Surface Mount PTC OZCB Series Not recommended for new applications. Please use OZCH (HEI@ 0208 Series -1210 Chip __RoHS 6 Compliant & HalogenFree: Application Allhigh-densty boards Product Features 1210 Chip Size , Fast Trp Time, Low OCR Resistance Operating (Hold Current) Range ‘0m - 2A, Maximum Voltage 6 -60V (per table) Temperature Range a0 085 Agency Approval ‘TUY (Std. EN6O738-1-1, Cer R50102117) UL Component (Std. UL1434, File £305051) UL Conditions of Acceptabity 1. These devices have been investigated for use in safety circuits and are suitable 2s alimting devi. fous someting crn dem 2 ean nt hecitid gine, rinse cate LEAD FREE = Electrical Characteristics (23) HALOGEN FREE = [HF mi aS eS =e reo [ce] ort] say ['Sa | We [ee ee] na | Re ed THA | ITA |Wmax, vdeo} Imax, A | Pd, W A sec | Ohms | Ohms | °™ | 7 3 sens oat [www asta ee [P| acer om on |x an0-/ oo? on w —Y_—¥ 5 eencaras[oas_[onw | w[m [ono [ aap aas[ aera [FD Se + ownnerss/om [tet [| ae ae) ate oe oa | ¥ sesame e-|aar-|—e—|—n ea [ano 6a) 90> a YY wCtsemisere iar [ser [| tore aso [aa ono orf Y Roseanne an gi A fu, Ulam ecard a Sth, Ges, Hien ek ric apetare car ee Rin SBCA aaa 42, smear don. wtongsestohRienein enero | EXEoxse LUTION: 30! Fuse Inc. +1201, mementos xiv sme snwsenwomca "Nana ©2014 Bel Fuse, Ine. OZCBFeb2015 1/4Surface Mount PTC OZCB Series (HE]@ 0ZCB Series -1210 Chip RoHS 6 Compliant & Halogenfree PTC's - Basic Theory of Operation / “Tripped” Resistance Explanation Fundamentally, a Bel PTC consists of a block of polymeric material containing conductive filler and bonded between two conductive, planar terminations. ‘At currents below the device IHOLD rating, AND at temperatures below 100G, the PTC maintains a resistance value below its Rt MAX rating, ‘As the device's temperature approaches 1306, either due to an increase in ambient temperature or a current exceeding its | TRIP rating, volumetric expansion of the filed polymer breaks apart the majority of conductive pathways across the terminals created by chain contact of adjacent filer particles or device resistance increases sharply by several orders of ‘magnitude. ‘At the much higher “Tripped” resistance, there is just enough leakage current to allow internal heating to “hold” the device in ts tripped state (around 125C) until power is interrupted. Once power is removed, the PTC's core Cools and contracts allowing conductive chains to reform and return the device to its low resistance state. ‘The catalog data for each device specifies a “Typical Power" value. This is the power required to exactly match the heat {ost by the tripped device to its ambient surroundings at 23C. By Ohm's Law, power can be stated as: W = ES2/R. Thus the approximate resistance of a “Tripped” PTC can be determined by: R = E*2/W, where “E" is the voltage appearing across the PTC (usually the supply's open circuit voltage), and "W" is the Typical Power value for the particular PTC. Since the PPTC acts to maintain a constant internal temperature, its apparent resistance will change based upon applied voltage and, to a lesser degree, ambient conditions. Consider the following example... APTC with a Typical Power of 1 watt protecting a circuit using a GOV supply will demonstrate an apparent, tripped resistance "R" of: 3042/1 = 3,600 ohms {his Same tipped device when used to protect a 12V crcult would now prosent an apparent resistance of AON = 144 ohms ‘The value for Typical Power is “typical” because any physical factors that affect heat loss (such as ambient temperature or air convection) will somewhat alter the level of power that the PTC needs to maintain its internal temperature. In short, PTCs do not exhibit a constant, quantifiable tripped resistance value. Type Time - To - Trip at 23°C (See Ele. Caraceitis Table or PN - Carve conelaton) Tie - To Tip (8) 7 Feuncunen Speciicatons subject to change wtheut nates bel 2x; 206 Van Vorst Street —_—_techhelpebetf.com abelomue Jersey City, NJ 07902 USA bettuse.com D 2014 Bel Fuse, Ine, ZC Feb2015.2/4Surface Mount PTC OZCB Series [HEI@ 0208 Series -1210 Chip __RoHS 6 Compliant & HalogenFree Pad Layout PTC Marking ‘The dimensions in the table below provide the recommended pad layout. pe TED +m br cooe, art Number [Cogs +. occacn FFE inal | axcoaraore ime) nok |e Inch mm | oh 1 Zoo eve) 1.00 }o.0s07 280 [0.110] | occussrrzs Termination Pad Materials ee Matte Tin - Plated Copper reeset Mechanical Dimensions ae eaozeam Figure 1 o2sarsnm Figure 2 E Ope Da eet Pact Number ‘Min [Max | Min | Max 0 | 315 x0 [aa [ asa | 075 = a0 [a70 |. | = '980]| 090 [10] os 80 [1.40 [0.70 | 045 T rcRoRR Markin 226 200mm) ozconoFFae i I excerorrae E a ‘zC800s0FF26 (300-53) ‘as0.4arm) ecamaeaEA “Top and Botom ew Topsnd Boom ew es ——- ——_ acaaTerae sideview sideview — & ezoaDT Thermal Derating Curve pecs auton Nats 1. Operon bone sec maximum ange or Hold & Trip Current and Thermal Derating Curve Charaton von he epatedmexram rg tsetre! reng ence tae. ] Trae Pohme: PTO PTC) devices a inended for F-(gl-la-e- ei Prolacon age! cacasineloverauen rertmportre fu concons ad may ot bo Stabe or use nappledions where reposted snclor prolonged taut coratens ae arta Joo contact oF PT dca wih chomon! ster Prolonged contact may avery ipl the PTC Tt ice|will trip ahd protect circuit. | lente peter ge a. Tin doves a rend or ae no oka ‘Dotcom, Use Ae vag tonanone inci doctses win bofuscargrotn. 6: Rotana Soran td eee SACI Ratu fies oecoaatect, sera rotate snr tnt nonce oe 7 = wwe Soro Foe enpraong Ambiont Temperature 1. ibe inst terbace zane parnutee (C) [ofan com erent betcge For Hold Current =" Trip Current ‘gon, cone 8 Fs Ergentng a tC7 es ecosne ores oa oy, and Trip Current femal Percentage of Hold Current ‘Specticaions abject 0 change wihout notoe bel 82s: 206 Van Vorst Street —_—_techhelpebetf.com abelomue Jersey City, NJ 07902 USA belfuse.com (©2014 Bel Fuse, Ine. ZB Feb20153/4Surface Mount PTC OZCB Series (HE]@ 0ZCB Series -1210 Chip RoHS 6 Compliant & Halogenfree Solder Reflow and Rework Recommendations * 1 ae Profie Feature [Pi-Fiee Assembly | [Average Ramo-Up Rate (Tsmax to Tp} [3° / second max. t [Rams rss fovesne inane soe - eer ove g etm eo-t0seene = fennclon 5 heneona) lire E : [Tame (4) 160-150 seconds - PeCiesncain Teno ae cs | ee wi foo Poa 7 i enpeaare tt ot secose t a |Ramp-Down Rate: [s'Cisecond max, 25°C 0 Peak “Ting > fine Pee Toxpire ener Solder slow ‘Due to “lead tree / ROHS 6 " construction of these PTC devices , the required Temperature and Duell Time inthe * Soldering * zone of the reflow profile are greater than those used for non-RoHS devices. 1, Recommended reflow methods ; IR, vapor phase oven, hot air oven, 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended maximum; paste thickness is 0.2Smm. 4, Devices are compatible with standard industry cleaning solvents and methods. Caution {reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework : MIL-STD-2026 Method 210F, Test Condition A. ‘Standard Packaging P/N Explanation and Ordering Information FaANDS [FSSA] 400° 200 tne in 7 ‘OZCBO005FF2E roe oo ‘feck on x xx Time com | ferzinséiequvainn | PTC saree oxoonrt2e ee bee ore ‘lotsa ne wa aig me Getic ton The 00 . ms a Becca Chaectestes ozeenorrat_| 3000 oC ozcensnrrze [0 Nesta Fens (OZOBDITSFFZE 8.000 ‘NwZiecest Spee sero eadtonmna rae [0 Tipe Ret oy Draenor, ‘Specticatons abject to change winout nates bel 82s: 206 Van Voest Street techneiparelfcom abelaup: sersey City, NJ 07302 USA belfuse.com 14 Bel Fuse, ine, ZB Feb2015.