Rendered by: Tom Hammond - NSS 26 MAR 2011 v1.7 MAIN PC BOARD AC ON/OFF PC BOARD VREF VREF VREF VREF IC2B OUT LM324 IC2A OUT LM324 IC2D LM324 OUT TRIAC DRIVER IC1 NC B A C G F E D 1 3 2 4 8 7 6 5 VREF LM324 OUT U1C VEE VCC VCC VEE AC Q1 R4 T1 T2 G IC2C ZD2 ZD1 10 9 8 11 + _ 4 V+ V- R10 C3 C2 C1 R1 D3 R3 C4 C9 R13 R2 R14 1 2 3 + _ + _ R7 TEMP CTRL 5 6 7 R15 R8 R5 C5 R9 R11 SENSOR PINS SOLDERING IRON PLUG SLEEVE GND HEATER PINS R17 R16 C6 R12 R6 C7 CAL CTRL 12 13 14 HEATER LED 1 3 5 HANDSET TIP GND BLK WHT GRN D1 D2 HOT NEUT GND CHASSIS GND CHASSIS GND SOLDERING IRON/CHASSIS GND CHASSIS GND POWER XFMR NEC AC05D 5A TRIAC 1k NEC* PC1701C Zero Volt Switch NEC PC324A Lo-Pwr Quad OpAmp 220F 50V 47F 16V 47F 16V 5.1Zv 500mW 5.1Vz 500mW 680 360 2W metal film 15k .01/50V .01/25V 1k8 1k0 5k0 ALPS RK09L 1140A65 5K (502B) LINEAR 390 1% 1M0 .01/25v 130k 1% 27k0 1% 300 HANDSET SOCKET 1N4148 100k 5k1 1% 24k0 .01/25V 1k0 1% 180k 1% 66k5 1% 1k2 0.1 25V 1N4007 120VAC 24VAC 120VAC 2A HAKKO 936 TEMPERATURE-CONTROLLED SOLDERING STATION PC BOARD LAYOUT Rendered by: Tom Hammond, NSS 26 MAR 2011 v1.7 PC BOARD AS VIEWED FROM THE COPPER (SOLDER) SIDE HAKKO 936 TEMPERATURE-CONTROLLED SOLDERING STATION PC BOARD LAYOUT Rendered by: Tom Hammond, NSS 26 MAR 2011 v1.7 PC BOARD AS VIEWED FROM THE COMPONENT SIDE HEATSINK HAKKO 936 TEMPERATURE-CONTROLLED SOLDERING STATION PC BOARD LAYOUT Rendered by: Tom Hammond, NSS 26 MAR 2011 v1.7 PC BOARD AS VIEWED FROM THE COMPONENT SIDE HTR LED JP1 R4 R13 R6 R7 R2 R8 R12 R10 R15 D1 D2 C1 C3 C7 C2 Q1 IC1 IC2 T1 T2 G N/C N/C + + + + VEE VEE VCC VCC VCC VREF CN1 FG 1 2 3 4 5 VR2 PVR1 K A HEATSINK HAKKO 936 TEMPERATURE-CONTROLLED SOLDERING STATION PC BOARD LAYOUT Rendered by: Tom Hammond, NSS 26 MAR 2011 v1.7 PC BOARD AS VIEWED FROM THE COMPONENT SIDE 1k 100k 47uF 16v 47uF 16v 220uF 50v AC05D B1081 C324C C1701C 27k 1% 5.1k 1% 1.8k 24k 680 130k 1% 390 1% 0.1 25v 300 5k 1N4148 1N4148 J C1 220uF 50V C2 47uF 16V C3 47uF 16V C4 0.01 (103) 50V Ceramic C5 0.01 (104) 25V Ceramic C6 0.01 (104) 25V Ceramic C7 0.1 (104) 25V Ceramic C8, C10-C13 n/a C9 0.01 (104) 25V Ceramic D1 4N4148 Small Sig Sil, or similar D2 Small Sig Sil, or similar D3 1N4001, or 50VDC (or higher) @ 1A IC1 NEC* PC1701C, Zero Volt Switch IC2 NEC* C324A, Lo-Pwr Quad OpAmp Q1 NEC AC05D 5A Triac R1 360 2W 5% metal film R2 1.8k 1/4w 5% carbon film R3 15k 1/4w 5% R4 330 1/4w 5% R5 1.0k 1/4W 1% metal film R6 27.0k 1/4W 1% R7 5.11k 1/4w 1% R8 390 1/4w 1% R9 66.5k 1/4w 1% R10 680 1/4w 5% R11 180.0k 1/4W 1% R12 130.0k 1/4W 1% R13 100k 1/4w 5% R14 1k 1/4W 5% R15 24k 1/4w 5% R16 12k 1/4w 5% R17 1M 1/4w 5% ZD1 5.1Vz 500mW, ZD2 PVR1 TEMP ADJ POT - ALPS RK09L1140A65 5K (502B) LINEAR VR2 CAL TEMP POT - Bournes 3362P-1-501LF, see note below * NOTE: NEC, is now part of Renesas Electronics Corp. NOTE: In the 936, the CAL TEMP pot is 300 Ohms, however we were unable to find a pot in this physical format rated at 300 Ohms, so a 500 Ohm device has been specified as a suitable substitute. 4N4148 P carbon film carbon film metal film metal film metal film metal film carbon film metal film metal film carbon film carbon film carbon film carbon film carbon film 5.4Vz (measured) 5.1Vz 500mW, 5.2Vz (measured)