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Part - I

APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)

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Application of EPD Process

Advantage of EPD Process

Challenges

Choice of solvent & applied current

Conventional EPD process

Aqueous EPD process

How to control water electrolysis and bubble incorporation in the deposit ?

Previous attempts to develop Aqueous EPD

APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART 2 (Coming Soon)

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