100104977

16
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12
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CCT
CCT CCT
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15
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16
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17
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mg/L
mg/100mL
()
()
()
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(10)
(11)
(12)H16.7.1
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21
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16 18
14 18 16
23
IP3 2 X
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ATPase3 X
1.5
GPCR4
NMR GPCR
5
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NMR
6
LDL LDL6 NMRX
PACAP PACAP277
NMR
MS/MS
FRET
8
GPCR V1b 9
TACE in
silico
16
24
IP3 IP3 a2+
ATPaseATP
GPCR
PACAP PACAP27 PACAP
FRET
V1b
16
14 18
10
11
HARP 12
16
10
11
25
12
HARP
15 17
cDNA
cDNA 13 cDNA
cDNA 4,000
cDNA
Gateway 14 12,000
4,600 15
iAFLP 16 1,000
500
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17 siRNA
siRNA18
13
14
15
16
17
18
mRNA
mRNA
10
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17
14
26

19
20
19
20
12 17
DNA
SNPs21
21
IT
14
17
27

KeyMolnet

15 17
POCT22 POCT
DNA DNA
28
DNA
22 POCTPoint of Care Testing
15 17
15
Web Web
15
17
29
15 17
Hb
16 15 10L GLPGood
Laboratory Practice
GMPGood Manufacturing Practice
Hb
Hb
15 17
15
GMPGood
Manufacturing Practice
30
DNA
15
16
16
18
16
16 18
162005
31
13
MRI
12 16
DVT 3

DVT
32
DVT
12 17
ASIC-LSI
BNPbrain natriuretic peptide

ANP
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ASIC-LSI
ASIC-LSI
33
12 16
15
in vitro
13 16
34
in vivo
MPa
3080MPa
in vivo
13 17
35

15
1 17
2
2
IC
IC
14
18 16
compression hip screw
800
15
36
16
37
16 10
14 21
DNA
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DNA
38
12 17
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in vitro
E-CELL
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2
Rhodococcus Micrococcus Pseudomonas
DNA 10
15
Rhodococcus opacus B-4 Micrococcus
14 18
16
39
PCR
FISH
15
15
PCE
Desulfitobacterium Y51 ()
Desulfitobacterium Y51
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Thauera sp. DNT-1 ()
16
12
16
40
PCB
A
PCB#169 F114
15
LC
16 18
(a)
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30%(c)
16
11 17
16
41

DNA
cDNA
cDNA
16
12 16
40kg
14
19 16
42
pH
(
)
DNA
16
14
18 16
OECD
15
16
43
13 17
(
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(dsr)
PCR
15
44
LSI
16 23
16
18
16
16
18
45

16
MIRAI
13
19
LSI
16
EOT
1.0nm High-k
80%EOT 0.5nm High-k
Low-k
SOI-CMOS
32nm CMOS SiGe
SGOI(SiGe-on-Insulator) Ge GOI(Ge-on-Insulator) SOI
FET(Field Effect Transistor)
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EUV
14
17
EUV 45nm
EUV
16
46
EUV EUV
4W 4W
EUV 10W
EUV
EUV
EUV
Ion Beam Figuring : IBF
EEMElastic Emission Machining3
EUV
15
17
CPU OS
MRAMMagnetic Randam Access Memory
16
MRAM
MRAM MTJMagnetic Tunnel Junction
Mbit MRAM
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15
17
90nm LSI
SoC
47
16
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SISignal Integrity
TEGTest Equipment Group
PIPattern Integrity
14 17
16
EOT1nm
(110)
300mm
15 17
48
16
SiB
14 18
16
16
10GHz
16
16
10-15 10-12
16
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160Gb/s
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c
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X
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16
16
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10
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16
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17
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16
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14 18
16
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17
58
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15
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16
15 17

12 16
3cm10cm 7
65
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CVT
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66
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16
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14 18
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1980 POF
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16
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Intergovernmental Panel on Climate

Change
71

16
16
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SMES
SMES 100MW
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16
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13 17
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15
81
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13 17
15

15
15
15
82
12 16
16
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16
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132

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RF(Radio Frequency)-MEMS
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Object Management Group
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30,132
27,542
27,536
6
2,590
171
353
351
353
1
350
172

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16

IP3 IP3 a2+

PACAP PACAP27 PACAP

siRNARNAi 2123 RNARNAi

22 POCTPoint of Care Testing

GMPGood Manufacturing Practice

BNPbrain natriuretic peptide

compression hip screw

80%EOT 0.5nm High-k

EEMElastic Emission Machining3

MRAMMagnetic Randam Access Memory

2GH 200W 26GH

SFQ 2.0m2 LSI

TFTThin Film Transistor

10-8 mm2 /kgf

Intergovernmental Panel on Climate

300A/cm 500m 5m/h

FSW(Friction Stir Welding)VaRTM(Vacuum-assisted Resin

MDOMultidisciplinary Design Optimization

ZnFe2 O4 Zn-K XANES

2.04.0 0.02dB/cm 1.260

1.360m 3232 100GHz

PTCPositive Temperature Coefficient

VHF CVD60100MHz CVD

0.7V 200mA/cm2 75%

750kW 1.2MPa MCFC

RTMResin Transfer Molding 160

MEMSMicro Electro-Mechanical System

MEMSMicro Electro Mechanical Systems

PDQ(Product Data Quality)

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