Panasonic Kxtg1070 Service Manual

ORDER NO.
KM40610223CE
Telephone Equipment
KX-TG1070FXB
KX-TG1070FXC
KX-TG1072FXB
KX-TGA107EXB
KX-TGA107EXC
Digital Cordless Phone
Black Version
Blue Version
(for Central Europe)
2006 Panasonic Communications Co., Ltd. All

rights reserved. Unauthorized copying and distribution is a violation of law.
KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC
TABLE OF CONTENTS
PAGE
1 Safety Precaution ------------------------------------------------ 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------- 9
4.4. Circuit Operation (Handset)----------------------------10
4.5. Signal Flow------------------------------------------------- 11
5 Location of Controls and Components ------------------12
5.1. Controls -----------------------------------------------------12
6 Installation Instructions ---------------------------------------12
6.1. Connections------------------------------------------------12
6.2. Battery-------------------------------------------------------13
7 Operation Instructions-----------------------------------------14
7.1. Guide to Telephone Settings---------------------------14
7.2. Handset Registration ------------------------------------14
7.3. For Service Hint-------------------------------------------14
8 Service Mode -----------------------------------------------------15
8.1. Engineering Mode ----------------------------------------15
8.2. How to Clear User Setting------------------------------19
8.3. How to Set When Replacing Unit---------------------20
9 Troubleshooting Guide ----------------------------------------22
9.1. How to Replace the Flat Package IC ----------------23
10 Disassembly and Assembly Instructions ---------------25
10.1. Disassembly Instructions -------------------------------25
11 Schematic Diagram ---------------------------------------------27
11.1. For Schematic Diagram---------------------------------27
11.2. Schematic Diagram (Base Unit_Main) --------------28
11.3. Schematic Diagram (Base Unit_Operation) -------31
11.4. Schematic Diagram (Handset) ------------------------32
12 Printed Circuit Board-------------------------------------------35
12.1. Circuit Board (Base Unit) -------------------------------35
12.2. Circuit Board (Base Unit_Page key) -----------------37
12.3. Circuit Board (Handset) ---------------------------------39
13 Exploded View and Replacement Parts List -----------41
1 Safety Precautions
1.1.
For Service Technicians
ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufactures Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F 20 F (370 C 10 C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturers
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.2.2.
How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
Marked
PbF
35-006057-005-200
U3
The location of the PbF mark is subject to change without notice.
> EP-GW <
RF
U4
(Component View)
Note:
3 Specifications
Note:
Specifications are subject to change.
Connections:
The unit will not work during a power failure. We recommend you connect a standard telephone on the same line for power protection.
Note for Service:
Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
Analog telephone connection: Telephone Line
4 T-DATA 15
6 R-DATA 14
13.824MHz
Crystal
3.3V
RF Module
ANT
17, 18
U2
Base
Band
Controller
50, 51
3.3V
EEPROM
U3
2, 52
64
32
Speech
Network
Q605
Power
DC6V
Locator button
Tel Line
KX-TG1070/1072 BLOCK DIAGRAM (BASE UNIT)
Current
Limiter
DC
Charge Contact 6V
Linear
Regulator
U1
TEL Line
Interface
D1~ D4, Q7
4.1.
37
4 Technical Descriptions
Block Diagram (Base Unit)
4.2.
Circuit Operation (Base Unit)
The base-station consists of base band controller, speech network, tel-line interface, RF module, linear regulator, EEPROM,
crystal and so on. Refer to Block Diagram (Base Unit) (P.7).
4.2.1.
Base Band Controller
These are parts to control all function of the base-station, we used the Philips XS which is controller for DECT. These devices
include all control circuits of the base-station for RF module, tel-line interface, ADPCM codec, series regulator and so on.
4.2.2.
Power Supply
The power supply consists with CM1117 voltage regulator ICs.

CM1117 generate DC 3.3V voltage from DC 6V voltage from adaptor. DC 3.3V are used for RF module & I/O port, DC 2.5V &
DC1.8V are used for the base band controller and the circumference circuits.
4.2.3.
Speech Network
The TR circuit is used for speech network. The function of this connects tel-line interface and the base band controller.
4.2.4.
TEL Line Interface
The function of this connects tel-line and speech network. Also, the tel-line interface include the ring detect circuit, caller-ID circuit.
4.2.5.
EEPROM
This is 8K bits memory. The each kind of value to set-up at power-on, redial memory, speed-dialing memory, and so on are
stored in this device.
4.2.6.
RF Module
Receiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected is
demodulated into RX_DATA signals. And signals is passed to the base band controller.
Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RF
control interface. And then this signal is radiated from antenna.
Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) of
the RF control interface.
4.2.7.
Current Limiter
The current limiter is circuit to supply the proper current to charge batteries of the handset from DC 6V voltage.
Charger Contact
Charger
Battery
Regulator
Switching
2.4V, 2-cell
RF Module
Q10
52
4 T-DATA 15
6 R-DATA 14
Crystal
13.824MHz
16, 17
Base Band
Controller
U4
50, 51
EEPROM
U3
LCD Driver
U2
MIC
Ear Piece
KEYPAD
LCD
KX-TGA107 BLOCK DIAGRAM (HANDSET)
29, 30
32, 33
57~62, 64, 1
54, 55, 56
4.3.
Antenna
Block Diagram (Handset)
4.4.
Circuit Operation (Handset)
The handset consists of Base Band Controller, LCD, RF module, keypad, regulator, charger, EEPROM, crystal, earpiece, ringer
& microphone, and so on.
4.4.1.
Base Band Controller
The base band controller controls all function of the handset, Philips XS for the base band controller is used.
This device include all control circuits of the handset for RF module, LCD controller, keypad interface, earpiece, microphone,
ADPCM codec, switching and series regulator and so on.
4.4.2.
Charger
The base-station supply DC 6V power to the charger and the charger charges the batteries to use this power. The signal on the
charger circuit is generated when the handset is to being charged this signal is used to control the charger circuit and for automatic off-hook by cradle-off when an incoming call is coming.
4.4.3.
2.4V 2 cell & 3.3V output from internal switching regulator
The battery is (2.4V / 2cell) directly supplied to switching regulator which controlling by base band controller and step up the DC
3.3V to the RF module & I/O port. DC 2.5V & DC1.8V are used for the base band and the circumference circuits.
4.4.4.
RF Module
Receiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected is
demodulated into RX_DATA signals. And signals is passed to the base band controller.
Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RF
control interface. And then this signal is radiated from antenna.
Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) of
the RF control interface.
4.4.5.
LCD
The LCD consists of 7-segment, 12 digit display and 13 icon which controlling by the LCD display driver.
4.4.6.
Keypad
The keypad consists of 12 dialing keys and 8 function keys.
10
4.5.
Signal Flow
4.5.1.
Talk mode:
Rx audio signal from line interface at LINERX_P path into B/S MCU (pin 32, 33) and then signal from B/S RF transform, H/S RF
receive signal forward to MCU, H/S MCU from (pin 32, 33) receive path output audio signal to receiver.
Tx audio signal from MIC receive audio signal at mic path into H/S MCU and then audio signal from H/S RF transform, B/S RF
receive signal forward to MCU, B/S MCU audio signal from (Pin 30, 29) at LINETX_P path transmit to line interface out of PSTN.
4.5.2.
Ringer detect:
Telephone line have ringer signal from tip ring into Base, and then Base transistor Q8 turn on and ringer data signal for Base MCU
(Pin 58_IOGP16) detect and the handset buzzer have product Melody tone.
4.5.3.
Type I CID receive:
CID signal from tip ring couple CID signal at (CID1_P, CID1_N) path into Base MCU (Pin 29, 30) detect, Handset display show the
telephone no.
11
5 Location of Controls and

Components
6 Installation Instructions
5.1.
Base Unit
6.1.
Controls
5.1.1.
Base Unit
5.1.2.
Handset
Connections
Note:
Use only the included AC adaptor and telephone line cord.
Connect the AC adaptor securely to the AC outlet.
Charger
Note:
Never install telephone wiring during a lightning storm.
Do not connect the AC adaptor to a ceiling-mounted AC outlet, as the weight of the adaptor may cause it to become disconnected.
Location
For maximum distance and noise-free operation, place your
base unit:
- Away from electrical appliances such as TVs, radios,
personal computers or other phones.
- In a convenient, high and central location.
5.1.3.
Charger
12
6.2.
6.2.1.
Battery
Note:
It takes 10 hours to fully charge the batteries, however, you
can use the handset if
remains on the display while
charging.
It is normal for batteries not to reach full capacity at the initial
charge. Maximum battery performance is reached after a
few complete cycles of charge/discharge (use).
Actual battery performance depends on a combination of
how often the handset is in use and how often it is not in use
(standby).
Even after the handset is fully charged, the handset can be
left on the base unit or charger without any ill effect on the
batteries.
The battery strength may not be displayed correctly after you
replace the batteries. In this case, place the handset on the
base unit or charger and charge for at least 10 hours.
Battery Installation
Note:
Use only the included rechargeable batteries HHR-55AAAB
or HHR-4EPT.
6.2.2.
Battery Charge
6.2.3.
Battery Strength
6.2.4.
Panasonic Ni-MH Battery

Performance
13
7 Operation Instructions
7.1.
Guide to Telephone Settings
7.2.
Handset Registration
7.3.
For Service Hint
14
8 Service Mode
8.1.
8.1.1.
Engineering Mode
Base Unit
15
Note:
(*1) Refer to Handset Registration (P.14).
(*2) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.)
0
Input Keys
0

A
Input Keys
[ ]+2
[ ]+3
[ ]+4
[ ]+5
[ ]+6
16
[ ]+1
8.1.2.
Handset
17
Note:
(*1) When you enter the address or New Data, please refer to the table below.
0
Input Keys
0

A
Input Keys
[ ]+2
[ ]+3
[ ]+4
[ ]+5
[ ]+6
18
[ ]+1
8.2.
How to Clear User Setting
19
8.3.
How to Set When Replacing Unit
If base unit or handset has a defect, replace with new base unit or handset. Refer to the following procedures.
Note:
BS=Base unit, HS=Handset
To register handset, refer to Handset Registration (P.14)
20
Note:
(*1) Refer to How to Clear User Setting (P.19)
21
9 Troubleshooting Guide
If your telephone does not work properly, try to solve the problem according to the following table.
Note:
(*1) Refer to Handset Registration (P.14).
22
9.1.
How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.1.1.
Preparation
PbF (: Pb free) Solder

Soldering Iron
Tip Temperature of 700 F 20 F (370 C 10 C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
9.1.2.
How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
23
9.1.3.
How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
9.1.4.
How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
24
10 Disassembly and Assembly Instructions

10.1. Disassembly Instructions
10.1.1. Base Unit
25
10.1.2. Handset
26
11 Schematic Diagram
11.1. For Schematic Diagram
11.1.1.
Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
11.1.2.
Handset (Schematic Diagram (Handset))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
27
RING_DET
28
Chain Relay
Option 11
R76 TB
C19
10n
GND
R18
TB
R19
TB
GND
Q8
R39
10k
VDD3V2
TP10
Offhook
R31
18k
R33
390k
C129
100n
D603
TB
RL1-A
TB
GND
Q606
TB
R690
TB
TP52
TP54
Path Selection
Option 4
4
3
RL1-B
TB
TB
R665
Offhook
7
5
C29
1N
500V
Onhook
Onhook
TB
R682
6
RL1-C
TB
TB
R678
VAR1
TB
Line Protection
Option 16
ESD
GND
6V_UNREG
R691
TB
R78 TB
R79 TB
C37
10N / 250V
RING
CID1_N
BPHONE_RLY
PJ1
4
3
2
1
R75 TB
Line Selection
Option 2
C30
1N
500V
L7
TIP
C33
C25
TB
MBR Reduction
RING
Type 4
GND
Q601
TB
TB
R50
1/2W
TB
R1
GND
D4
EC1 +
TB
50V
R649
TB
D2
R97
10M
R93
TB
D1
D3
10uH
L4
CID1_P
TB
0805
Option 12
REV1_MBR
GND
R30
390k
C31
100n
TP9
10N / 250V
C36
Type 4
10uH
L1
TB
Toll Count
Filter
Option 3
Earth Break
Option 1
GND
TB
+
Q607
TB
D6
TB
D608
TB
TB
R7
GND
Q12
TB
R28
2k2
R27
2k2
TIP
AC / DC Load
Wetting Pulse
Option 13
REV2_WP
C27
N.C.
Q30
R87
TB
C57
TB
GND
R26
8k2
Q6
Pulse Shape
Option 5
ACDC_LOAD
R92
N.C
Option 17
TB
EC4
TP47
TP48
C28
3n3
C26
N.C.
Q7
Q11
N.C.
TO92
LINE_INUSE
R80
N.C
0603
OFF_HOOK
3K3
TP55
TP57
LINE+2
TB
R659
TP56
GND
GND
TB
C664
TB
GND
TB
Surge Protection
R2
R25
220k
GND
Q10
C34
Option 6
TB
R82
TB
C32
TB
R81
LINE+1
R104
180K
C192
1N
R103
R102
2M
EBR
C
B
TB
Q4
N.C
TB
C656
2n2
R16
N.C GND
TP62
Q2
N.C
R9
NC
GND
R640
GND
R89
TB
LINE + 1
GND
R85 OR
TB
R69
TB
C663
GND
OR
C58
TB
R62
TB
R90
R91 OR
C89
8P2
GND
Q24
TB
GND
TB
R58
TB
R52
TB
TB
C665
TB
R642
TO-92
Q605
RING
TIP
C3
TB
R56
TB
C2
TB
GND
PARA_DET
TP24
TP6
100N
C23
LINERX_P
GND
GND
Q15
TB
R5
TB
VDD3V2
REV2_WP
REV1_MBR
TB
R63
TB
TB
R64
C24
1k
GND
RX
TX
GND
TB
TB
R8
TB
TB
Q5
GND
TB
C21
TB
R38
VDD3V2
R21
TP76
Q1
TB
TP77
R24
TB
TP78
C22
TB
R22
GND
TB
C10
GND
TP74
TX Amplifier
Option 19
TB
C11
TB
C12
TB
R96
TP79
C662
68N
50V
C85
8p2
GND
GND
GND
GND
2K2
R647
TP73
GND
TB
R6
C669
6N8
LINETX_P
GND
C670
8p2
TB
D606
+ 1/2W
Current
Limitation
Option 10
TB
TP75
GND
TB
R648
15K
R646
C1
100N C666
10N
R638 TP71
220K
R637
68K
TP70
C18
TB
R23
TP72
GND
TP69
GND
R635
C8
8p2
R633
100K
N.C: No Components
KX-TG1070/1072FX SCHEMATIC DIAGRAM (Base Unit_Main 1/3)
R57
TB
R54
TB
Q14
TB
R55
TB
VDD3V2
LINETX_P
C35
8p2
C693
8p2
Q604
GND
GND
C38
8p2
TP68
GND
C70
8p2
DC Line Loading
GND
TB
Option 9
Line Reversal Detection
R53
TB
GND
C661
8p2
RLR & SLR
TP65
GND
R639
Option 18
GND
C688
8p2
C668
100N
TP66
TP67
Option 14
GND
TBR38 / 600
R17
N.C
Q3
N.C
TP63
TP49
TB
600R Load
R13
N.C
TP59
TB
R636
TB
R632
Option 20
Parallel Phone Detection
For TG1090 Only
TB
R84
C71
8p2
TB
TB
GND
C6
R11
GND
Sidetone Concellation
Option 15
TB
R10
EC658
10uF C659
TB
50V
R12
Option 8
R88
TB
GND
GND
GND
TB
R83
TB
C657
TP60
R631
C69 4k7
8p2
LINE + 2
Option 7 Complex Load
GND
R15
N.C
R14
N.C
VDD3V2
GND
D610
47V
1.3W
TP61
R20
R36
Q28
TB
R29
TP23
R32
TP58
R644
TP51
11.2. Schematic Diagram (Base Unit_Main)
29
SCL
SDA
R48
1K
D9
TP41
C193
8p2
TP26
TP25
TMS
JTAG INTERFACE
TP27
TDI
TP28
TP18
TCK
TDO
100P
100P
TP19
C118
TP20
TP21
SCL
C119
1
2
3
4
Q9
C79
12P
EC2
100U
NC
C93
100N
C44
12P
R74
510R
C15
1N
R44
10R
R51
10R
R45
100R
VDD2V5
Page Key
PAGE1
PAGE
DI_SPI
DO_SPI
SCK_SPI
CS_SPI
REV2_WP
RING DET
OFF_HOOK
TBR38 / 600
EBR
REV1_MBR
C190
100N
VDD3V2
POWER_CHK
J1
2
1
VDDINT
VDDA
C88
100N
SDA
SCL
C7
8p2
C96
4U7
VDDO
R40
4K7
C194
100N
VSSIO4
IOGP0 / SCL_IIC
IOGP1 / SDA_IIC
VDDIO3
IOGP31 / DI_SPI
IOGP32 / DO_SPI
IOGP33 / SCK_SPI
IOGP34 / CS_SPI
IOGP15 / KB0
IOGP16 / KB1
IPGP17 / KB2
IOGP18 / KB3
IOGP19 / KB4
IOGP20 / KB5
VSSIO1
IOGP21 / KB6
C83
100N
8P2
8P2
C107
C109
C108
C106
C103
C81 C123
100N 8p2
8P2
C53
100N
VDDC
VDD3V2
ACDC_LOAD
C105
C54
100N
C132
100N
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
BUZZER
BPHONE_RLY
TDO
TDI
TCK
TMS
R41
4K7
VDD3V2
Power failure if VDD3V2 < 2.8V
C144 C143
100N 12P
VDD3V2
VR1_CTRL
C90
100N
C45
100N
VDD2V5
R46
1K3
1%
VDD3V2
R47
1K
1%
VDDC1
100U / 6V3
VR2_CTRL
R60
EC10
VDDC
TP40
+ D5
TP39
TP11
C56
8p2
TP5
C61
8p2
VDD3V2
1V8 / 2V5
TP12
R43
1K
ATE INTERFACE
47K
R59
Q13
R42
47K
GND
A0
A1
A2
GND
C124 C99 C49

8p2 2P7 8p2
TP8
C121
8p2
SDA
+6V
TP42
VDD3V2
VCC
WP
SCL
SDA
8
7
6
5
U3
EEPROM
C39
100N
VDD3V2
VDDC
C72
N.C.
U2
BBIC
AOP2
VDDA
AIP2
AIN2
VR2_CTRL
VANLI
VBAT
VMIC
VR1_CTRL
VBGP
VSSA
RF_SIG[0]
RF_SIG[1]
VSSO
XTAL2
XTAL1
8P2
8P2
8P2
C145
100N
VDDINT
TP37
C60
N.C.
TP3
R86
25338
25341
R61
C51
10P
1K
TP16
TP17
TP4
C46
100N
VDDO
GND
GND
C78
8p2
C75
8P2
1K
C94
8P2
C95
15OP
GND
C50
10P
T_ENABLE
RF_S_DATA
RF_S_EN
RF_S_CLK
SLICE_CTR
XTAL1
XTAL2
T_GMSK
R_DATAP
RSSI
RF_CLK_REF
GND
TP1
C82
8p2
GND
LINETX_P
TP13
C5
100N
VBGP VMIC
R77
2K2
TP36
TP35
GND
C41
8p2
GND
EC3
10U
6V3
C73
TP2 8p2
C47
100N
OR
R100
VDDA
GND
OR
R105
OR
R99
OR
R98
OR
R101
GND
GND
C74
8p2
CID_P
CID_N
R72
20K
GND
R73
20K
C43 GND
100n
C42
100n
GND
GND
C142
330P
GND
C141
330P
R35
390K
R34
390K
RX
TX
CID1_N
CID1_P
N.C: No Components
GND
Y1
13.824MHz
XTL - AT - 49
TP38
ANT0_SW
ANT1_SW
VR1_CTRL
POWER_CHK
C52
100N
C86
100N
C84
8p2
C9
100N
LINERX_P
VR2_CTRL
GND
C77
8p2
TP22
TP34
GND
TP15
TP33
R37
N.C.
GND
R66
8k2
C4
100N
C40
N.C.
GND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
GND
C65 C63 C59

N.C. N.C. N.C.
LINE_INUSE
PARA_DET
AON2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
JTAG_TMS
JTAG_TCK
JTAG_TDI
JTAG_TDO
IOGP13
IOGP14 / BIF
VDDC2
VSSC2
VSSINT
PWR_SWITCH
VR3_CTRL
AIP2B
AIN2B
AD3
AD2
AON2
IOGP24 / KB9
VDDIO1
RF_SIG4 / IOGP28
SIF_CLK
RF_SIG[3]
SIF_DATA
RF_SIG[2]
VSSC1
VDDC1
VDDINT
REF_CLK
VSS
RSSI
R_DATA
T_GFSK / T-DATA
VDDO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
C97
12P
Audio Flash
C66
100N
PWRJ2
PIN
3
2
GD
+6V
EC65
470U
10V
GD
+6V
L6
L5
10U
10U
R71
750R
OUT2
OUT1
U1
GND
For TG1090 Only
PWRJ1
N.C
CS_SPI
Option 21
6V_UNREG
C67
8p2
DO_SPI
SCK_SPI
SI
SO
WP
VCC
GND
C126
N.C
VDD3V2
C64
8p2
C166
TB
VDDPA
EC62
8p2
R49
3R
DI_SPI
VDD3V2
3V2
EC63
100U
EC61
1000U
6V_UNREG
470R
R70
Flash
CS
RESET
SCK
ANT0
ANT
C156
12P
C152 C120 C153

12P 2P4 12P
ANT0
ANT1
TP31
TP32
C80
NC
L10
22N
R65
1K
ANT0_SW
Antenna part
GND
D7
R67
1K
C181
12P
C76
12P
C130
100pF
C55
NC
ANT1_SW
C20
1pF
C170
OR
C169
OR
C91
2P4
C101
2p7
Charge LED
TP14
TP7
ANT1
C92 C155
12P 2P4
C87
1pF
N.C
Q29
J8
GND
N.C
C177
TP29
1U
C48
8P2
VDDPA
63
62
61
60
59
58
57
56
55
54
100N
C68
28
52
C162
100N
T_ENABLE
EC163
100U
VDD3V2
17
18
19
20
21
22
23
24
25
26
27
29
53
31
30
32
C148
4.7pF
TP30
51
COB2
RF
J7
CRD
50
48
27R
1/4W
R109
L3
10uH
N.C
C16
TP53
C171
J7
CRD +
49
N.C
C14
N.C.
40
ANT
N.C: No Components
C154
12P
R107
N.C
N.C
C176
47
1
N.C.
N.C
45
R108
43
5
44
T_GMSK
TB
R_DATAP
U6
41
8
RF_S_DATA
7
RF_CLK_REF
TP46
46
2
C17
C13
1
1
39
RF_S_EN
VDD3V2
42
6
1
1
38
10
RF_S_CLK
R4
TB
12
I
I
34
L2
10uH
37
11
SLICE_CTR
30
RSSI
6V_UNREG
15
HANDSET BATTERY CHARGER
36
13
35
14
33
16
VDD3V2
11.3. Schematic Diagram (Base Unit_Operation)
J1
1
2
KEY1
KX-TG1070/1072 SCHEMATIC DIAGRAM (Base Unit_Operation)
31
ESD1
EC26
47u / 4V
CHARGE_CTRL / CRAD_DET
ESD_TEETH / 5637
ESD2
ESD_TEETH / 5637
PWR_SW
L1
22U
D6
SL8
SL7
SL5
SL6
R26
10K
TP11
VBAT
R24
NC
C85
NC
TP4
TP8
L2
27UH
D3
NC
R28
OR
TP103
EC19
200u / 4V
3V3
TP9
C25 +
100N
CHARGE CONTACTS
TP43
Q5
D5
L3
27UH
R34
1K
TP105
C72
100N
TP104
R43
1K
TP102
Q9
Q1
D4
D1
R35
680R
C87
1N
R27
430R
OR
R10
NC
R15
R4
15K
R42
15K
C17
1N
TP5
E
E
VDD3V3
C
C
TP101
B
B
VBAT
32
I
I
Z1
C7
12P
C8
100N
C19
100n
3.5V MAX
VBAT
VDDC
C45
100N
VDD2V5
1V4
C44
12P
Q10
2V5
TP10
EC6
47u / 4V
VR2_CTRL
VR1_CTRL
EC2
47u / 4V
TP12
C26
12p
R50
6k2
R53
6k8
VBAT
FIL1
GND
OUT
Battery
NC
NC
SL 4
SL 3
SL 2
SL 1
VDD2V5
U2
VDD
Fuse Trace
C84
4U7
VBAT
R7
10R
R45
100R
R44
10R
VDDINT
VDDO
2V5
VDDA
C9
100N
R46
18K
1%
ESD_TEETH / 5637
ESD_TEETH / 5637
ESD4
BAT_CHK
Power failure if VBAT < 2V
TP7
ESD3
R47
30K
1%
VBAT
N.C: No Components
KX-TGA107 SCHEMATIC DIAGRAM (Handset_Main 1/3)
Q6
B
TP108
11.4. Schematic Diagram (Handset)
C77
12P
VCC
WP
SCL
SDA
TCK
TP18
ATE INTERFACE
TDI
TP19
SCL
TMS
TDO
VDD3V3
TP114
TP115
TP116
TP117
TP118
TP112
TP113
KBIO6
KBIO0
KBIO1
KBIO2
KBIO3
KBIO4
KBIO5
TP20
TP21
1
2
3
4
C48
100N
A0
A1
A2
GND
EEPROM
CHARGE_CTRL / CRAD_DET
8
7
6
5
SDA
VBAT
SCL
SDA
R40
1K
JTAG INTERFACE
TP25
TP24
TP23
TP27
TP26
TP119
TP120
TP121
TP123
TP124
12P
VDDC
C81
12P
VDDIO4
IOGP0 / SCL_IIC
IOGP1 / SDA_IIC
VDDIO3
IOGP31 / DI_SPI
IOGP32 / DO_SPI
IOGP33 / SCK_SPI
IOGP34 / CS_SPI
IOGP15 / KB0
IOGP16 / KB1
IOGP17 / KB2
IOGP18 / KB3
IOGP19 / KB4
IOGP20 / KB5
VSSIO1
IOGP21 / KB6
C78
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
LCD_BL
TDD
TDI
TCK
TMS
R56 OR
12P
R60 NC
AMP_EN / BEEP
VDD3V3
KBIO9
R41
1K
VDD3V3 VDD3V3
LCD_SI
LCD_SCL
LCD_CS / TCOM_BL
R61 OR
R62 NC
SCL
SDA
VDD3V3
TP109
C35
100N
TP156
C76
VDDC
U4
BBIC
C36
100N
C54
100N
GND
GND
R16
TP6
TP16
R11
1K
R39
OR
C79
12P
AOP2
VDDA
AIP2
AIN2
VR2_CTRL
VANLI
VBAT
VMIC
VR1_CTRL
VBGP
VSSA
RF_SIG [0]
RF_SIG [1]
VSSO
XTAL2
XTAL1
TP111
12P 12P 12P 12P 12P 12P 12P 12P
GND
GND
TP137
GND
C42
12P
R21
OR
T_GMSK
GND
GND
C67
NC
TP132
REC+ / SPK_AMP+
C51
10P
C50
10P
GND
100N
TP131
GND
12P
C47
C61
NC
C34
VDDA
C23
12P
C52
100N
GND
R_DATAP
RSSI
RF_CLK_REF
T_ENABLE
RF_S_DATA
RF_S_EN
RF_S_CLK
SLC_CTR
TP129
GND
Y1
13.824MHz
GND
TP1
R12
N.C.
C46
100N
TP128
TP127
VR2_CTRL
HANDFREE_BL
BAT_CHK
VMIC
VR1_CTRL
TP130
C31
12P
TP110
VDDO
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PWR_SW
C15 C16 C18 C20 C24 C37 C38 C40
12P
VDDINT
100N
C33
C80
U3
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
JTAG_TMS
JTAG_TCK
JTAG_TDI
JTAG_TDO
IOGP13
IOGP14 / BIF
VDDC2
VSSC2
VSSINT
PWR_SWITCH
VR3_CTRL
AIP2B
AIN2B
AD3
AD2
AON2
IOGP24 / KB9
VDDIO1
RF_SIG4 / IOGP28
SIF_CLK
RF_SIG [3]
SIF_DATA
RF_SIG [2]
VSSC1
VDDC1
VDDINT
REF_CLK
VSS
RSSI
R_DATA
T_GFSK / T-DATA
VDDO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1K
C39
100N
GND
C60
NC
TP134
C64
100N
C82
NC
R14
62K
C5
NC
GND
C4
12p
C83
12P
C20
OR
GND
C29
12P
TP138
C53
330N
C2
10N
TP136
GND
TP143
GND
C27
12P
C30
330N
R23
N.C
C62
NC
TP142
R3
N.C
TP141
R13
N.C
C71
NC
C65
12P
C73
N.C
C74
N.C
C75
NC
TP135
GND
Z3
NC
VCC
VO1
R22
47K
C55
1N
GND
VIN
VO2
CD
FC2
FC1
U1
AMP_EN / BEEP
GND
C41
22N
Z2
NC
VMIC
TP14
R32
OR
RX
TX
GND
GND
12P
C11
GND
C12
12P
R30
OR
TP13
GND
GND
C43
12P
GND
C89
100N
VDD3V3
GND
C90
12P
C6
12P
C57
12P
GND
U7
GND
GND
GND
12P
C59
100N
C56
TP15
GND
12P
C58
EC1
10u /16V
U6 (MIC)
GND
C3
100N
TC5
47U / 4V
TANT
REC
TP29
GND
GND
R2
1K2
R1
1K2
TP3
C49
NC
SPK2
SPK1
GND
C21
12P
N.C: No Components
R19
4K7
REC / SPK_AMP
TP139
C22
1U
TP140
R33
OR
TP125
R5
OR
TP126
C1
10N
C28
NC
GND
REC+ / SPK_AMP+
OPTION FOR TG1090 ONLY
C70
12p
C66
NC
C63
100N TP133
GND
C91
4U7
GND
C32
12P
VDD3V3
33
1
REC / SPK_AMP
EC8
220u / 4V
GND
VBAT
GND
41
42
43
44
45
46
GND
47
C13
100N
C10
OP75
22
23
24
2R
R31
17
GND
12P
C69
GND
63
C68
100N
GND
62
T_GMSK
18
R_DATAP
19
RF_CLK_REF
20
SLC_CTR
61
RF_S_CLK
10
RF_S_EN
RF_S_DATA
EC4
47u / 4V
VDD3V3
RSSI
60
GND
C14
12P
GND
21
COB1
RF
GND
59
58
57
56
25
26
40
55
54
39
27
38
53
37
28
36
29
11
52
35
30
12
51
34
50
13
31
14
32
33
49
16
48
15
T_ENABLE
R58
TP2
GND
C88
4U7
0
K1
K7
K15
12P
C157
TP155
R54
NC
R110
27R
R94
2R2
Q20
C
VDD3V3
D10
Q8
R95
100K
Key Assignment
K22
8
K11
7
K23
6
K16
5
K12
4
K24
3
K3
2
K5
K10
K21
On - H
PWR
Down
K19
Up
K4
OK
K27
K25
PB
K6
Off - H
K20
K13
34
+
ANT1
R52
1M
BUZ1
TP154
R48
470R
C147
12P
R49
100K
K1
K11
#8
K2
Phone
K3
#5
K12
OFF
K10
#3
K13
K4
K5
K19
Down
#2
K15
K7
#6
K16
#9
TCOM
K6
K21
#1
K25
K20
SPK
#4
K24
K23
K22
#7
RD
7 - Segment LCD
LCD INTERFACE ( 3V2 )
LCD_SI
LCD_SCL
LCD_CS / TCOM_BL
VDD3V3
TP44
TP42
TP40
TP39
TP38
TP36
TRIANGLE KEYPAD ( 28 keys max )
Right dot / M
K27
Left dot / C
Up
VDDA
AMP_EN / BEEP
KBIO9
KBIO6
KBIO5
KBIO4
KBIO3
KBIO2
KBIO1
KBIO0
#0
12 Printed Circuit Board

12.1. Circuit Board (Base Unit)
12.1.1. Component View
C148
EC2
L7
ANT0
C170
L1
D4
D2
C664
C45
C44
D1
TP14
RF
RL1
C76
C91
C92
EC61
D3
Q11
R50
C166
U6
R98
R4
TP46
C119
R101
C144
C662
R51
C143
EC10
C61
R85
Q3
R45
Y1
R91
D606
R640
TP59
TP63
R17
R69
R44
R83 C89
R12
R90
R9 C663
C657
TP60
Q2
C118
R40
R41
U3
Q605
R89
EC1
EC163
C79
R636
R105
R88
D610
R87
C58
R57
Q24
C57
R74 R60
EC658
C93
R649
R99
EC4
R93
C3
COB2
C83
C90
R62
Q15
Q13
C71
Q607
C69
Q12
BUZ1
D5
Q14
R42
R48
C97
C54
C99
J1
Q9
D9
TP41
R59
TP39
TP49
TP52
TP42
R43
R33
R31 C2
C19
R53
C88
R56
J8
C155
C154
TP40
R54
C129
TP54
Q8
C153
C120
C152
EC65
L4
35-006055-003-200
PbF
>EP-GW<
R109
C20
C30
L10
L6
C101
VAR1
R65
EC63
C29
L5
L3
L2
J7
C30
R67
TP7
PWRJ1
C55 C181
PWRJ2
PJ1
D7
C80 C156
C169
C87
ANT1
EC3
KX-TG1070/1072 CIRCUIT BOARD (Base Unit (Component View))
35
12.1.2. Flow Solder Side View
TP29
TP31
TP53
R75
C25
C62
C33
C64
C126
R7
C66
R70
TP57
R2
R71
TP32
C14
C13
TP30
C16
R79
C171
C17
R76
R678
R78
TP9
C36
R665
C28
R20
D603
Q7
Q30
R659
R22
R38
TP78
C27
D6
R103
R14
TP61
R94
R3
R82
C192
R104
R73
C142
R72
TP58
C141
TP1
TP8
TP43 R95
C43
R102
C32
R81
R97
R15
Q20
C34
R35
R34
TP2
C42
C49
C11
C21
TP44
R29
R644
R642
R638
R6
TP62
C10
TP45
R68
C656
D608
R36
R635
C666
R646
C12
TP69
Q4
R107
D10
R32
R633
C38
C693
C85
TP77
C661
C1
C669
R13
TP73
TP71
R21 R16
TP74 TP79
TP75 R24
Q5
R64
C18
C22
TP70 R637
R648
C670
C59
R58
C23
R52
C668
TP76
R96
R11
C6
TP72
R647
R84
R10
TP68
TP6
TP65
Q1
TP15
C24
R639
TP67
R37
C63
C194
C665
R77
R63
R8
C47
C74
C35
R632
R23
C73
C15
R46
R47
C56
TP36
C9
TP35
C52
C5
C77
C86
C84
C41
TP13
C50
C51
C96
C46
TP38
C78 R66
TP34
C688
TP22
TP37
TP5
C65
C193
C60 TP3
C72
C40
TP66
C4
TP33
C82
C123
C81
U2
C659
C70
R631
C8
C176 C177
Q29
TP24
TP27
TP18
TP25
Q606
Q10
Q604
C145
TP55
R28
TP12
R100
R27
PAGE1
TP11
TP28
TP26
Q6
R18
R26
R19
TP47
C121
R5
C39
R55
C190
TP19
C53
C124
C7
C132
R39
TP20
TP17
TP4
C162
TP21
R61
R86
R92
TP16
R1
R690
TP51
C26
C95
C48
C68
C94
C75
C106
C107
C108
C109
TP48
C103
R691
R80
R25
C105
TP10
Q28
R49
TP56
Q601
R108
U1
R30
C31
C37
R682
C67
TP23
KX-TG1070/1072 CIRCUIT BOARD (Base Unit (Flow Solder Side View))
36
12.2. Circuit Board (Base Unit_Page key)

TP1
TP2
KEY1
KX-TG1070/1072 CIRCUIT BOARD (Base Unit_page key (Component View))
37
Memo
38
12.3. Circuit Board (Handset)

PbF
> EP-GW <
35-006057-005-200
TP126
R33
C11 TP111
C12 COB1
R5 TP110
TP125
TP14
R30
ANT1
TP2
C10
R58
TP13
C6
R32
C49
RF
C20
C16
TP120
EC8
Q5
TP137
TP148
R38
Q7
R18
R9 TP145
TP117
Z2
TP136
TP153
C74
Z3
SL8
SL3
TP29 TP15
R40
TP18 TP19 TP20

C87
C85
FIL1
C43 C73
R27
TP113
R10
R35
Q10
C41
SL4
L2
D5
C17
TP109
C84
TP21
R41 TP112
R61
R26
Z1
R47
TP135
R2
R46
C75
C28
TP4
C76
R56 R60
R50
R53
R1
TP11
U2
TP152
SL1
D3
TP43
L3
Q6
TP7
TP26 TP25 TP24 TP23
TP132
TP156
C35
R62
C77
R15
TP3
C50
C5
C3
C34
C21
C23
C47
C32
C31
TP134
U4
C67 TP131
C83
TP108
C91
TP133
C48
TP114
TP128
C9
C4 C70
C64
C66
C82
C63
R14
TC5
C39
TP115
C52
C89
C90
SL7
U3
TP27
TP129
C2
TP149
Q3
TP151
TP150
C1
R8
TP147
TP144
TP130
Y1
Q2
Q4
R7
TP12
R59
R37
R16
TP123
C80
C33
C78
TP121
C36
TP6
R12
TP119
TP124
C45
C44
R6
R44
C54
C81
R11
C61 R20
C62
C51
C79 C46
TP139 C29 R19
R21 C53
C60
TP138
TP1
R39
D4
TP140 TP143 TP141

C71 R13
R3
C65
C22
R23 C30
C27
R49
R45
R48
C147
TP16
Q9
EC2
TP146
C88
C157
R110
R94
TP155
C26
R29
TP116
C57
C56
EC19
C19
TP118
TP127
C7
C8
R43
R42
TP9
EC26
D10
Q20
TP142 TP105 R95 TP154
R22
C55
D1 R34 TP104
C58
SPK2
SPK1
C72
TP102
Q1
R54
U1
TP103
TP10
BUZ1 EC1
R52 C59
R24
EC6
TP101
Q8
C13
R4
D6
TP8
TP5
C14
C25
L1
C24
C15 C38
C18
EC4
C68
R28
R31 C69 C42 C40 C37
SL6
SL2
SL5
KX-TGA107 CIRCUIT BOARD (Handset (Component View))
39
12.3.2. Flow Solder Side View

PbF
FM7
FM5
35-006057-005-200
> EP-GW <
TP35
TP34
TP33
TP32
TP28
TP30
U7
2 1
TP44
TP42
TP36
TP40
TP39
TP38
TP22
K13
K6
K27
K20
K4
K21
K2
K19
K10
K25
K5
K3
K24
K12
K16
K23
K11
K15
K22
K1
K7
TP17
FM4
U6
KX-TGA107 CIRCUIT BOARD (Handset (Flow Solder Side View))
40
13 Exploded View and Replacement Parts List

1. RTL (Retention Time Limited)
Note:
The marking (RTL) indicates that the Retention Time is limited for this item.
After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time.
The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing part
and product retention. After the end of this period, the assembly will no longer be available.
2. Important safety notice
Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufactures parts.
3. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.
Note:
(*1) HANDSET without BATTERY COVER ASSY
(*2) You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
Ref. No.
A1
A1
A2
A2
A3
A4
A5
A6
A6
Part No.
PQZBG1070FXB
PQZBG1070FXC
PQZHGA107EXB
PQZHGA107EXC
PQWETGA107CE
PQWATG1070CE
PQQX15467Z
8060094500
8060094600
Part Name & Description

BASE UNIT (RTL) (for KX-TG1070FXB/1072FXB)
BASE UNIT (RTL) (for KX-TG1070FXC)
HANDSET (RTL) (for KX-TG1070FXB/1072FXB) (*1)
HANDSET (RTL) (for KX-TG1070FXC) (*1)
CHARGER UNIT with AC ADAPTOR (RTL) (for KX-TG1072FXB)
AC ADAPTOR (for Base Unit)
INSTRUCTION BOOK (*2)
LID, BATTERY COVER ASS'Y (for KX-TG1070FXB/1072FXB)
LID, BATTERY COVER ASS'Y (for KX-TG1070FXC)
Remarks
ABS-HB
ABS-HB
G/N
KXTG1070FXB
KXTG1070FXC
KXTG1072FXB
KXTGA107EXB
KXTGA107EXC
41

Panasonic Kxtg1070 Service Manual

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Panasonic Kxtg1070 Service Manual

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ORDER NO.

2006 Panasonic Communications Co., Ltd. All

For Service Technicians

ICs and LSIs are vulnerable to static electricity.

1. Danger of explosion if battery is incorrectly replaced.

About Lead Free Solder (Pbf: Pb free)

Suggested PbF Solder

How to Recognize that Pb Free Solder is Used

(Example: Handset P.C.B.)

The location of the PbF mark is subject to change without notice.

> EP-GW <

KX-TG1070/1072 BLOCK DIAGRAM (BASE UNIT)

Circuit Operation (Base Unit)

Base Band Controller

The power supply consists with CM1117 voltage regulator ICs.

TEL Line Interface

KX-TGA107 BLOCK DIAGRAM (HANDSET)

Block Diagram (Handset)

Circuit Operation (Handset)

Base Band Controller

2.4V 2 cell & 3.3V output from internal switching regulator

The keypad consists of 12 dialing keys and 8 function keys.

Type I CID receive:

5 Location of Controls and

Panasonic Ni-MH Battery

Guide to Telephone Settings

For Service Hint

Desired Number (hex.)

Desired Number (hex.)

How to Clear User Setting

How to Set When Replacing Unit

How to Replace the Flat Package IC

PbF (: Pb free) Solder

How to Remove the IC

3. While the solder melts, remove it together with the IC pins.

How to Install the IC

How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.

10 Disassembly and Assembly Instructions

Base Unit (Schematic Diagram (Base Unit_Main))

Handset (Schematic Diagram (Handset))

Line Reversal Detection

RLR & SLR

For TG1090 Only

Option 7 Complex Load

11.2. Schematic Diagram (Base Unit_Main)

Power failure if VDD3V2 < 2.8V

C124 C99 C49

C65 C63 C59

For TG1090 Only

C152 C120 C153

HANDSET BATTERY CHARGER

11.3. Schematic Diagram (Base Unit_Operation)

KX-TG1070/1072 SCHEMATIC DIAGRAM (Base Unit_Operation)

Power failure if VBAT < 2V

11.4. Schematic Diagram (Handset)

12P 12P 12P 12P 12P 12P 12P 12P

C15 C16 C18 C20 C24 C37 C38 C40

OPTION FOR TG1090 ONLY

LCD INTERFACE ( 3V2 )

TRIANGLE KEYPAD ( 28 keys max )

KX-TGA107 SCHEMATIC DIAGRAM (Handset_Main 3/3)

12 Printed Circuit Board

KX-TG1070/1072 CIRCUIT BOARD (Base Unit (Component View))