.5 V

2 Tc = 75C 25C 25C

10

Drain to Source Voltage

VDS (V)

Gate to Source Voltage

VGS (V)

Drain to Source Saturation Voltage VDS (on) (V)

Drain to Source Saturation Voltage vs. Gate to Source Voltage

2.0 Pulse Test 1.6

Static Drain to Source on State Resistance vs. Drain Current

Static Drain to Source on State Resistance RDS (on) ()
1 0.5 VGS = 4 V 0.2 0.1 0.05 10 V

1.2

0.8

ID = 5 A 2 A
1 A

0.4

0.02 Pulse Test 0.01 0.1 0.3 1 3 10 30 100

0 0 4 8 12 16 20

Gate to Source Voltage

VGS (V)

Drain Current

ID (A)

Rev.3.00 Sep 07, 2005 page 3 of 7

2SJ539
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S) Static Drain to Source on State Resistance RDS (on) ()
0.5 Pulse Test 0.4 VGS = 4 V 2 A ID = 5 A 1 A 100 30 10 3 25C 1 0.3 0.1 0.1 75C VDS = 10 V Pulse Test 0.3 1 3 10 30 100 Tc = 25C

Forward Transfer Admittance vs. Drain Current

0.3

0.2 1 A, 2 A 0.1 10 V

5 A

0 40

40

80

120

160

Case Temperature

Tc (C)

Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage

5000 2000

Body-Drain Diode Reverse Recovery Time

500

Reverse Recovery Time trr (ns)

Capacitance C (pF)

200 100 50

1000 500 200 100 50 20 VGS = 0 f = 1 MHz 10 0 10 Crss 20 30 40 50 Coss Ciss

20 10 5 0.1 0.2 di / dt = 50 A / s VGS = 0, Ta = 25C 0.5 1 2 5 10 20

Reverse Drain Current

IDR (A)

Drain to Source Voltage VDS (V)

Dynamic Input Characteristics

VDS (V) VGS (V)
0 VDD = 10 V 25 V 50 V 0 1000 300 100

Switching Characteristics
VGS = 10 V, VDD = 30 V PW = 5 s, duty 1 % td(off) tf 30 10 3 1 0.1 0.2 tr td(on)

20

Drain to Source Voltage

40 VDS 60 VGS VDD = 10 V 25 V 50 V

12

80 ID = 10 A 0 8 16 24 32

16

100

20 40

Gate to Source Voltage

Switching Time t (ns)

0.5 1

5 10 20

Gate Charge

Qg (nc)

Drain Current

ID (A)

Rev.3.00 Sep 07, 2005 page 4 of 7

2SJ539
Reverse Drain Current vs. Source to Drain Voltage
10

Maximum Avalanche Energy vs. Channel Temperature Derating

Repetitive Avalanche Energy EAR (mJ)

10 IAP = 10 A VDD = 25 V duty < 0.1 % Rg 50

Reverse Drain Current IDR (A)

8 10 V

5 V VGS = 0, 5 V

2 Pulse Test 0 0 0.4 0.8 1.2 1.6 2.0

0 25

50

75

100

125

150

Source to Drain Voltage

VSD (V)

Channel Temperature Tch (C)

Normalized Transient Thermal Impedance vs. Pulse Width

Normalized Transient Thermal Impedance s (t)

3 Tc = 25C 1 D=1 0.5 0.3

0.2

0.1
0.1

0.05

ch c (t) = s (t) ch c ch c = 3.12C/W, Tc = 25C PDM

pu ls e

0.02
0.03
0.0
1s

D= PW T

PW T

t ho

0.01 10

100

1m

10 m

100 m

10

Pulse Width PW (S)

Avalanche Test Circuit

Avalanche Waveform 1 L IAP2 2 VDSS VDSS VDD

V(BR)DSS IAP VDD ID VDS

VDS Monitor

L IAP Monitor

EAR =

Rg

D.U.T

Vin 15 V

50 VDD

Rev.3.00 Sep 07, 2005 page 5 of 7

2SJ539
Switching Time Test Circuit
Vin Vin Monitor D.U.T. RL 90% Vin 10 V 50 VDD = 30 V Vout td(on) 10% tr td(off) 10% tf 90% 90% Vout Monitor 10%

Waveform

Rev.3.00 Sep 07, 2005 page 6 of 7

2SJ539

Package Dimensions
JEITA Package Code
SC-46

RENESAS Code
PRSS0004AC-A

Package Name TO-220AB / TO-220ABV

MASS[Typ.] 1.8g

Unit: mm

11.5 Max

2.79 0.2

10.16 0.2 9.5 8.0 3.6 0.08

+0.2 0.1
+0.1

4.44 0.2 1.26 0.15

6.4

18.5 0.5

15.0 0.3

1.27

2.7 Max

7.8 0.5

0.76 0.1

14.0 0.5

1.5 Max

2.54 0.5

2.54 0.5

0.5 0.1

Ordering Information
Part Name Quantity Shipping Container 2SJ539-E 500 pcs Box (Sack) Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.

Rev.3.00 Sep 07, 2005 page 7 of 7

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