14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP] ete: For the most cumment package drawings, please see the Microchip Packaging Speciation located at http: www microchip. comipackeaing Tes MILUMETERS Dimension Limits | MIN ROM MAK, © 4 = AS BSC x = = 120 a2 | 080 To8 105 At | 006 = 05 [Overan Wisth E ea 8G Molced Package Width | 40 aaa 10 Molded Package Length a 250 Ei Bie Foal Length C ae aa. 07s Foalpeint a TOO REF Foot Ange @ 7 = e Lead Thickness © 08 = 020 Lead With @ oas = oa Notes: 4. Pin 4 visual index feature may vary, but must te Facated within the hariched area. 2. Dimensions D and £1 do nat incude mold flash or protrusions. Mold flash or protrusions shall not exceed 0.16 mm per side. 3. Dimansianing and telerancing par ASME Y14.5M, BSC: Basic Dimension. Theoretically exact value shawn wihout tolerances. REF: Reference Dimension, usualy withaut ielerance, fer information purposes arly. Microchip Technology Drawing CO4-0878. + 2008 Micwchip Technalegy Inc.