Precise grinding & polishing

Student: wenjheng Lin

Adviser: Liren Tsai

Outline
Introduction-----------------------------------------------(4)
-----------------------------------------(5)
--------------------------------------------(6)

--------------------------------------------------(10)

--------------------------------------------------(12)

--------------------------------------------(14)

Outline
-----------------------------------------(17)

--------------------------------------------(19)

-----------------------------------------(22)

References-----------------------------------------------(26)

Introduction

0.01mRa0.025m

(Lapping or Polishing)


#:

ELID
# :

(EEM)

0.10.01m


Interactions Between Surfaces of Ultra-fine Powders and Works

Interactions Between Surfaces of Ultra-fine Powders and Works

(a)Surface structures before interaction. (b)Hydrogen bonding between two
surface. (c)Interface structure. (d)Separation of adsorbed powder with work
atom removals.

:AGT 900GS

0.084
www.abletek.com.tw/images/AGT1.jpg

www.abletek.com.tw/AGT900.htm

magnetic
brush

originimages.ttnet.net/.../01/400086011b.jpg

tw.ttnet.net/.../1/itno/TL305/dtno/015/
type1/A


:JX126001782

www.jwfu.com/upload1/201006/20106211335391
57.jpg

www.jwfu.com/products/9705/

(Electrolytic In-Process DressingELID)

ELID
ELID

ELID

ELID


CMP (Chemical Mechanical

Polishing) (Chemical
Mechanical Planarization)
CMP (PU Pad)
(Slurry)
(IC Wafer)(oxide layer)
(metal layer)
(pattern
density)(defect density)

:http://140.112.22.210/lab/eml/semi-94/chapter12
%E5%8C%96%E5%AD%B8%E6%A9%9F%E6%A2%B0%E7%A0%94%E7%A3%A8.pdf

-
www.ewebs.com.tw/.../P0000140000117_1_278.jp
g

www.stc.tw/stc/index.php?action=product_detai...

1m
SAE30

5mSiC


:AR-303
GOUS

img.diytrade.com/.../5574304/0/1207297612.jp
g

www.diytrade.com/china/3/products/4017434/
...

References

2005 2

B93104019

(Precision

Grinding)
http://blog.sina.com.tw/lifung/article.php?pbgid=24968&entryid=591384