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guide1PCB REpair
guide1PCB REpair
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TABLE OF CONTENTS
Types - Printed Board Types R. Rigid Printed Boards and Assemblies F. Flexible Printed Boards and Assemblies W. Discrete Wiring Boards and Assemblies C. Ceramic Boards and Assemblies No. 1.0 2.0 2.1 2.2 2.3.1 2.3.2 2.3.3 2.3.4 2.3.5 2.3.6 2.4.1 2.4.2 2.5 2.6.1 2.6.2 2.6.3 2.7 3.0 3.1 3.2 3.3.1 3.3.2 3.4.1 3.4.2 3.5.1 3.5.2 3.5.3 4.0 4.1.1 4.1.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.3.1 4.3.2 4.3.3 4.3.4 Title FOREWORD BASIC PROCEDURES Handling Electronic Assemblies Cleaning Coating Removal, Identification Of Coating Coating Removal, Solvent Method Coating Removal, Peeling Method Coating Removal, Thermal Method Coating Removal, Grinding/Scraping Method Coating Removal, Micro Blasting Method Coating Replacement, Solder Mask Coating Replacement, Conformal Coatings/Encapsulants Baking And Preheating Legend/Marking, Stamping Method Legend/Marking, Hand Lettering Method Legend/Marking, Stencil Method Epoxy Mixing and Handling BASE MATERIAL PROCEDURES Delamination/Blister Repair, Injection Method Bow And Twist Repair Hole Repair, Epoxy Method Hole Repair, Transplant Method Key And Slot Repair, Epoxy Method Key And Slot Repair, Transplant Method Base Material Repair, Epoxy Method Base Material Repair, Area Transplant Method Base Material Repair, Edge Transplant Method CONDUCTOR AND LAND PROCEDURES Lifted Conductor Repair, Epoxy Seal Method Lifted Conductor Repair, Film Adhesive Method Conductor Repair, Foil Jumper, Epoxy Method Conductor Repair, Foil Jumper, Film Adhesive Method Conductor Repair, Welding Method Conductor Repair, Surface Wire Method Conductor Repair, Through Board Wire Method Conductor Repair, Inner Layer Method Circuit Cut, Surface Circuits Circuit Cut, Inner Layer Circuits Deleting Inner Layer Connection At A Plated Hole, Drill Through Deleting Inner Layer Connection At A Plated Hole, Spoke Cut
1997
C - Conformance Level High Highest Level Medium Medium Level Low Lowest Level
Types
Rev D
R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C
High High High High High High High High High High High High High High High
I I A A A A A A I I I I I I I
C C C D D D D D D D D D C C C
R R, W R, W R, W R, W R, W R, W R, W R, W
A A A E A E A E E
C C C D C C C C C
R, F R, F R, F, C R, F, C R, F, C R, F, C R R, F R, F R, F R, F R, F
Medium High Medium High High Medium Medium High High High High High
I I A A A I A E A A A A
C C D C C C C D D D D D
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
4.4.1 4.4.2 4.5.1 4.5.2 4.6.1 4.6.2 4.6.3 4.7.1 4.7.2 5.0 5.1 5.2 5.3 6.0 6.1 6.2 6.3 6.4 6.5 7.0 7.1.1 7.1.2 7.1.3 7.2.1 7.2.2 7.3.1 7.3.2 7.4.1 7.4.2 7.4.3 7.5.1 7.5.2 7.5.3 8.0 8.1.1 8.1.2 8.2.1 8.2.2 8.3.1 8.3.2 8.4.1 8.4.2
Lifted Land Repair, Epoxy Method Lifted Land Repair, Film Adhesive Method Land Repair, Epoxy Method Land Repair, Film Adhesive Method Edge Contact Repair, Epoxy Method Edge Contact Repair, Film Adhesive Method Edge Contact Repair, Plating Method Surface Mount Pad Repair, Epoxy Method Surface Mount Pad Repair, Film Adhesive Method PLATED HOLE PROCEDURES Plated Hole Repair, No Inner Layer Connection Plated Hole Repair, Double Wall Method Plated Hole Repair, Inner Layer Connection JUMPER WIRE PROCEDURES Jumper Wire Basics Jumper Wires, Through Hole Components Jumper Wires, Chip Components, Pads and Conductors Jumper Wires, J Lead Components Jumper Wires, Gull Wing Components SOLDERING PROCEDURES Soldering Basics Preparation For Soldering And Component Removal Solder Joint Acceptance Criteria Soldering Through Hole Components, Point To Point Method Soldering Through Hole Components, Solder Fountain Method Soldering SM Chip Components, Point To Point Method Soldering SM Chip Components, Hot Gas Method Soldering SM J Lead Components, Point To Point Method Soldering SM J Lead Components, Continuous Flow Method Soldering SM J Lead Components, Hot Gas Method Soldering SM Gull Wing Components, Point To Point Method Soldering SM Gull Wing Components, Continuous Flow Method Soldering SM Gull Wing Components, Hot Gas Method COMPONENT REMOVAL PROCEDURES Component Removal, Through Hole, Vacuum Method Component Removal, Through Hole, Solder Fountain Method Component Removal, SM Chip Components, Forked Tip Method Component Removal, SM Chip Components, Hot Tweezer Method Component Removal, SM J Lead Components, Conduction Method Component Removal, SM J Lead Components, Hot Gas/Air Method Component Removal, SM Gull Wing Components Conduction Method Component Removal, SM Gull Wing Components Hot Gas/Air Method
R, F R, F R, F R, F R, F, W, C R, F, W, C R, F, W, C R, F, C R, F, C
A A A A A A A A A
C C C C C C D D C
C D C
R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C
I I I I I
C C C C C
R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C
N/A N/A N/A High High High High High High High High High High
I I I I E I I I I I I I I
C C C C C C C C C C C C C
R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C R, F, W, C
I E I I A A A A
C C C C C C C C
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
1.0 FOREWORD
1.1 Introduction PC boards are more complex today than ever before, but despite how severely damaged they may be, they can be repaired. Indeed the high value of many PC boards demands that they be repaired. Even less expensive assemblies require repair because just-in-time manufacturing and tightly controlled production runs leave little room for shortage. Just a few years ago, PC boards were much simpler and repairs were relatively easy. Today's PC boards have fine pitch components, ball grid arrays and fine line circuits making them a challenge to repair. Yet, we're driven by simple economics and must repair damaged PC boards whenever possible. This manual is designed to help you repair and ship good, reliable PC boards that might otherwise be consigned to scrap. Because of its high demands, PC board repair has been accurately compared to surgery. Whether repairing surface mount pads or repairing damaged internal circuitry, the technical knowledge and manual skills needed for high reliability repair and rework are indeed demanding. Since today's repair procedures are more sophisticated than ever before, you need a comprehensive guidebook. The repair specialists at Circuit Technology Center, Inc. have used this guidebook to repair thousands of PC boards. Circuit Technology Center, Inc. is the world's leading specialist in PC board repair and modification and the procedures described herein are the same procedures they use to repair and modify PC boards. They have been repairing PC boards for over 15 years for companies including Digital Equipment Corporation, IBM, Hewlett Packard, Siemens, Compaq Computer, AT&T, Allied Signal Aerospace and hundreds of other commercial and military manufacturers. Damaged PC boards may be compared to patients in a hospital. Some will need a stitch or two while others will need open heart surgery. To expect a reliable outcome, each repair project must follow proven and well established procedures. This guidebook covers the repair and rework of both surface mount and through hole PC boards and assemblies. Not only will this guidebook give you the details for most PC board repair procedures, but it will also explain why certain procedures are important and answer many questions that you're bound to have. 1.2 Purpose This guidebook includes procedures for modifying, reworking and repairing printed boards and printed board assemblies. It complies with standards set by the Institute for Interconnecting and Packaging Electronic Circuits (IPC), in Northbrook IL. The main IPC documents to refer to when using this guidebook include: J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies IPC-A-600 Acceptability of Printed Boards IPC-A-610 Acceptability of Electronic Assemblies IPC-R-700 Modification, Rework and Repair of Printed Boards and Assemblies. Revision levels for each procedure are recorded in the header section. A complete log of engineering changes is maintained at Circuit Technology Center, Inc..
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
1.3
Classes of Product Three Classes of Products are referred to in this guidebook. 1. Class 1 General Electronic Products Includes consumer products, some computer products and computer peripherals, and hardware suitable for applications where the major requirement is the function of the completed assembly. 2. Class 2 Dedicated Service Electronic Products Includes communications equipment, sophisticated business machines, and instruments where high performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically, the end use environment would not cause failures. 3. Class 3 High Performance Electronic Products Includes equipment for commercial and military products where continued performance or performance-on-demand is critical. Equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function where required, such as life support and critical weapons systems.
1.4
Printed Board Types Four Printed Board Types are referred to in this guidebook. R - Rigid Printed Boards and Assemblies A printed board or assembly using rigid base materials only. These may be single sided, double sided or multilayered. F - Flexible Printed Boards and Assemblies A printed board or assembly using flexible or a combination of rigid and flexible materials only. May be partially provided with electrically nonfunctional stiffeners and/or cover lay. These may be single sided, double sided or multilayered. W - Discrete Wiring Boards and Assemblies A printed board\assembly using a wire technique to obtain electrical interconnections. C - Ceramic Boards and Assemblies A printed board or assembly using ceramic as the base material with interconnections separated by dielectric.
1.5
Conformance Level Conformance Level indicates how closely the repaired or reworked product will be to the original specifications. The Conformance Level listed for each procedure should be used as a guide only. Conformance Levels include the following: High Most closely duplicates the physical characteristics of the original and most probably complies with all the functional, environmental and serviceability factors.
1997
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Medium
Some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors. Significant variance with the physical character of the original and may vary with many of the electrical, functional, environmental and serviceability factors.
Low
Class 3 Products must use procedures rated High unless it can be demonstrated that a lower level procedure will not adversely affect the products functional characteristics. Class 2 and 1 Products should use procedures rated High for assured safety and dependability but Medium or Low Level procedures can be used if it has been determined that they are suitable for the specific product's functional characteristics. Procedures in this manual are given a "Conformance Level" rating which is described in the following table. Table 1 Conformance Level
Conformance Level Functional Consideration Electrical - Resistance Electrical - Inductance Electrical - Capacitance Electrical - Cross Talk Electrical - High Speed Frequency Environmental - Shock Environmental - Vibration Environmental - Humidity Environmental - Temperature Environmental - Altitude Environmental - Bacteria Environmental - Fungus Serviceability - Future Repair or Mod. High Yes Yes Yes Yes Yes Yes Yes Verify Yes Verify Yes Yes No Medium Verify Verify Verify Verify Verify Verify Verify Verify Yes Verify Verify Verify Yes Low No No No No No No No Verify Yes Verify Verify Verify Yes
Procedure may not comply with functional consideration. Procedure should comply with functional consideration but should be tested to verify. Procedure will normally comply with functional consideration.
Skill Level In the PC board manufacturing and assembly environment, most processes are tightly controlled and one-directional. The technicians who run these processes have certain defined characteristics and training. As you look deeper into the repair operation, the first thing that becomes apparent is that an entirely different set of skills is needed. Repair skills are more specific. They require a higher degree of manual dexterity, patience, and a thorough understanding of the repair process. There are more steps involved in any single repair operation than the typical assembly technician would be confronted with. It becomes a
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
personnel issue as well as a training one. You must not only have the proper training program, but the right people. Repair personnel can't be part-timers and repair PC boards only one day a week or on a rotational basis with other duties. They should be dedicated to the repair operation and do nothing but repair. For challenging procedures to be done reliably, they must be done repeatedly. Furthermore, some repair skills are so specific that they should be limited to certain individuals who demonstrate an affinity for the job, rather than attempting to train a general number of persons to do the same difficult task. Considerable supervision is required during the basic phase of the training operation, with lots of individual help and attention. The key is not to attempt to move people too fast on the road to proficiency. It's a step-by-step approach. Regardless of who provides the training, you will find that the greatest cost and investment is in personnel. Personnel are key to the success of the whole operation. Repair skills training is available from Circuit Technology Center, Inc.. Three Skill Levels are referred to in this guidebook. The Skill Level recommended should be used as a guide only. I - Intermediate - Technician with skills in basic soldering and component rework but inexperienced in general repair/rework procedures. A - Advanced - Technician with soldering and component rework skills and exposure to most repair/rework procedures but lacking extensive experience. E - Expert - Technician with advanced soldering and component rework skills and extensive experience in most repair/rework procedures. 1.7 Tools and Materials Repair is and may always be a highly labor intensive operation relying more on individual operator skills than automation. Despite the availability of very good tools for repair, many in-house repair operations are poorly equipped. Here are a few guidelines for the basic equipment needed in an up-to-date repair operation. 1. Ergonomic Workstation Good repair work can't be done at an old workbench or makeshift setup. Performing PC board repair requires a high degree of concentration and dexterity. A proper workstation that is ESD grounded with proper lighting, outlets, and comfort is therefore essential. When possible, commonly used systems can be bolted to the work surface to improve efficiency. 2. High Quality Stereo Microscope Precision repair cannot be done without a microscope of this type available to the repair operation 100% of the time. Limited access will not do since it must be used constantly. Use of video cameras and monitors, although they may be fine for inspection or training, should be avoided. They cannot provide the clarity that quality optics offer. Also, the microscope needs a good light. Halogen, or fiber optic lighting systems with flexible goosenecks to direct the light are the best for this application.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
3. Soldering Precision soldering is vital to modern repair operations. Repair technicians can't get by with the traditional soldering tools that were commonly used as recently as a few years ago. They need the very best soldering irons that are highly controlled, ergonomically designed and feature a wide assortment of small tips. 4. Component Removal Tools Today's expanding variety of large and small components require an array of special use tools and methods for safe, efficient component removal. These tools generally use either conductive heating (by contact), convective heating (by hot gas) or infrared heating (by focused infrared lamps). Each method has its own advantages and disadvantages depending on the particular application. 5. Preheating Station When possible, you should preheat the entire PC board before SMT component removal. Preheat minimizes thermal shock due to localized heating in the rework area, and speeds up the rework process. Most facilities have a curing/drying oven, but a preheating station for maintaining heat in addition to the oven is often necessary. A hotplate-style preheater or infrared heater will maintain the temperature of the board after it is taken out of the oven, or can heat the board up from ambient temperature. 6. Micro Drilling and Grinding Tool Bulky, hand-held drilling and grinding tools that have both the motor and power supply contained within the handpiece are difficult to manipulate for the kind of detailed work that is necessary in repair. The type needed is preferably a lightweight, high quality, dental style drilling tool. 7. Precision Drilling System Repair and rework projects often require the need to make precise holes, slots, grooves etc. Precision, accurate depth control and high speed are a must. The ideal system should have a base plate to pin PC boards in place and an optional microscope attachment. 8. Replacement Circuits and Pads Circuits and surface mount pads can be replaced using liquid epoxy, but liquid epoxy can be messy and unreliable when replacing fine pitch pads. Pads are available with a dry film adhesive on the back. These replacement pads and circuits are heat-bonded to the board surface, and are available in any pattern that you might need. 9. Gold Contact Plating System Plating gold edge contacts or any metal surface is a serious business. The chemicals used are hazardous and must be handled properly. The power applied to the plating surfaces must be controlled accurately to expect reliable results. A good plating systems should include the following: a DC power supply with voltage and current meters, plating anodes sized for gold edge contact plating, a solution tray to collect the solution runoff, a support for the PC board and a tray to hold and store the various chemicals safely.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
10. Epoxy Kits and Coloring Agents For many repair operations you need high strength, high temperature epoxies. You should select a two-part epoxy because they offer the high strength, thermal resistance and durability that one-part and quick-setting epoxies do not have. It is also important to have masks or coloring agents so that you can restore the cosmetic appearance of the board. It is best to cure the epoxies in an oven if possible. 11. Eyelets and Eyelet Press Solder plated copper eyelets and an eyelet press to repair damaged plated through holes is generally required. 1.8 How To Set Up An In-House PC Board Repair Department It's a fact that far more printed circuit assemblies are damaged during the manufacturing process than they are in the field. And even though PC boards are more complex today than ever before, they are still repairable. Ten years ago boards were much simpler, and repairs were easy; but the assemblies also cost a great deal less. Today's printed circuit manufacturers and assemblers are driven by simple economics. They must repair damaged circuit boards. The primary question is whether to develop and maintain a full repair department in-house, or to contract the repair out. Which choice makes the most sense? Repair encompasses much more than simply rework, i.e. removing/reattaching components. You must be prepared to make a real commitment in several key areas if you plan to complete repair work in-house. If not, you are better off contracting the work out to a reputable repair facility. In reality, more damage can be done to a board from a botched repair than from most other causes. Aside from soldering and desoldering, other aspects of repair can include replacing damaged circuits, gold contacts, and SMT pads; re-plating solder-contaminated gold contacts, repairing burns or physical damage to the laminate, repair of through-holes, and more. Both contract manufacturers and OEMs will benefit from establishing a good in-house repair operation. Five Keys to Reliability There are five basic requirements needed for successful implementation of a high quality PC board repair department: 1. Documented Standards 2. Documented Procedures 3. Comprehensive training 4. Modern, Up-To-Date Equipment 5. Highly Skilled Technicians 1. Documented Standards The key starting point, of course, is a good set of documented standards. Standards will establish which types of defects are acceptable as is, and which are not. Although most major manufacturers have their own set of acceptance standards, the small manufacturer can obtain commercially-available guidelines, in particular from the IPC. Specific documents include IPC A-600 and A-610. A good working knowledge of these standards can prevent unnecessary repair. 2. Documented Procedures Every repair operation, whether it be replacing a pad or re-plating a gold contact, requires a specific set of procedures. The goal of this book is to provide you with a detailed
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
explanation of each procedure. If you need more information, an excellent additional reference source is the IPC's publication IPC-R-700. This IPC publication, along with this Guidebook, should be an integral part of your repair department and can serve as a tool for training repair personnel. To obtain copies of these publications, contact the Institute for Interconnecting and Packaging Electronic Circuits (IPC) in Northbrook, IL. Copies can also be obtained from Circuit Technology Center, Inc.. Once you know what can be repaired and have the necessary guidance to proceed, the next step is completing the repair, and that requires qualified personnel. Of course, even the most highly skilled technicians require training if they are to perform their best. 3. Comprehensive Training Repair personnel can't be part-timers and repair only one day a week or on a rotational basis with other duties. They should be dedicated exclusively to the repair operation. The reason for this is to develop a high level of skill and maintain it through repetition. For many challenging aspects of repair to be done reliably, they must be done repeatedly, such as the replacement of fine-pitch surface mount pads. Furthermore, some repair skills are so specific that they should be limited to certain individuals who demonstrate an affinity for the job, rather than attempting to train a general number of persons to do the same difficult task. Considerable supervision is required during the basic phase of the training operation, with lots of individual help and attention. The key is not to attempt to move people too fast on the road to proficiency. It's a step-by-step approach. Other companies may do it differently, but this is our method. Regardless of who provides the training, you will find that the greatest cost and investment is in personnel. Personnel are key to the success of the whole operation. Equipment costs are actually quite low in comparison. Why? 4. Modern, Up-To-Date Equipment Repair is and may always be a highly labor intensive operation relying more on individual operator skills than automation. Despite the availability of very good tools for repair, many in-house repair operations are poorly equipped. 5. Highly Skilled Technicians In the PC board manufacturing and assembly environment, most processes are tightly controlled and one-directional. The technicians who run these processes have certain defined characteristics and training. As you look deeper into the repair operation, the first thing that becomes apparent is that an entirely different set of skills are needed by repair personnel compared to assembly personnel. Repair skills are more specific. They require a higher degree of manual dexterity, patience, and a thorough understanding of the repair process. There are more steps involved in any single repair operation than the typical assembly technician would be confronted with. It becomes a personnel issue as well as a training one. You must not only have the proper training program, but the right people.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.1
Revision C x Page 1 of 2
Figure 2: Handle components by edges to prevent contaminating leads with skin oil.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.1
Revision C x Page 2 of 2
8. Components should be handled by the edges when possible. Avoid touching the component leads. (See Figure 2). 9. Hand creams and lotions containing silicone must not be used since they can cause solderability and epoxy adhesion problems. Lotions specifically formulated to prevent contamination of PC boards are available. 10. Stacking of PC boards and assemblies should be avoided to prevent physical damage. Special racks and trays are provided for handling.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
Cleaning
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: High OUTLINE Surface contaminants can significantly effect soldering, bonding, coating and the electrical characteristics of printed board and assemblies. This procedure outlines the cleaning methods for PC boards and assemblies.
No. 2.2
Revision C x Page 1 of 2
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies NASCWPNS Final report for NON-ODS cleaning of electronics and avionics report of October 1, 1995. LIMITATIONS 1. The ability of solvent based cleaning solutions to remove flux residue containing polyglycols should be assessed since not all solvent based cleaning solutions will remove polyglycols. 2. A deionized water rinse should follow IPA/DI cleaning except that a water rinse for double sided PC boards with plated through holes may not be required. 3. Potable (drinking) water should not be used as a final rinse due to the potential of contaminating the PC board assembly with chlorine, fluorine and halides. 4. When automated cleaning is used for assemblies that have been conformally coated, it is important that the cleaning process is compatible with the type of coating used and with any unsealed components. The coating should be checked to ensure that the coating will not be degraded by the cleaning process. TOOLS & MATERIALS Black Light Brush Cleaner, Aqueous or Semi-Aqueous Containers Gloves Isopropyl Alcohol (IPA) Oven Wipes PROCEDURE CAUTION Use clean gloves during this entire operation.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
Cleaning
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: High NOTE To reduce solvent volumes, mixtures of IPA with water and IPA with solvent are available in pressurized containers. The propellants are HFCs. Theses containers may be fitted with a bristle brush spray attachments for additional cleaning action. 1. Clean the board in an Aqueous or Semi-Aqueous cleaner, or pour approximately 10 ml per 4 square inches of effected area. 2. Scrub the board vigorously with a continually wet soft bristle brush for 10 seconds. 3. Rinse the area with 10 ml per 4 square inches of clean Isopropyl Alcohol to effectively remove all potentially harmful residues. 4. Handle the board by the edges and blot the excess Isopropyl Alcohol with clean, lint free cloth. 5. Examine board visually for cleanliness. The use of a black light will help detect contaminants that will fluoresce. 6. Dry boards in oven, if desired. 7. If the boards or assemblies are to be stored before use or coating, remove them from the oven and allow to cool until they can be handled. Place the boards or assemblies into self sealing bags with packages of desiccant. EVALUATION 1. Visually examine and test for cleanliness using IPC-TM-650, test method 2.3.25 or 2.3.26
No. 2.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.1
Revision C x Page 1 of 4
Wood Stick
PROCEDURE To determine the appropriate coating removal procedure the coating must first be identified. During original manufacture the specific coating is usually known. Consequently, the coating removal methods can usually be specified and based on the known coatings being used. When identification of the coating is not available, simple observation and testing will help identify the coating characteristics so that the proper removal procedure can be specified. NOTE The generic or commercial identification of the coating material is not necessary to accomplish coating removal. 1. Hardness Penetration test in a non-critical area to determine relative hardness. The harder the coating the more suitable to pure abrasive techniques. The softer and gummier the coatings the more suitable to the brushing removal procedures. CAUTION Abrasion operations can generate electrostatic charges.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.1
Revision C x Page 2 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.1
Revision C x Page 3 of 4
Table 2 Conformal Coating Removal Methods Removal Method Conformal Coating Paraxylyene Epoxy Acrylic Polyurethane Silicone Thin Silicone Thick 1 3 1 1 2.3.2 Solvent Method 2.3.3 Peeling Method 2.3.4 Thermal Method 1 1 2 1 2 2.3.5 Grinding Scraping Method 2 2 3 2 3 2 2.3.6 Micro Blasting Method 3 3 4 4 4
NOTE The preferred order for applying individual removal methods to specific coatings is numerically indicated. These removal methods are listed in ascending order.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.1
Revision C x Page 4 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.2
Revision D - Page 1 of 2
Figure 1: Apply High Temperature Tape to outline area for coating removal.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.2
Revision D - Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.3
Revision D x Page 1 of 1
Figure 1: Slit and peel off coating using a knife or heated blade.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.4
Revision D x Page 1 of 2
Figure 1: Lightly apply thermal tip to coating to soften or granulate the material.
Figure 2: Apply hot air to the work area and use a wood stick to remove the overcured coating.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.4
Revision D x Page 2 of 2
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.5
Revision D x Page 1 of 2
Figure 1: Scrape away damaged or unwanted coating with the Precision Knife or Scraper.
Figure 2: Rubberized abrasives are best used to remove thin, hard coatings.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.5
Revision D x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.3.6
Revision D x Page 1 of 1
Figure 1: Apply High Temperature Tape to outline area for coating removal.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.4.1
Revision D x Page 1 of 1
Figure 1: For large surfaces, apply the replacement coating with a foam swab to create a texture.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.4.2
Revision D x Page 1 of 1
Figure 1: For large surfaces, apply the replacement coating with a foam swab to create a texture.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.5
Revision D x Page 1 of 1
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.6.1
Revision C x Page 1 of 1
Damaged Legend
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.6.2
Revision C x Page 1 of 1
Damaged Legend
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.6.3
Revision C x Page 1 of 1
Damaged Legend
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.7
Revision C x Page 1 of 2
Figure 1: For prepackaged epoxy, remove divider clip and mix resin and hardener inside package.
Figure 2: Apply epoxy as needed. Foam swabs may be used to add texture for soldermask repair.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 2.7
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.1
Revision C x Page 1 of 2
Delamination
Figure 1: Drill into the delamination blister using a ball mill and a MicroDrill.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.1
Revision C x Page 2 of 2
CAUTION Exercise care to prevent bubbles in the epoxy mixture. 5. Pour the epoxy into the epoxy cartridge. 6. Inject the epoxy into one of the holes in the delamination. (See Figure 2). The heat retained in the PC board will improve the flow characteristics of the epoxy and will draw the epoxy into the void area filling it completely. 7. If the void does not fill completely, the following procedures may be used: A. Apply light local pressure on the board surface starting at the fill hole, slowly proceeding to the vent hole. B. Apply vacuum to the vent hole to draw the epoxy through the void. 8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. 9. Scrape away any excess epoxy using the Precision Knife or Scraper. NOTE If needed, apply additional thin coating to seal any scrapped areas. EVALUATION 1. Visual examination for texture and color match. 2. Electrical tests to conductors around the repaired area as applicable.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.2
Revision C x Page 1 of 2
NOTE Bow and twist should not be repaired unless sighted as a defect.
REFERENCES 1.0 Index 2.1 Handling Electronic Assemblies 2.5 Baking and Preheating
TOOLS & MATERIALS Base Plate Caliper or Pin Gauges Oven Restraint Bars Restraint Clamps
PROCEDURE 1. Check the deflection to determine if rework is needed. See Figure 1. NOTE Bow and twist after soldering shall not exceed 1.5% for through-hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties during placement, soldering and testing operations. Before dispositioning PC boards with bow and twist as scrap, keep in mind how the PC board is mounted in it's final destination. Keep in mind "form, fit and function" without jeopardizing reliability. 2. Place the restraint bars along the edges that require rework. (See Figure 2). CAUTION Components or parts that will interfere with the restraint bars should be removed. 3. If the PC board is warped along more than one edge or more than one plane, clamp the entire PC board to the base plate.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.2
Revision C x Page 2 of 2
EVALUATION 1. Check for marks or damage along edges. 2. Electrical tests as applicable.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.3.1
Revision C x Page 1 of 2
Figure 1: Mill away damaged material with the Micro-Drill and ball mill.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.3.1
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.3.2
Revision C x Page 1 of 2
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.3.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.4.1
Revision C x Page 1 of 2
Damaged Key Slot REFERENCES 1.0 2.1 2.2 2.5 2.7 Foreword Handling Electronic Assemblies Cleaning Baking and Preheating Epoxy Mixing and Handling
TOOLS & MATERIALS Ball Mill Cleaner Color Agent Epoxy Micro-Drill Mixing Sticks Oven Precision Knife Scraper Tape, High Temperature Wipes PROCEDURE 1. Clean the area to be filled, including the edges. 2. Mill away the damaged board base material using a Micro Drill System and ball mill. All damaged base board material must be removed. No fibers of laminate material should be exposed at the surface of the keyslot. (See Figure 1). NOTE To clearly see that all damaged material has been removed, flood the area with alcohol or solvent. Damaged internal fibers of the base material will show up clearly. CAUTION Abrasion operations can generate electrostatic charges. 3. Remove all loose material and clean the area.
Figure 1: Mill away the damaged board base material using the Micro-Drill System and ball mill.
Figure 2: Apply epoxy to the edges of the key slot using a mixing stick sharpened at the end.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.4.1
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.4.2
Revision C x Page 1 of 2
Figure 1: Mill out the damaged area using a milling machine or Precision Drill System.
Figure 2: Cut a groove into both sides of the key slot using the Micro-Drill System and carbide saw.
Figure 3: Machine a tongue onto both sides of the replacement base material.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.4.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.1
Revision C x Page 1 of 3
Figure 1: Scrape away damaged base board material with a Precision Knife.
Figure 3: An undercut, to enhance mechanical strength, may be desired for class 3 product.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.1
Revision C x Page 2 of 3
Figure 4: Apply the epoxy with a mixing stick sharpened at the end.
Figure 5: For large areas, apply the epoxy with a foam swab to create a texture in the surface.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.1
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.2
Revision C x Page 1 of 2
Figure 1: Mill away the damaged base material using the Micro-Drill System and ball mill.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.2
Revision C x Page 2 of 2
Figure 4: Mill a step onto the edge of the replacement base material.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 3.5.3
Revision C x Page 1 of 2
Figure 1: Cut away damaged base material with the Saw or milling cutter.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
Figure 3: Mill a tongue onto the edge of the replacement base material.
No. 3.5.3
Revision C x Page 2 of 2
Figure 4: Check fit of new base material. The tongue must mate with the groove in PC board.
Figure 6: Complete by drilling holes, slots, etc. or adding circuitry and solder mask as required.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.1.1
Revision C x Page 1 of 2
Lifted Conductor
Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.1.1
Revision C x Page 2 of 2
8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. CAUTION Some components may be sensitive to high temperature. 9. Apply surface coating to match prior coating as required. EVALUATION 1. Visual examination and tape (ANSI/IPC-FC-250A) test method 2.4.1. 2. Electrical tests as applicable.
test
per
IPC-TM-650
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.1.2
Revision C x Page 1 of 2
Lifted Conductor
Figure 1: Cut out a piece of dry film epoxy and place it under the lifted conductor.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.1.2
Revision C x Page 2 of 2
test
per
IPC-TM-650
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.1
Revision D x Page 1 of 3
Damaged Conductor
Figure 1: Scrape off any solder mask or coating from the ends of the remaining circuits.
Figure 2: Place the new Circuit Track in position and hold in place with tape.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.1
Revision D x Page 2 of 3
Figure 4: Wide circuits that cannot be easily formed may be folded over to produce a sharp bend.
Figure 5: Form the final shape of the Circuit Track then hold in place with tape while soldering.
NOTE The new circuit may be trimmed from copper sheet. 8. Gently abrade the top and bottom surface of the Circuit Track with a buffer to remove the protective coating. NOTE A thin protective coating is applied to the Circuit Track to prevent oxidation. 9. Clean the Circuit Track. 10. If needed, the ends of the Circuit Track may be tinned with solder prior to lap soldering it in place. 11. If the Circuit Track is long or has bends, one end may be soldered prior to forming the new shape. Place the Circuit Track in position. The Circuit Track should overlap the existing circuit a minimum of 2 times the circuit width. The Circuit Track may be held in place with Kapton tape. (See Figure 2). Figure 6: Coat the top and sides of the Circuit Track with epoxy.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.1
Revision D x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.2
Revision C x Page 1 of 3
Damaged Conductor
Figure 2: Sample frame or replacement conductors with dry film adhesive backing.
Figure 3: Scrape off epoxy bonding film from solder joint connection area on back of new conductor.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.2
Revision C x Page 2 of 3
Figure 4: Cut out the new circuit. Cut from the plated side.
Figure 6: Repair system used to thermally bond dry film adhesive backed replacement conductors.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.2
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.3
Revision C x Page 1 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.3
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.4
Revision C x Page 1 of 3
Damaged Conductor
Figure 1: Scrape off any solder mask or coating from the ends of the remaining circuits.
Figure 2: Lap solder the wire to one end of the circuit on the PC board surface.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.4
Revision C x Page 2 of 3
Figure 4: Form the final shape of the wire and solder in place.
Figure 5: Bond the wires to the surface with adhesive or Tape Dots.
When using solid wire to repair a conductor, there should be no reduction in the cross sectional area. 8. Strip the wire and tin the ends if needed. Non insulated wire may be used for short repairs if conductors are not crossed. 9. Clean the wire. 10. If the wire is long or has bends, one end may be soldered prior to forming the new shape. Place the wire in position. The wire should overlap the existing circuit a minimum of 2 times the circuit width. The wire may be held in place with Kapton tape during soldering. NOTE If the configuration permits, the overlap solder joint connection should be a minimum of 3.00 mm (0.125") from the related termination. This gap will minimize the possibility of simultaneous reflow during soldering operations. Refer to 7.1 Soldering Basics. 11. Apply a small amount of liquid flux to the overlap joint. 12. Lap solder the wire to one end of the circuit on the PC board surface. Make sure the wire is properly aligned. (See Figure 2). 13. Bend the wire as needed to match the shape of the missing circuit. (See Figure 3).
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.4
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.5
Revision C x Page 1 of 3
Damaged Conductor
Figure 1: Scrape off any solder mask or coating from the ends of the remaining circuits.
Figure 2: Drill through the board adjacent to both ends of the remaining circuits.
Figure 3: Bend the stripped wire over the prepared circuits in line with the circuits.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.5
Revision C x Page 2 of 3
Figure 4: Lap solder the wire to the circuits on the PC board surface.
When using solid wire to repair a conductor, there should be no reduction in the cross sectional area. 8. Strip the wire and tin the ends if needed. Non insulated wire may be used for short repairs if conductors are not crossed. 9. Clean the wire. 10. Drill through the board adjacent to both ends of the remaining circuits. Drill the hole slightly larger than the wire diameter to be used. (See Figure 2). CAUTION Review circuit diagrams to be sure no surface or internal circuits will be damaged or shorted. 11. Position the wire on the opposite side from the repair and insert the stripped ends into the drilled holes. 12. Bend the stripped wire over the prepared circuits in line with the circuits. The wire should overlap the existing circuit a minimum of 2 times the circuit width. (See Figure 3). NOTE If the configuration permits, the overlap solder joint connection should be a minimum of 3.00 mm (0.125") from the related termination. This gap will minimize the possibility of simultaneous reflow during soldering operations. Refer to 7.1 Soldering Basics. 13. Apply a small amount of liquid flux to the overlap joint.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.5
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.6
Revision D x Page 1 of 3
Figure 1: Milling into multilayer PC board to expose the damaged internal circuit.
Figure 2: A high quality, Micro-Drill System is recommended for this delicate operation.
Figure 3: Remove the remaining board material covering the internal circuit using the knife.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.6
Revision D x Page 2 of 3
Figure 5: If spacing is critical or the PC board uses high frequency circuits, bevel the joint as shown.
Figure 6: Coat the top and sides of the new circuit with epoxy. Add epoxy until flush with top surface.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.2.6
Revision D x Page 3 of 3
13. Clean the area. NOTE The PC Board may be preheated prior to filling the area with epoxy. A preheated PC Board will allow the epoxy to easily flow and level out. Epoxy applied to an unheated PC board may settle below the PC board surface as the epoxy cures. 14. Mix epoxy. If desired, add color agent to the mixed epoxy to match the PC board color. 15. Coat the top and sides of the replaced circuit with epoxy. The epoxy bonds the new circuit to the base board material and insulates the circuit. Continue adding epoxy up to the top surface of the PC board or to the height of the next internal circuit. (See Figure 6). NOTE A slight overfill of epoxy may be desired to allow for shrinkage when the epoxy cures. 16. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. CAUTION Some components may be sensitive to high temperature. 17. Add additional Circuit Tracks if needed and coat with additional epoxy. 18. Continue completing all layers until the top surface of the PC board is reached. (See Figure 7). 19. Clean the board as required. 20. Apply surface coating to match prior coating as required. EVALUATION 1. Visual examination for alignment and overlap of new circuit. 2. Visual examination of epoxy coating for texture and color match. 3. Electrical tests as applicable.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.1
Revision D x Page 1 of 2
Circuit Cut, Surface Circuit REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.7 Epoxy Mixing and Handling TOOLS AND MATERIALS Ball Mills Cleaner Color Agent Continuity Meter Epoxy Heat Lamp Micro-Drill System Microscope Oven Precision Knife Wipes PROCEDURE 1. Identify the circuit or short to be cut. Determine from the artwork or drawings where the best location is to make the break. The width of the break should at least match the minimum required electrical spacing. 2. Clean the area. 3. Carefully make two small cuts with the knife and remove the short section of circuit. (See Figure 1). OR 4. Select the appropriate size ball mill and insert it into the Micro-Drill System. Set the speed to high. (See Figure 2). The ball mill should be approximately the same width as the circuit to be cut. NOTE Ball mills should be dental grade carbide steel for precision cutting and long life. Figure 2: A high quality, Micro-Drill System is recommended for this delicate operation.
Figure 1: Option A - Make two small cuts with the knife and remove a short section of circuit.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.1
Revision D x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.2
Revision D x Page 1 of 2
Figure 1: Precision Drill System with base plate to pin PC board in position while cutting circuits.
Figure 2: Mill into PC board at proper coordinates to cut inner layer circuits as required.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
Figure 3: Fill the milled hole with epoxy up to and flush with the surface.
No. 4.3.2
Revision D x Page 2 of 2
Figure 4: Completed repair. 7. Check continuity to be sure that the circuit has been cut. 8. Mix epoxy. If desired, add color agent to the mixed epoxy to match the PC board color. 9. Fill the milled hole with epoxy up to and flush with the surface. An epoxy dispenser may be used to accurately control the application of epoxy. Remove any excess epoxy. (See Figure 3). CAUTION Examine milled hole to be sure all material is removed from the hole prior to filling the hole with epoxy. NOTE A slight overfill of epoxy may be desired to allow for shrinkage when epoxy cures. 10. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. EVALUATION 1. Visual examination of cuts for spacing, and unintended damage to surrounding circuits. 2. Electrical tests as applicable.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.3
Revision D x Page 1 of 2
Figure 1: Precision Drill System with base plate to pin PC board in position while drilling out plated hole.
Figure 2: Completely mill through the hole to isolate the internal connection(s).
Figure 3: Fill the hole with epoxy up to and flush with the surface.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.3
Revision D x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.4
Revision D x Page 1 of 2
Figure 1: Precision Drill System with base plate to pin PC board in position while cutting inner layers.
Figure 2: Internal view of plated through hole with inner layer spoke connections. .
Figure 3: Mill adjacent to the plated hole to sever internal spoke connections.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.3.4
Revision D x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.4.1
Revision C x Page 1 of 2
Lifted Land
Figure 1: Carefully apply a small amount of epoxy under the entire length of the lifted land.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.4.1
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.4.2
Revision C x Page 1 of 2
Lifted Land
Figure 1: Cut out the appropriate shape of Bonding Film material to match the area of the lifted land.
Figure 3: Bond the land down using a commercially available bonding system.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.4.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.1
Revision C x Page 1 of 3
Damaged Land
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking And Preheating 2.7 Epoxy Mixing and Handling TOOLS & MATERIALS Buffer Circuit Frames, Lands Cleaner Convection Oven Epoxy Flux, Liquid Heat Lamp Microscope Precision Knife Repair System or Repair Kit Scraper Solder Soldering Iron Tape, High Temperature Tweezers Wipes PROCEDURE 1. Clean the area.
Figure 1: Remove the defective land and remove soldermask from the connecting circuit.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.1
Revision C x Page 2 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.1
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.2
Revision C x Page 1 of 4
Damaged Land
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking And Preheating 2.7 Epoxy Mixing and Handling TOOLS & MATERIALS Bonding Iron Bonding Tips Bonding System Buffer Circuit Frames, Lands Cleaner Epoxy Flux, Liquid Heat Lamp Microscope Precision Knife Repair System Scraper Solder Soldering Iron Tape, High Temperature Tweezers Wipes
Figure 1: Remove the defective land and remove soldermask from the connecting circuit.
Figure 3: Scrape off the adhesive bonding film from solder joint area on the back of new land.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.2
Revision C x Page 2 of 4
Figure 4: Cut out the new land. Cut from the plated side.
Figure 5: Place the new land in place using High Temperature Tape.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.2
Revision C x Page 3 of 4
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.5.2
Revision C x Page 4 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.1
Revision C x Page 1 of 3
Figure 1: Remove the defective edge contact and remove solder mask from the connecting circuit.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.1
Revision C x Page 2 of 3
Figure 4: Place the new edge contact in place using Kapton tape.
Figure 5: File overhanging piece of new edge contact to blend with existing bevel.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.1
Revision C x Page 3 of 3
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.2
Revision C x Page 1 of 4
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking And Preheating 2.7 Epoxy Mixing and Handling Figure 1: Remove the defective edge contact and remove solder mask from the connecting circuit.
TOOLS & MATERIALS Bonding Iron Bonding Tip Bonding System Circuit Frames Cleaner Epoxy Finishing File Flux, Liquid Heat Lamp Microscope Oven Precision Knife Repair System Scraper Solder Soldering Iron Tape, High Temperature Tweezers Wipes
PROCEDURE 1. Clean the area. Figure 3: Scrape off the adhesive bonding film from the solder joint area on the back of new contact.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.2
Revision C x Page 2 of 4
Figure 4: Cut out the new edge contact. Cut from the plated side.
Figure 5: Place the new edge contact in place using Kapton tape.
Figure 7: File overhanging piece of the new edge contact to blend with existing bevel.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.2
Revision C x Page 3 of 4
Figure 9: Completed repair. 13. Position the PC board so that it is flat and stable. Gently place the hot bonding tip onto the tape covering the new edge contact. Apply pressure as recommended by the manufacturer. (See Figure 6). CAUTION Excessive bonding pressure may cause measling in the PC board surface or the new circuit to slide out of position. 14. After the bonding cycle remove the High Temperature Tape used for alignment. The new edge contact is fully cured. Carefully clean the area and inspect the new edge contact for proper alignment. 15. If the new edge contact has a connecting circuit apply a small amount of liquid flux to the lap solder joint connection area and solder the circuit from the new edge contact to the circuit on the PC board surface. Use minimal flux and solder to ensure a reliable connection. Tape may be placed over the top of the new edge contact to prevent excess solder overflow. NOTE If the configuration permits, the overlap solder joint connection should be a minimum of 3.00 mm (0.125") from the related termination. This gap will minimize the possibility of simultaneous reflow during soldering operations. Refer to 7.1 Soldering Basics. 16. Remove the High Temperature Tape and clean the area. 17. Trim the extending edge of the new edge contact with a file. File parallel to the beveled edge until the excess material has been removed. (See Figure 7). 18. If sealing the lap solder joint connection is required, mix epoxy and coat the lap solder joint connections. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. CAUTION Some components may be sensitive to high temperature. NOTE Additional epoxy can be applied around the perimeter of the new edge contact to provide additional bond strength.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.2
Revision C x Page 4 of 4
EVALUATION 1. Visual examination, measurement of new pad width and spacing. 2. Electrical continuity measurement.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 1 of 7
SAFETY A thorough review of this method should be made before repairs are attempted. Technicians should become familiar with the tools included and should practice on scrap PC boards To expect the best results a clean work environment is essential. A smooth work surface and good lighting are recommended. Safety glasses and safety gloves should always be worn when handling hazardous chemicals. The work area should be adequately ventilated. It is particularly important to have adequate ventilation when using gold solution, since gold solution contains a very small percentage of free cyanide. If ventilation is not adequate, use a fan to move fumes away from the operator. CAUTION It is essential to follow the manufacturer's instruction supplied with the plating equipment.
Figure 2: Flow solder over the entire surface of each contaminated contact.
Figure 3: Swab the contaminated area with solder stripping solution until all solder has been removed.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 2 of 7
TOOLS & MATERIALS Abrasive Pad Board Support Burnisher Cleaner Conductive Pen Connector Edge Plating System Desoldering Braid or Desoldering System Eraser Stick Flux, Liquid Gloves, Antistatic Peel Testing Tape Pin Fixtures Plating Anodes Plating Solution, Gold Plating Probe Plating Solution, Electroclean Plating Cables Plating Solution, Nickel Plating Solution, Solder Strip Plating Tape Power Supply Precision Knife Probe Clip Rinse Tray Rinse Bottle Safety Glasses Solder Iron Solder Solution Swab Solution Cups Solution Tray Tape, High Temperature Thickness Measuring System, Gold and Nickel Water/Air Sprayer Wipes Wire, Bus, 30 AWG Work Sink
Figure 4: Rinse the area with water. A water/air sprayer provides a full water flush.
Figure 5: Apply High Temperature Tape then solder a wire to the edge of the contacts needing plating.
Figure 6: Apply High Temperature Tape then apply conductive paint to the contacts that need plating.
PREPARATION - Remove Solder Contamination CAUTION Safety glasses and safety gloves should always be worn when handling hazardous chemicals. Do not work within a small enclosed room without supplemental ventilation. If ventilation is not adequate, use a fan to move fumes away from the operator. 1. Clean the rework area.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 3 of 7
Figure 8: Swab all the contacts by brushing the surface with the saturated plating probe.
PREPARATION - Remove Poor Plating or Surface Defects 1. Clean the rework area. 2. Apply plating tape to the PC board surface surrounding the area to be reworked. The plating tape will protect adjacent components and the PC board surface from unwanted exposure to stripping and plating solutions. 3. Clean the area. 4. Buff the contacts using an abrasive pad. Buff the contacts until all defective or poor plating is removed. 5. Burnish small scratches. Use the tip of the Tech-Pro Burnisher to work the copper material into the scratch and smooth out the area. Finish by mildly buffing the area to remove any minor burnishing marks. If there are large scratches the contact may need replacement. See Procedure Number 4.6.1 or 4.6.2. 6. Thoroughly rinse the entire area with water to remove any residue.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 4 of 7
BUSING - Wire Soldered to Edge (Option 1) CAUTION When finished, this method will leave a small unplated line along the inner tip of each contact. 1. Apply High Temperature Tape to all the contacts to be plated. The High Temperature Tape should cover the entire contact except for a small line along the inboard edge. The High Temperature Tape will prevent further solder contamination. 2. Solder a wire directly to the inboard tip or connecting circuit of each contact to be plated. The smallest amount of solder should be used to prevent further contamination. (See Figure 5). BUSING - Conductive Paint Applied to Edge (Option 2) CAUTION When finished, this method will leave a small unplated line along the inner tip of each contact. 1. Apply High Temperature Tape to all the contacts to be plated. The High Temperature Tape should cover the entire contact except for a small line along the inboard edge. The High Temperature Tape will prevent the conductive paint from contaminating the contact surface. 2. Apply a thin coating of conductive paint directly to the inboard tip of each contact to be plated. The conductive paint should extend out to one edge so that a clip can be applied to make electrical connection. (See Figure 6). BUSING - Mechanical Probe, Individual Contacts (Option 3) 1. Each contact needing plating can be individually probed using the plating probe. Touch the tip of the plating probe to the inboard edge of each contact or to the connecting circuit as each solution is applied during the plating process.
BUSING - Pin Fixture, Multiple Contacts (Option 4) 1. Make a mechanical connection to each contact using a pin fixture. The pin fixture has spring loaded contact pins on centers matching the spacing of the edge contacts to be plated. The contact pins make direct mechanical connection to the inboard tip of each
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 5 of 7
PROCEDURE - Plating Process 1. Place the PC board on the board support so that the leading edge overhangs the rinse tray. 2. Make the cathode connection (-) to the PC board by using a plating probe or probe clip. Connect the probe clip directly to the wire bus connection or to the edge where conductive paint has been applied. The cable should be connected to the (-) or black jack on the power supply. 3. Connect the plating probe to the power supply (+) or red jack. (See Figure 7). 4. Set the output current on the power supply to setting recommended by the equipment manufacturer. Refer to Table 1 for general voltage/time settings. 5. Dip the plating probe into the electroclean plating solution. Wait a few seconds for the solution to saturate the absorbent wrapping. 6. Swab the entire surface to be plated by brushing the surface with the saturated plating probe. The plating probe should be moved back and forth briskly to prevent burning and to provide even coverage. (See Figure 8) Swab the area for the time recommended by the equipment manufacturer. Refer to Table 1 for general voltage/time settings. 7. Thoroughly rinse the entire area with water. Any burning or darkening of the contacts may be removed with an abrasive pad. Saturate the abrasive pad and the PC board surface with water and lightly buff the contacts until all evidence of the burning or discoloring is removed. Rinse the entire area with water. CAUTION Do not allow the rework area to dry out between steps. The water coating prevents oxidation. 8. Connect the nickel plating probe to the power supply (+) or red jack. 9. Set the output current on the power supply to setting recommended by the equipment manufacturer. Refer to Table 1 for general voltage/time settings. 10. Dip the plating probe into the nickel plating solution. Wait a few seconds for the solution to saturate the absorbent wrapping. 11. Swab the entire surface to be plated by brushing the surface with the saturated plating probe. The plating probe should be moved back and forth briskly to prevent burning and to provide even coverage. Swab the area for the time recommended by the equipment
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 6 of 7
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.6.3
Revision D x Page 7 of 7
Nickel
Gold
Volts
10.0 VDC 10.0 VDC 10.0 VDC 10.0 VDC 10.0 VDC 10.0 VDC 10.0 VDC 10.0 VDC
Time
5 sec. 5 sec. 5 sec. 10 sec. 10 sec. 10 sec. 20 sec. 20 sec. 20 sec. 30 sec. 30 sec. 30 sec.
Volts
4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 5.0 VDC 6.0 VDC 6.0 VDC 6.0 VDC 6.0 VDC
Time
10 sec. 30 sec. 1.0 min. 2.0 min. 2.5 min. 3.0 min. 4.0 min. 5.0 min. 6.0 min. 7.0 min. 7.5 min. 8.0 min.
Volts
3.0 VDC 3.5 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC 4.0 VDC
Time
10 sec. 20 sec. 30 sec. 1.0 min. 1.5 min. 2.0 min. 2.5 min. 3.0 min. 3.5 min. 4.0 min. 4.5 min. 5.0 min.
.01 - .05 in .10 - .20 in .20 - .30 in .30 - .40 in .50 - .60 in .60 - .70 in .80 - .90 in
Notes: 1. Surface Area is the total area being plated during each swab plating operation. 2. Voltage and Time setting shown in Table 1 are for a minimum of .000100" Nickel and .000050" Gold. 3. Setting are a guide, for precise thickness requirements the final thickness should be verified with proper measuring equipment.
EVALUATION 1. The rework area should be checked by measuring the thickness of the nickel and gold to make sure they meet the minimum thickness requirement. 2. The plating bond may also be checked by doing a peel test using peel testing tape. 3. Visually examine the rework area for color and luster.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.1
Revision D x Page 1 of 3
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking And Preheating 2.7 Epoxy Mixing and Handling Figure 1: Remove the defective pad and remove soldermask from the connecting circuit.
TOOLS & MATERIALS Buffer Circuit Frames, Pads Cleaner Epoxy Flux, Liquid Heat Lamp Microscope Oven Precision Knife Scraper Solder Soldering Iron Tape, High Temperature Tweezers Wipes
Figure 2: Select a commercially available replacement pad that matches the missing pad.
PROCEDURE 1. Clean the area. 2. Remove the defective pad and a short length of the connecting circuit. (See Figure 1). 3. Use knife and scrape off any epoxy residue, contamination or burned material from the board surface. CAUTION Abrasion operations can generate electrostatic charges.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.1
Revision D x Page 2 of 3
Figure 4: Place the new surface mount pad in place using High Temperature Tape.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.1
Revision D x Page 3 of 3
EVALUATION 1. Visual examination 2. Measurement of new pad width and spacing. 3. Electrical continuity measurement.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.2
Revision C x Page 1 of 3
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 2.7 Epoxy Mixing and Handling Figure 1: Remove the defective pad and remove soldermask from the connecting circuit.
TOOLS & MATERIALS Bonding Iron Bonding Tips Bonding System Circuit Frames, Surface Mount Pads Cleaner Epoxy Flux, Liquid Heat Lamp Microscope Oven Precision Knife Repair System or Repair Kit Scraper Solder Soldering Iron Tape, High Temperature Tweezers Wipes
PROCEDURE 1. Clean the area. 2. Remove the defective pad and a short length of the connecting circuit. (See Figure 1). Figure 3: Scrape off the adhesive bonding film from the solder joint area on the back of new pad.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.2
Revision C x Page 2 of 3
Figure 4: Cut out the new surface mount pad. Cut from the plated side.
Figure 5: Place the new surface mount pad in place using High Temperature Tape.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 4.7.2
Revision C x Page 3 of 3
EVALUATION 1. Visual examination 2. Measurement of new pad width and spacing. 3. Electrical continuity measurement.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.1
Revision C x Page 1 of 3
Damaged Plated Hole REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning
TOOLS & MATERIALS Ball Mill Caliper Gauges Cleaner Eyelet Press System Eyelet Kit Eyelets , Funnel Flange, Various Sizes Eyelets , Flat Flange, Various Sizes Flux, Liquid Micro-Drill System Microscope Pin Gauges Precision Knife Setting Form Tool, Various Sizes Setting Anvil, Various Sizes Solder Iron Solder Wipes
Figure 1: Drill out the hole using a Micro-Drill System and ball mill.
Figure 2: The eyelet flange can be used to secure a new circuit in place.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.1
Revision C x Page 2 of 3
ID
OD
FD
ID
LUF
Figure 4: Completed repair.
Inside Diameter The eyelet inside diameter should be a .075 - .500 mm (.003"-.020") greater than the component lead diameter. Length Under Flange The length of the eyelet barrel under the flange should be .630 .890 mm (.025" - 035") greater than the thickness of the PC board. This added length allows for proper protrusion when setting the eyelet. Flange Diameter The eyelet flange diameter should be small enough to prevent interference with adjacent pads or circuits. Outside Diameter The clearance hole should allow the eyelet to be inserted without force but should not exceed .125 mm (.005") greater than the eyelet outside diameter.
LUF
FD
OD
NOTE Be sure to select an eyelet meeting the proper criteria. An eyelet with an oversize flange may interfere with adjacent circuits. An eyelet that is too short will not protrude through the PC board for proper setting.
PROCEDURE 1. Clean the area. 2. Select an eyelet using the Eyelet Selection Criteria. Use a pin gauge and caliper to measure the existing plated hole dimensions. 3. Insert the appropriate ball mill into the Micro-Drill System. Drill out the hole removing all the plating. The drilled hole should be .025 .125 mm (.001" - .005") larger than the eyelet O.D. (See Figure 1). CAUTION This procedure may isolate internal connections on multilayer PC boards. 4. Clean the area.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.1
Revision C x Page 3 of 3
EVALUATION 1. Visual examination, dimensional requirement of pad diameter and inside diameter. 2. Electrical continuity measurement.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.2
Revision D x Page 1 of 3
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
No. 5.2
Revision D x Page 2 of 3
ID
OD
FD
ID
LUF
Inside Diameter The eyelet inside diameter should be a .075 - .500 mm (.003"-.020") greater than the component lead diameter. Length Under Flange The length of the eyelet barrel under the flange should be .630 .890 mm (.025" - 035") greater than the thickness of the PC board. This added length allows for proper protrusion when setting the eyelet. Flange Diameter The eyelet flange diameter should be small enough to prevent interference with adjacent pads or circuits. Outside Diameter The clearance hole should allow the eyelet to be inserted without force but should not exceed .125 mm (.005") greater than the eyelet outside diameter.
LUF
FD
OD
NOTE Be sure to select an eyelet meeting the proper criteria. An eyelet with an oversize flange may interfere with adjacent circuits. An eyelet that is too short will not protrude through the PC board for proper setting. PROCEDURE 1. Clean the area. 2. Examine the hole to ensure that there is no damage to the wall of the hole. Check continuity to establish the integrity of the connection.
3. Select an eyelet using the Eyelet Selection Criteria. Use a pin gauge and caliper to measure the existing plated hole dimensions. The eyelet must have an inside diameter sufficient to receive the component lead and an outside diameter that will allow the eyelet to be inserted into the hole without force. 4. Remove oxides from the surface pads where the eyelet is to be installed using a buffer and clean.
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
No. 5.2
Revision D x Page 3 of 3
9. Apply firm even pressure to form the eyelet barrel. 10. Apply a small amount of liquid flux and solder the eyelet flanges to the pads on the PC board surface if necessary. Clean the area. Inspect for good solder flow and wetting around the eyelet flanges and lands. 11. Clean the area. 12. Install the component lead and solder, if required. EVALUATION 1. Visual examination, dimensional requirement of pad diameter and inside diameter. 2. Electrical continuity measurement.
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
No. 5.3
Revision C x Page 1 of 4
Figure 3: Solder the eyelet barrel to the exposed inner layer signal or plane.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.3
Revision C x Page 2 of 4
ID
OD
FD
ID
LUF
Inside Diameter The eyelet inside diameter should be a .075 - .500 mm (.003"-.020") greater than the component lead diameter. Length Under Flange The length of the eyelet barrel under the flange should be .630 .890 mm (.025" - 035") greater than the thickness of the PC board. This added length allows for proper protrusion when setting the eyelet. Flange Diameter The eyelet flange diameter should be small enough to prevent interference with adjacent pads or circuits. Outside Diameter The clearance hole drilled through the PC board should allow the eyelet to be inserted without force but should not exceed .125 mm (.005") greater than the eyelet outside diameter.
Figure 4: Fill the milled hole with the epoxy up to, and level with, the surface of the board.
LUF
FD
OD
NOTE Be sure to select an eyelet meeting the proper criteria. An eyelet with an oversize flange may interfere with adjacent circuits. An eyelet that is too short will not protrude through the PC board for proper setting. PROCEDURE 1. Clean the area. 2. Select an eyelet using the Eyelet Selection Criteria. Use a pin gauge and caliper to measure the existing plated hole dimensions. 3. Pin the PC board to the base of the Precision Drill System. (See Figure 1). 4. Insert the appropriate ball mill, end mill or drill into the chuck of the drill press. 5. Mill or drill out the hole. The drilled hole should be approximately .030 mm (0.001") larger than the eyelet O.D. Inspect to ensure no metallic particles or burrs remain.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.3
Revision C x Page 3 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 5.3
Revision C x Page 4 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 6.1
Revision C x Page 1 of 6
Jumper Wires
Figure 1: Wires may be held in place with Tape Dots for a quick neat job.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 6.1
Revision C x Page 2 of 6
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 6.1
Revision C x Page 3 of 6
1997
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No. 6.1
Revision C x Page 4 of 6
NOTE The strip length may be adjusted depending on the termination. Stripping insulating material from jumper wires should always be done with a qualified strip tool. 3. If required, add liquid flux to the stripped ends and tin with solder. Clean the wire ends. JUMPER WIRE TERMINATIONS Lap Soldered to Component Leads or Surface Conductors 1. Form the wire as needed and place the wire in position depending on the termination type. Center the wire on the component lead or pad, do not overhang sides. NOTE Make sure the solder joint length and insulation gap spacing will meet the acceptability requirements. 2. Bend the wire as needed and run the wire along PC board surface. NOTE Wires may run over component body only when approved. More than 1 wire may be soldered at each termination, but wires shall not overhang the edges. 3. Apply flux and solder one end of the wire. After terminating the wire, clean the area. CAUTION The insulation shall not be stripped back more than 2 wire diameters from the solder joint. Wire insulation may touch but not penetrate the solder joint. 4. After routing the jumper wire, solder the opposite end. CAUTION Wires soldered to lifted or clipped components leads may require insulation to prevent shorting.
1997
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No. 6.1
Revision C x Page 5 of 6
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No. 6.1
Revision C x Page 6 of 6
Table 2 - Wire Bend Radius Specifications Preferred Bend Radius 4X Diameter 10X Diameter 10X Diameter 10X Diameter 10X Diameter 10X Diameter Minimum Bend Radius 2X Diameter 3X Diameter 3X Diameter 5X Diameter 5X Diameter 8X Diameter
Wire Type Individual Solid Wire Individual Stranded Wire Unsleeved Harness Wire Sleeved Harness Wire Multi-conductor Cable Single Conductor Shield or Coaxial Cable
JUMPER WIRE BONDING After the wire has been soldered to both ends and routed, the wire should be bonded to the PC Board surface. NOTE Jumper wire should be bonded to the PC Board surface within 6.0 mm (0.25") of the solder joints, within 6.0 mm (0.25") of each bend and at intervals of not less than 25 mm (1.0") on straight wire runs. Jumper wires should be bonded using one of the following methods. A. Tape Dots (See Figure 1) B. Hot Melt Glue C. Quick Set Adhesive.
1997
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No. 6.2
Revision C x Page 1 of 2
OUTLINE This procedure covers the specific application of jumper wires to through hole components. Refer to procedure 6.1 Jumper Wire Basics for detailed information about, Tools and Materials, General Rules, PC Board Preparation, Jumper Wire Selection, Jumper Wire Preparation, Jumper Wire Termination, Jumper Wire Routing and Jumper Wire Bonding. REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 6.1 Jumper Wire Basics 7.1 Soldering Basics
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
No. 6.2
Revision C x Page 2 of 2
Figure PLP1 PTH Lead - Preferred Wire soldered into plated through hole on component side.
Figure PLP2 PTH Lead - Preferred Wire soldered parallel to component lead on component side.
Figure PLA1 PTH Lead - Acceptable Wire soldered into plated through hole on solder side.
Figure PLA2 PTH Lead - Acceptable Wire wrapped around component lead on solder side.
Figure PLA3 PTH Lead - Acceptable Wire wrapped around component lead on component side.
Figure PLA4 PTH Lead - Acceptable Wire soldered to lifted component lead.
Figure PLA5 PTH Lead - Acceptable Wire soldered to clipped component lead on component side.
Figure PLA5 PTH Lead - Acceptable Wire looped and soldered to adjacent component leads.
Figure PLN1 PTH Lead - Not Recommended Wire soldered to component lead, wire running over component.
Figure PLN2 PTH Lead - Not Recommended Wire soldered perpendicular to component lead.
Figure PLN3 PTH - Not Recommended Multiple wires soldered to component lead overhanging edge.
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
No. 6.3
Revision C x Page 1 of 3
OUTLINE This procedure covers the specific application of jumper wires to chip components, pads and conductors. Refer to procedure 6.1 Jumper Wire Basics for detailed information about, Tools and Materials, General Rules, PC Board Preparation, Jumper Wire Selection, Jumper Wire Preparation, Jumper Wire Termination, Jumper Wire Routing and Jumper Wire Bonding. REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 6.1 Jumper Wire Basics 7.1 Soldering Basics
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No. 6.3
Revision C x Page 2 of 3
Figure CHP1 Chip Component - Preferred Wire soldered to pad, parallel or perpendicular to component.
Figure CHA1 Chip Component - Acceptable Wire soldered parallel or perpendicular to component lead.
Figure CHA2 J Lead - Acceptable Wire soldered to component end, lifted off pad.
Figure CHN1 J Lead - Not Recommended Multiple wires soldered to component end overhanging edge
1997
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No. 6.3
Revision C x Page 3 of 3
Figure PPP1 Plated Hole - Preferred Wire soldered into plated through hole.
Figure COP1 Conductor - Preferred Wire soldered parallel to conductor, contact, SMT pad.
Figure PPA1 Plated Hole - Acceptable Wire soldered across top of PTH pad.
Figure PPN1 Plated Hole-Not Recommended Multiple wires soldered to pad overhanging pad edge.
Figure CON1 Conductor - Not Recommended Wire soldered perpendicular to conductor, contact, SMT pad.
Figure CON2 Conductor- Not Recommended Multiple wires soldered to conductor, contact, SMT pad.
1997
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No. 6.4
Revision C x Page 1 of 2
OUTLINE This procedure covers the specific application of jumper wires to J lead components. Refer to procedure 6.1 Jumper Wire Basics for detailed information about, Tools and Materials, General Rules, PC Board Preparation, Jumper Wire Selection, Jumper Wire Preparation, Jumper Wire Termination, Jumper Wire Routing and Jumper Wire Bonding. REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 6.1 Jumper Wire Basics 7.1 Soldering Basics
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No. 6.4
Revision C x Page 2 of 2
Figure JLA2 J Lead - Acceptable Wire looped and soldered to adjacent component leads.
Figure JLN1 J Lead - Not Recommended Wire soldered to component lead, wire running over component.
Figure JLN2 J Lead - Not Recommended Wire soldered perpendicular to component lead.
Figure JLN3 J Lead - Not Recommended Multiple wires soldered to component lead overhanging edge.
Figure JLN4 J Lead - Not Recommended Wire soldered to lifted component lead.
1997
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No. 6.5
Revision C x Page 1 of 2
OUTLINE This procedure covers the specific application of jumper wires to gull wing components. Refer to procedure 6.1 Jumper Wire Basics for detailed information about, Tools and Materials, General Rules, PC Board Preparation, Jumper Wire Selection, Jumper Wire Preparation, Jumper Wire Termination, Jumper Wire Routing and Jumper Wire Bonding. REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 6.1 Jumper Wire Basics 7.1 Soldering Basics
1997
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No. 6.5
Revision C x Page 2 of 2
Figure GWP1 Gull Wing - Preferred Wire soldered parallel to component lead.
Figure GWA1 Gull Wing - Acceptable Wire soldered to lifted component lead.
Figure GWA2 Gull Wing - Acceptable Wire soldered to clipped component lead.
Figure GWA3 Gull Wing - Acceptable Wire looped and soldered to adjacent component leads.
Figure GWN1 Gull Wing - Not Recommended Wire soldered to component lead, wire running over component.
Figure GWN2 Gull Wing - Not Recommended Wire soldered perpendicular to component lead.
Figure GWN3 Gull Wing - Not Recommended Multiple wires soldered to component lead overhanging edge.
1997
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Soldering Basics
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: N/A OUTLINE This procedure covers the basic concepts for high quality soldering. REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 7.1.2 Preparation For Soldering 8.1.1 Preparation For Component Removal SOLDERING PROCESS Soldering is the process of joining two metals by the use of a solder alloy, and it is one of the oldest known joining techniques. Faulty solder joints remain one of the major causes of equipment failure and thus the importance of high standards of workmanship in soldering cannot be overemphasized. The following material covers basic soldering procedures and has been designed to provide the fundamental knowledge needed to complete the majority of high reliability hand soldering and component removal operations. PROPERTIES OF SOLDER Solder used for electronics is a metal alloy, made by combining tin and lead in different proportions. You can usually find these proportions marked on the various types of solder available. With most tin/lead solder combinations, melting does not take place all at once. Fifty-fifty solder begins to melt at 183C (361F), but it's not fully melted until the temperature reaches 216C (420F). Between these two temperatures, the solder exists in a plastic or semi-liquid state.
7.1.1
Revision C x Page 1 of 4
Figure 1: Wetting is when molten solder penetrates a copper surface, forming an intermetallic bond.
Figure 2: Minimal thermal linkage due to insufficient solder between the pad and soldering iron tip.
The plastic range of a solder varies, depending upon the ratio of tin to lead. With 60/40 solder, the range is much smaller than it is for 50/50 solder. The 63/37 ratio, known as eutectic solder has practically no plastic range, and melts almost instantly at 183C (361F). The solders most commonly used for hand soldering in electronics are the 60/40 type and the 63/37 type. Due to the plastic range of the 60/40 type, you need to be careful not to move any elements of the joint during the cool down period. Movement may cause what is known as disturbed joint. A disturbed joint has a rough, irregular appearance and looks dull instead of bright and shiny. A disturbed solder joint may be unreliable and may require rework. WETTING ACTION When the hot solder comes in contact with a copper surface, a metal solvent action takes place. The solder dissolves and penetrates the copper surface. The molecules of solder and copper blend to form a new alloy, one that's part copper and part solder. This solvent action is
1997
Figure 3: A solder bridge provides thermal linkage to transfer heat into the pad and component lead.
Figure 4: Solder blends to the soldered surface, forming a small contact angle.
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Soldering Basics
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: N/A called wetting and forms the intermetallic bond between the parts. (See Fig. 1). Wetting can only occur if the surface of the copper is free of contamination and from the oxide film that forms when the metal is exposed to air. Also, the solder and work surface need to have reached the proper temperature. Although the surfaces to be soldered may look clean, there is always a thin film of oxide covering it. For a good solder bond, surface oxides must be removed during the soldering process using flux. FLUX Reliable solder connections can only be accomplished with truly cleaned surfaces. Solvents can be used to clean the surfaces prior to soldering but are insufficient due to the extremely rapid rate at which oxides form on the surface of heated metals. To overcome this oxide film, it becomes necessary in electronic soldering to use materials called fluxes. Fluxes consist of natural or synthetic rosins and sometimes chemical additives called activators. It is the function of the flux to remove oxides and keep them removed during the soldering operation. This is accomplished by the flux action which is very corrosive at solder melt temperatures and accounts for flux's ability to rapidly remove metal oxides. In its unheated state, however, rosin flux is non-corrosive and non-conductive and thus will not affect the circuitry. It is the fluxing action of removing oxides and carrying them away, as well as preventing the reformation of new oxides that allows the solder to form the desired intermetallic bond. Flux must melt at a temperature lower than solder so that it can do its job prior to the soldering action. It will volatilize very rapidly; thus it is mandatory that flux be melted to flow onto the work surface and not be simply volatilized by the hot iron tip to provide the full benefit of the fluxing action. There are varieties of fluxes available for many purposes and applications. The most common types include: Rosin - No Clean, Rosin - Mildly Activated and Water Soluble. When used, liquid flux should be applied in a thin, even coat to those surfaces being joined and prior to the application of heat. Cored wire solder and solder paste should be placed in such a position that the flux can flow and cover the joints as the solder melts. Flux should be applied so that no damage will occur to the surrounding parts and materials. SOLDERING IRONS Soldering irons come in a variety of sizes and shapes. A continuously tinned surface must be maintained on the soldering iron tip's working surface to ensure proper heat transfer and to avoid transfer of impurities to the solder connection. Before using the soldering iron the tip should be cleaned by wiping it on a wet sponge. When not in use the iron should be kept in a holder, with its tip clean and coated with a small amount of solder.
7.1.1
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Soldering Basics
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: N/A NOTE Although tip temperature is not the key element in soldering you should always start at the lowest temperature possible. A good rule of thumb is to set the soldering iron tip temperature at 260C (500F) and increase the temperature as needed to obtain the desired result. CONTROLLING HEAT Controlling soldering iron tip temperature is not the key element in soldering. The key element is controlling the heat cycle of the work. How fast the work gets hot, how hot it gets, and how long it stays hot is the element to control for reliable solder connections. THERMAL MASS The first factor that needs to be considered when soldering is the relative thermal mass of the joint to be soldered. This mass may vary over a wide range. Each joint, has its own particular thermal mass, and how this combined mass compares with the mass of the iron tip determines the time and temperature rise of the work. SURFACE CONDITION A second factor of importance when soldering is the surface condition. If there are any oxides or other contaminants covering the pads or leads, there will be a barrier to the flow of heat. Even though the iron tip is the right size and temperature, it many not be able to supply enough heat to the joint to melt the solder. THERMAL LINKAGE A third factor to consider is thermal linkage. This is the area of contact between the iron tip and the work. Figure 2 shows a view of a soldering iron tip soldering a component lead. Heat is transferred through the small contact area between the soldering iron tip and pad. The thermal linkage area is small. Figure 3 also shows a view of a soldering iron tip soldering a component lead. In this case, the contact area is greatly increased by having a small amount of solder at the point of contact. The tip is also in contact with both the pad and component further improving the thermal linkage. This solder bridge provides thermal linkage and assures the rapid transfer of heat into the work. APPLYING SOLDER In general, the soldering iron tip should be applied to the maximum mass point of the joint. This will permit the rapid thermal elevation of the parts to be soldered. Molten solder always flows from the cooler area toward the hotter one. Before solder is applied; the surface temperature of the parts being soldered must be elevated above the solder melting point. Never melt the solder against the iron tip and allow it to flow onto a surface cooler than the solder melting temperature. Solder applied to a cleaned, fluxed and properly heated surface will melt and flow without direct contact with
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7.1.1
Revision C x Page 3 of 4
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Soldering Basics
Product Class: R/F/W/C x Skill Level: Intermediate x Conformance Level: N/A the heat source and provide a smooth, even surface, filleting out to a thin edge. Improper soldering will exhibit a built-up, irregular appearance and poor filleting. For good solder joint strength, parts being soldered must be held in place until the solder solidifies. If possible apply the solder to the upper portion of the joint so that the work surfaces and not the iron will melt the solder, and so that gravity will aid the solder flow. Selecting cored solder of the proper diameter will aid in controlling the amount of solder being applied to the joint. Use a small gauge for a small joint, and a large gauge for a large joint. POST SOLDER CLEANING When cleaning is required, flux residue should be removed as soon as possible, but no later than one hour after soldering. Some fluxes may require more immediate action to facilitate adequate removal. Mechanical means such as agitation, spraying, brushing, and other methods of applications may be used in conjunction with the cleaning solution. The cleaning solvents, solutions and methods used should not have affected the parts, connections, and materials being cleaned. After cleaning, boards should be adequately dried. RESOLDERING Care should be taken to avoid the need for resoldering. When resoldering is required, quality standards for the resoldered connection should be the same as for the original connection. A cold or disturbed solder joint will usually require only reheating and reflowing of the solder with the addition of suitable flux. If reheating does not correct the condition, the solder should be removed and the joint resoldered. WORKMANSHIP Solder joints should have a smooth appearance. A satin luster is permissible. The joints should be free from scratches, sharp edges, grittiness, looseness, blistering, or other evidence of poor workmanship. Probe marks from test pins are acceptable providing that they do not affect the integrity of the solder joint. An acceptable solder connection should indicate evidence of wetting and adherence when the solder blends to the soldered surface. The solder should form a small contact angle; this indicates the presence of a metallurgical bond and metallic continuity from solder to surface. (See Figure 4). Smooth clean voids or unevenness on the surface of the solder fillet or coating are acceptable. A smooth transition from pad to component lead should be evident.
7.1.1
Revision C x Page 4 of 4
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No. 7.1.2
Revision C x Page 1 of 4
Figure 1: Remove excess solder from plated holes using a vacuum desoldering tool.
Figure 2: Remove excess solder from surface mount pads using a solder iron and solder braid.
Figure 3: Remove excess solder from surface mount pads using a vacuum desoldering tool.
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No. 7.1.2
Revision C x Page 2 of 4
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No. 7.1.2
Revision C x Page 3 of 4
3.
4.
6.
Surface Mount Pad Preparation, Solder Braid Method Solder Braid is made from stranded copper with a powdered flux inside the copper strands. Solder braid will absorb the solder when heat is applied to the braid and solder surface. 1. Solder braid comes in different widths. Select a size that matches the width of the pad, or just slightly smaller, where possible. NOTE Most solder removal braid comes with a powdered flux inside the copper strands. Adding additional flux will help to transfer the heat faster and helps to improve the wicking or capillary action of the copper braid.
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No. 7.1.2
Revision C x Page 4 of 4
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No. 7.1.3
Revision C x Page 1 of 5
OUTLINE This document includes figures and tables for solder joint acceptability criteria on a variety of component types. NOTE For the most up to date information on solder joint acceptability criteria refer to: IPC-A-610 Acceptability of Electronic Assemblies J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies REFERENCES 1.0 Foreword 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal
1997
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No. 7.1.3
Revision C x Page 2 of 5
75%
75%
75%
NOTES 1. Wetted solder refers to solder applied by the solder process. 2. The 25% unfilled volume includes both source and destination side depressions.
1997
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No. 7.1.3
Revision C x Page 3 of 5
Maximum End Overhang Minimum End Joint Width Minimum Side Joint Length Maximum Fillet Height Minimum Fillet Height
B C D E F
G J
Notes: 1. The maximum fillet may overhang the land or extend onto the top of the chip cap metallization; however the solder shall not extend further onto the component body. 2. Properly wetted fillet evident. 3. Unless satisfactory cleaning can be demonstrated with reduced clearance.
1997
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No. 7.1.3
Revision C x Page 4 of 5
Notes: 1. The maximum solder fillet shall not touch package body. 2. Properly wetted fillet evident.
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No. 7.1.3
Revision C x Page 5 of 5
Maximum Toe Overhang Minimum End Joint Width Minimum Side Joint Length
B C D
Maximum Heel Fillet Height Minimum Heel Fillet Height Minimum Thickness
E F G
Notes: 1. Solder fillet may extend through the top bend. Solder must not touch the package body or end seal, except for low profile SMD devices, e.g., SOICs, SOTs. Solder should not extend under the body of low profile surface mount components whose leads are made of Alloy 42 or similar metals. 2. Must not violate minimum design conductor spacing. 3. Properly wetted fillet evident.
1997
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No. 7.2.1
Revision C x Page 1 of 2
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal 7.1.3 Solder Joint Acceptability Criteria
TOOLS & MATERIALS Cleaner Cleaning Wipes Flux Microscope Soldering Iron with Tips Solder
Figure 1: Apply solder at the junction of soldering iron tip and lead to make a solder bridge.
PROCEDURE 1. If needed, form the component and clean the area. 2. Insert the component into the plated hole. If needed, secure in place by bending leads or other mechanical means. 3. If needed, apply liquid flux to the plated holes and pads. 4. Place the soldering iron tip at the junction between the pad and component lead. Apply a small amount of solder at the junction of soldering iron tip and lead to make a solder bridge. (See Figure 1). NOTE The size of the solder is important when soldering small components. If the solder is too large, it is easy to melt too much solder into the joint. If the solder is too small, it can take too long to melt the optimum amount into the joint. CAUTION Avoid exerting any pressure on the pad. 5. Immediately feed solder into the joint from the side opposite from the soldering iron tip until the proper fillet is achieved. Remove the solder then remove the iron. The iron may be swept over the end of the component lead to cover it with solder. (See Figure 2). Figure 2: Feed solder into the joint from the side opposite from the iron tip until the proper fillet is achieved.
1997
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No. 7.2.1
Revision C x Page 2 of 2
1997
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No. 7.2.2
Revision C x Page 1 of 4
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No. 7.2.2
Revision C x Page 2 of 4
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No. 7.2.2
Revision C x Page 3 of 4
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No. 7.2.2
Revision C x Page 4 of 4
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No. 7.3.1
Revision C x Page 1 of 2
Figure 2: Place the soldering iron tip at the junction between the prefilled pad and component lead.
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No. 7.3.1
Revision C x Page 2 of 2
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No. 7.3.2
Revision C x Page 1 of 2
Figure 2: Move the tool back and forth to heat both solder joints until complete solder melt is observed.
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No. 7.3.2
Revision C x Page 2 of 2
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No. 7.4.1
Revision C x Page 1 of 1
Figure 2: Place the soldering iron tip at the junction between the pad and component lead.
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No. 7.4.2
Revision C x Page 1 of 1
Figure 2: Apply solder to the continuous flow solder tip to create a convex bead of molten solder.
Figure 3: Slowly move the tip over the row of leads to form proper solder fillets at each joint.
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No. 7.4.3
Revision C x Page 1 of 1
Figure 1: Add a small bead of solder paste along the row of pads.
Figure 2: Move the tool back and forth to heat all the solder joints until complete solder melt is observed.
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No. 7.5.1
Revision C x Page 1 of 1
Figure 2: Place the soldering iron tip at the junction between the pad and component lead.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 7.5.2
Revision C x Page 1 of 1
Figure 2: Apply solder to the continuous flow solder tip to create a convex bead of molten solder.
Figure 3: Slowly move the tip over the row of leads to form proper solder fillets at each joint.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 7.5.3
Revision C x Page 1 of 1
Figure 1: Add a small bead of solder paste along the row of pads.
Figure 2: Move the tool back and forth to heat all the solder joints until complete solder melt is observed.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.1
Revision C x Page 1 of 3
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal
TOOLS & MATERIALS Cleaner Cleaning Wipes Flux Microscope Solder Solder Removal Tool, Vacuum Type with Tips Soldering Iron with Tips
Figure 1: When the solder melts, activate the vacuum to remove the solder while oscillating the tip.
PROCEDURE - Standard Method 1. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillet's are minimal, it may be desirable to add additional solder to form an "excess solder" joint. This will improve the thermal linkage. 2. Apply a small amount of liquid flux to the solder joints of the component to be removed. 3. Align the desolder tip with a component lead end and lightly make contact with the solder joint. Keep the desolder tip off the pad by allowing it to slide around on a film of solder. CAUTION Do not apply pressure with the solder extractor tip to the lands or other conductive patterns. 4. After the solder has melted, start a rotating or oscillating motion with the desolder tip. Continue the rotating motion until a change in the "feel" of the rotating motion occurs. At this instant the solder in the solder joint is completely molten. Immediately activate the vacuum, extracting the solder from the solder joint. (See Figure 1). Figure 2: Place a soldering iron tip against the component lead and the desoldering tip over the lead end.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.1
Revision C x Page 2 of 3
PROCEDURE - Auxiliary Heat Method Auxiliary heating may be required on solder joints with a large thermal mass. This is most common on multilayer PC boards. 1. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillet's are minimal, it may be desirable to add additional solder to form an "excess solder" joint. This will improve the thermal linkage. 2. Apply a small amount of liquid flux to the solder joints of the component to be removed. 3. Place a soldering iron tip against the lead of the component side of the PC board. (See Figure 2) 4. Align the desolder tip with a component lead end and lightly make contact with the solder joint. Keep the desolder tip off the pad by allowing it to slide around on a film of solder. CAUTION Do not apply pressure with the solder extractor tip to the lands or other conductive patterns.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.1
Revision C x Page 3 of 3
EVALUATION 1. In-process QA Inspection should be conducted to ensure component was removed without evidence of damage to PC board assembly or plated through hole.
1997
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No. 8.1.2
Revision C x Page 1 of 4
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.2
Revision C x Page 2 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.2
Revision C x Page 3 of 4
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.1.2
Revision C x Page 4 of 4
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.2.1
Revision C x Page 1 of 2
Figure 1: Forked tip shown with solder added to cavity to enhance removal operation.
Figure 2: Removing SMT chip component with forked tip. After solder has melted lift tip out and up.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.2.1
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.2.2
Revision C x Page 1 of 1
Figure 1: Place the tweezer tips in position. When the solder melts, lift the component off the PC board.
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.3.1
Revision C x Page 1 of 2
Figure 1: Conduction tip shown with solder added to enhance removal operation.
Figure 2: Removing J lead component with conduction tip. After solder has melted lift tip out and up.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.3.1
Revision C x Page 2 of 2
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.3.2
Revision C x Page 1 of 2
Figure 1: Nozzle at left heats the leads and pads. Nozzle at right heats component, leads and pads.
Figure 2: Rework stand holds hot air rework tool steady and positioning table keeps PC board level.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.3.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
No. 8.4.1
Revision C x Page 1 of 2
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal
TOOLS & MATERIALS Caliper Cleaner Cleaning Wipes Conduction Removal Tool with Tips Flux, Liquid Microscope Oven Positioning Table Rework Stand Soldering Iron with Tips
Figure 1: Conduction tip shown with solder added to enhance removal operation.
PREPARATION This method uses tips that are designed to fit over the top of surface mount components, and to reflow all the solder joints at once. The tip fits over the component with just a slight amount of extra space for solder. Measure the overall length and width of the component with a caliper to select the proper size tip. Check the tip for proper fit prior to processing the part. The tip should not fit the component so tightly that it will get lodged in the tip, but the tip should not be so loose that it will not conduct heat to all the leads simultaneously Conduction tips come in several sizes to accommodate many of the different styles and sizes of components, but the component must fit properly in the tool cavity. Since these tips have a cavity, they require special cleaning and tinning procedures. NOTE Carefully inspect the tip to ensure that all surfaces will properly contact the component leads. 1. Remove any solder from inside the tip cavity with a fiber tool.
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
Figure 2: After solder has melted lift tip out and up.
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
No. 8.4.1
Revision C x Page 2 of 2
1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information.
CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA Phone: 978.374.5000 x Fax: 978.372.5700 x E-Mail: info@circuitnet.com x Website: http://www.circuitnet.com
Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Product Class: R/F/W/C x Skill Level: Advanced x Conformance Level: High OUTLINE This procedure covers the most commonly used methods for removing surface mount Gull Wing components. NOTE The goal when removing any component is to remove the component as quickly as possible
No. 8.4.2
Revision C x Page 1 of 2
REFERENCES 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.5 Baking and Preheating 7.1.1 Soldering Basics 7.1.2 Preparation For Soldering And Component Removal
TOOLS & MATERIALS Caliper Cleaner Cleaning Wipes Flux, Liquid Hot Air Removal Tool with Tips Microscope Oven Positioning Table Rework Stand Vacuum Pen
Figure 1: Nozzle at left heats the leads and pads. Nozzle at right heats component, leads and pads.
PREPARATION This method uses hot air nozzles that do not touch the component. Gas or air is heated and forced through a specially designed nozzle and directed onto the component leads and surface pads. Hot gas/air nozzles come in several sizes to accommodate many of the different styles and sizes of components. Measure the overall length and width of the component to select the proper size tip. Check the nozzle for proper fit prior to processing the part. Some hot gas/air nozzle designs will heat only the component leads and pad area. (See Figure 1, Left Side). Some hot air nozzle designs heat the entire component, the leads and pad area. (See Figure 1, Right Side). Hot gas/air can be used to remove a number of different styles of SMT components but the heated gas/air must be directed onto the leads and pads and away from the top of the component and PC board surface. Hot gas/air nozzles may or may not include vacuum assistance to lift the component off the PC board surface. Figure 3: After solder has melted lift component straight up.
1997
Figure 2: Rework stand holds hot air rework tool steady and positioning table keeps PC board level.
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA
Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Product Class: R/F/W/C x Skill Level: Advanced x Conformance Level: High PROCEDURE 1. Place the pre-heated PC board on the Positioning Table. A heated positioning table is available to pre-heat the PC board, or can be used to maintain the pre-heated temperature when many components need to be removed from one PC board. (See Figure 2). 2. Apply a small amount of liquid flux to all leads of the component. 3. Place the nozzle directly over the top of the component and activate the air flow. When the solder has melted actuate the vacuum assist or lift off the component with a vacuum pen. Lift the component straight up. (See Figure 5). It's difficult to precisely know how long to dwell prior to safely removing the part. This is further complicated by the fact that when removing a bank of components, parts subsequent to the first come off much faster. Obviously, the smaller the part the quicker it reflows. Small SMT components may reflow in a few seconds and large SMT components may take more than a minute. 4. Clean the area.
No. 8.4.2
Revision C x Page 2 of 2
1997
CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this information. CIRCUIT TECHNOLOGY CENTER, INC. , 45 Research Drive, Haverhill, MA 01832-1293 USA