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25AA256/25LC256: 256K SPI Bus Serial EEPROM
25AA256/25LC256: 256K SPI Bus Serial EEPROM
VCC Range
Page Size
Temp. Ranges
Packages
25LC256
2.5-5.5V
64 Byte
I, E
25AA256
1.8-5.5V
64 Byte
Features:
Description:
PDIP/SOIC
(MF)
CS 1
VCC
SO 2
HOLD
SO
1
2
8
7
VCC
WP 3
SCK
WP
SCK
VSS 4
SI
VSS
SI
CS
SO
WP
Write-Protect
VSS
Ground
HOLD
Rotated TSSOP
(ST)
CS
HOLD
SCK
VCC
SI
CS
VSS
WP
SO
TSSOP
(ST)
SI
SCK
CS
VCC
Hold Input
SO
HOLD
Supply Voltage
WP
SCK
VSS
SI
HOLD
VCC
* 25XX256 is used in this document as a generic part number for the 25AA256, 25LC256 devices.
DS21822F-page 1
25AA256/25LC256
1.0
ELECTRICAL CHARACTERISTICS
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
TA = -40C to +85C
Automotive (E): TA = -40C to +125C
Min.
Typ.(2)
Max.
Units
D001
VIH
High-level input
voltage
.7 VCC
VCC +1
D002
VIL
-0.3
0.3 VCC
D003
VIL
Low-level input
voltage
D004
VOL
D005
VOL
D006
VCC 2.5V
-0.3
0.2 VCC
Low-level output
voltage
0.4
0.2
VOH
High-level output
voltage
VCC -0.5
IOH = -400 A
D007
ILI
D008
ILO
Output leakage
current
D009
CINT
Internal Capacitance
(all inputs and
outputs)
pF
D010
ICC Read
2.5
mA
0.5
2.5
mA
0.6
0.15
5
3
mA
mA
VCC = 5.5V
VCC = 2.5V
0.1
Operating Current
D011
ICC Write
D012
ICCS
Standby Current
Note 1:
2:
DS21822F-page 2
25AA256/25LC256
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Sym.
No.
Characteristic
Industrial (I):
TA = -40C to +85C
Automotive (E): TA = -40C to +125C
Min.
Max.
Units
Test Conditions
10
5
3
MHz
MHz
MHz
FCLK
Clock Frequency
TCSS
CS Setup Time
50
100
150
ns
ns
ns
TCSH
CS Hold Time
100
200
250
ns
ns
ns
TCSD
CS Disable Time
50
ns
Tsu
10
20
30
ns
ns
ns
THD
20
40
50
ns
ns
ns
TR
100
ns
(Note 1)
TF
100
ns
(Note 1)
THI
50
100
150
ns
ns
ns
10
TLO
50
100
150
ns
ns
ns
11
TCLD
50
ns
12
TCLE
50
ns
13
TV
50
100
160
ns
ns
ns
14
THO
ns
(Note 1)
15
TDIS
40
80
160
ns
ns
ns
16
THS
20
40
80
ns
ns
ns
17
THH
20
40
80
ns
ns
ns
DS21822F-page 3
25AA256/25LC256
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
TA = -40C to +85C
Automotive (E): TA = -40C to +125C
AC CHARACTERISTICS
Param.
Sym.
No.
Characteristic
Min.
Max.
Units
18
THZ
30
60
160
ns
ns
ns
19
THV
30
60
160
ns
ns
ns
20
TWC
ms
(NOTE 2)
21
Endurance
1M
E/W (NOTE 3)
Cycles
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
VLO = 0.2V
(Note 1)
VHI = 4.0V
(Note 2)
CL = 50 pF
0.5 VCC
Output
0.5 VCC
DS21822F-page 4
25AA256/25LC256
FIGURE 1-1:
HOLD TIMING
CS
17
16
17
16
SCK
18
SO
n+2
SI
n+2
n+1
19
High-Impedance
n
5
Dont Care
n+1
n-1
n-1
HOLD
FIGURE 1-2:
CS
2
Mode 1,1
SCK
12
11
Mode 0,0
5
SI
MSB in
LSB in
High-Impedance
SO
FIGURE 1-3:
CS
9
10
Mode 1,1
SCK
Mode 0,0
13
SO
14
MSB out
SI
15
ISB out
Dont Care
DS21822F-page 5
25AA256/25LC256
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
2.2
Read Sequence
DS21822F-page 6
2.3
Write Sequence
25AA256/25LC256
BLOCK DIAGRAM
STATUS
Register
HV Generator
Memory
Control
Logic
I/O Control
Logic
EEPROM
Array
X
Dec
Page Latches
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
VCC
VSS
TABLE 2-1:
INSTRUCTION SET
Instruction Name
Instruction Format
READ
0000 0011
WRITE
0000 0010
WRDI
0000 0100
WREN
0000 0110
RDSR
0000 0101
WRSR
0000 0001
FIGURE 2-1:
Description
READ SEQUENCE
CS
0
9 10 11
1 15 14 13 12
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
16-bit Address
2
0
Data Out
High-Impedance
SO
DS21822F-page 7
25AA256/25LC256
FIGURE 2-2:
CS
Twc
0
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
16-bit Address
0
0 15 14 13 12
Data Byte
1
High-Impedance
SO
FIGURE 2-3:
CS
0
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
16-bit Address
0 1
Data Byte 1
2
0 15 14 13 12
CS
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Data Byte 2
SI
DS21822F-page 8
Data Byte 3
1
25AA256/25LC256
2.4
FIGURE 2-4:
Power-up
WRDI instruction successfully executed
WRSR instruction successfully executed
WRITE instruction successfully executed
SCK
SI
High-Impedance
SO
FIGURE 2-5:
CS
0
SCK
SI
10
High-Impedance
SO
DS21822F-page 9
25AA256/25LC256
2.5
TABLE 2-2:
STATUS REGISTER
W/R
W/R
W/R
WPEN
BP1
BP0
WEL
WIP
FIGURE 2-6:
CS
0
10
11
12
13
14
15
SCK
Instruction
SI
High-Impedance
SO
DS21822F-page 10
1
Data from STATUS Register
7
25AA256/25LC256
2.6
TABLE 2-3:
FIGURE 2-7:
ARRAY PROTECTION
BP1
BP0
Array Addresses
Write-Protected
none
upper 1/4
(6000h-7FFFh)
upper 1/2
(4000h-7FFFh)
all
(0000h-7FFFh)
CS
0
10
11
12
13
14
15
SCK
Instruction
SI
High-Impedance
SO
Note:
An internal write cycle (TWC) is initiated on the rising edge of CS after a valid write STATUS register
sequence.
DS21822F-page 11
25AA256/25LC256
2.7
Data Protection
2.8
TABLE 2-1:
Power-On State
WEL
(SR bit 1)
WPEN
(SR bit 7)
WP pin
Protected Blocks
Unprotected Blocks
STATUS Register
Protected
Protected
Protected
Protected
Writable
Writable
0 (low)
Protected
Writable
Protected
1 (high)
Protected
Writable
Writable
x = dont care
DS21822F-page 12
25AA256/25LC256
3.0
PIN DESCRIPTIONS
TABLE 3-1:
Name
PDIP/SOIC Rotated
TSSOP/DFN TSSOP
Function
3.4
CS
SO
WP
Write-Protect Pin
VSS
Ground
3.5
SI
SCK
HOLD
Hold Input
VCC
Supply Voltage
3.1
3.2
3.3
3.6
Hold (HOLD)
Write-Protect (WP)
DS21822F-page 13
25AA256/25LC256
4.0
PACKAGING INFORMATION
4.1
8-Lead DFN
XXXXXXX
T/XXXXX
YYWW
NNN
25LC256
I/MF e3
0528
1L7
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
25LC256
I/P e3 1L7
0528
Example:
25LC256I
SN e3 0528
1L7
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
Example:
5LE
I528
1L7
XXXX
TYWW
NNN
Legend: XX...X
T
Y
YY
WW
NNN
e3
Example:
25LC256
I/SM e3
05281L7
XXXXXXXX
XXXXXXXX
YYWWNNN
Standard
Rotated
25AA256
5AE
5AEX
25LC256
5LE
5LEX
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21822F-page 14
25AA256/25LC256
8-Lead Plastic Dual Flat, No Lead Package (MF) 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
L
N
K
E2
E1
EXPOSED
PAD
NOTE 1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
A2
A
A1
A3
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
0.85
A2
0.65
0.80
Standoff
A1
0.00
0.01
0.05
Base Thickness
A3
0.20 REF
Overall Length
4.92 BSC
D1
D2
Overall Width
E1
E2
2.16
2.31
2.46
0.35
0.40
0.47
Contact Length
0.50
0.60
0.75
Contact-to-Exposed Pad
0.20
12
Contact Width
1.27 BSC
1.00
4.67 BSC
3.85
4.00
4.15
5.99 BSC
5.74 BSC
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
DS21822F-page 15
25AA256/25LC256
8-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
E1
2
D
E
A2
A1
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
NOM
MAX
Pitch
.210
A2
.115
.130
.195
A1
.015
.290
.310
.325
E1
.240
.250
.280
Overall Length
.348
.365
.400
.115
.130
.150
Lead Thickness
.008
.010
.015
b1
.040
.060
.070
.014
.018
.022
eB
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21822F-page 16
25AA256/25LC256
8-Lead Plastic Small Outline (SN) Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
b
h
A2
A1
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
1.27 BSC
A2
1.25
Standoff
A1
0.10
0.25
Overall Width
E1
3.90 BSC
Overall Length
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
0.25
0.50
Foot Length
0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
Lead Thickness
0.17
0.25
Lead Width
0.31
0.51
15
15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS21822F-page 17
25AA256/25LC256
(JEITA/EIAJ Standard, Formerly called SOIC)
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
A2
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
1.77
1.27 BSC
A2
1.75
1.98
Standoff
A1
0.05
0.25
Overall Width
7.62
8.26
E1
5.11
5.38
Overall Length
5.13
5.33
Foot Length
0.51
0.76
Foot Angle
Lead Thickness
0.15
0.25
Lead Width
0.36
0.51
15
2.03
15
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
DS21822F-page 18
25AA256/25LC256
8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
b
e
c
A
A2
A1
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
0.65 BSC
A2
0.80
1.00
1.05
Standoff
A1
0.05
0.15
1.20
Overall Width
E1
4.30
6.40 BSC
4.40
2.90
3.00
3.10
Foot Length
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
Lead Thickness
0.09
0.20
Lead Width
b
0.19
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21822F-page 19
25AA256/25LC256
APPENDIX A:
REVISION HISTORY
Revision C (11/03)
Corrections to Section 1.0, Electrical Characteristics.
Revision D (06/05)
Update package information
Revision E (08/05)
Remove Preliminary status. Revise Table 1-1, Params.
D011 and D012.
Revision F (05/07)
Update Pb-free; Replace Package Drawings (Rev. AP);
Update Product ID section.
DS21822F-page 20
25AA256/25LC256
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
DS21822F-page 21
25AA256/25LC256
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
RE:
Reader Response
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply?
Device: 25AA256/25LC256
N
Literature Number: DS21822F
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
DS21822F-page 22
25AA256/25LC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
/XX
Temp Range
Package
Examples:
a)
b)
Device:
25AA256
25LC256
25AA256X
25LC256X
Blank
T
=
=
Temperature
Range:
I
E
=
=
-40C to+85C
-40C to+125C
Package:
MF
P
SN
ST
SM
=
=
=
=
=
c)
d)
e)
DS21822F-page 23
25AA256/25LC256
NOTES:
DS21822F-page 24
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21822F-page 25
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Tel: 480-792-7200
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China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
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