8-Lead Plastic Dual Flat, No Lead Package (MU) —2x3x0.5 mm Body [UDFN) (Note: For the most current package drawings, please see the Microchip Packaging Specification located at http:fénewa.microchip.comipackaging nate 1 — Nee SEE DETAIL A DETAIL A. [A auemNate ConTacr SHAPES NOTE 2 [_ Bamansion Limes| Win [how Tax Number of Pins = Pilch = Oa0 BSC. versa Hearn a om os Siandotl AD 7 [Contact Tieknaas aa a7 REF fOveraat Cenggh | 185 2.00 2s [Overall With E | 205 3.00 Exposed Pad Langihy be] 130 1.80) Exposee Pan Wath ez | 120 7130) [Contact Wish b_| 920 0.35 iConeact Length 0.25 0.90 Notes: 41, Pev 1 visual Index feature may wary, Out must be located within the hatched area. 2, Package may nave ona or mora axposid tia bars at ents, 3, Package is sat singulatedt 4, Dimensioning and folerancing per ASME 16,501 BSC: Gasic Dwnension. Theoleliealy exacl value shove without lleances, REF: Reference Denonsion, usually without Inlaranee. for information purges ordy Microchip Technology Drawing No. C4126 (62012-2014 Microchip Teehnatngy Ine