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4. (C13) Giải Thích Hoạt Động Của Các Khối Mạch Trong Board MSP430G2553
4. (C13) Giải Thích Hoạt Động Của Các Khối Mạch Trong Board MSP430G2553
KHOA IN IN T
CLB NGHIN CU KHOA HC
Tp. H Ch Minh, ngy 28 thng 03 nm 2015
PH LC THI TUYN C13
C9:
ceramic
capacitor
C9: as
close to
pin 1 and
pin 20 as
possible
3 .3 V
P
P
P
P
P
P
P
P
P
1
1
1
1
1
1
2
2
2
.0
.1
.2
.3
.4
.5
.0
.1
.2
1
2
3
4
5
6
7
8
9
10
U 1
VC C
P 1 .0
TXD
R XD
P 1 .3
P 1 .4
P 1 .5
P 2 .0
P 2 .1
P 2 .2
G N D
XIN
XO U T
TEST
R ST
SD A
SC L
P 2 .5
P 2 .4
P 2 .3
2
1
1
1
1
1
1
1
1
1
0
9
8
7
6
5
4
3
2
1
P
P
P
P
P
P 2 .6
P 2 .7
TE S T
R ST
1 .7
1 .6
2 .5
2 .4
2 .3
1
2
S1
4
3
X T A L s e le c t
SW-dip
SW S1 ON to
connect to
external
crystal
M SP430G 2553
package: 20 PDIP
Y 1
XO U T
3 2 .7 6 8 K h z
Crystal
3 .3 V
C 6
N P
C5, C6:
ceramic
capacitor
NP = not
populated
R 5
47K
J16
1
2
3
G N D
TEST
R ST
2 - w ir e J t a g
header 3
R ST
C 10
1n
C10 1n
(102):
ceramic
capacitor
SW 4
R eset
SW4:
two-pin
button
a. Chip MSP430G2553: chip vi iu khin 16-bit cua TI, thuc dong Value Line cua MSP430.
b. Tu C9 104 (tc 100nF hay 0.1uF): tu pi (tu gm hay tu ceramic) dung loc nhiu ngun. Tu ny
cn phi c t gn 2 chn cp ngun cho MCU, tc l gn chn 1 v 20 cua U1.
c. Y1: thach anh 32.768 KHz (thach anh tao dao ng ng h thi gian thc).
d. SW-DIP: cng tc dung kt ni thach anh ngoai vo chip. Khi SW-DIP gat sang pha ON th
thach anh c ni vi chn P2.6 v P2.7
e. Tu C5, C6: loc nhiu, n nh cho thach anh. V chip MSP430G2533 c tch hp sn tu bn trong
chip, do tu gn ngoi thng khng cn thit. Tuy nhin, gi tr tu cng c th cn phi hiu
chnh do cc nh sn xut thach anh cung cp cc thng s khc nhau. Do , v tr 2 tu ny c
trng, d phong khi cn hiu chnh (NP = not populated).
1
f.
J16: Header 3, dung nap code v debug MCU (thng qua chun JTAG 2 dy SBW Spy-Bi-
Wire).
g. Khi R5, C10, SW4: dung reset chip. Thng thng chn Reset cua MCU (chn s 16 RST)
c treo tr ln ngun (mc logic 1). Khi nhn nt SW4, chn ny c ni xung GND (mc
logic 0), chip c reset.
1 5.3V
C1
1 0 0 0 u /2 5 V
C3
104
V in
OUT
A C 12V
DOMINO BIG 2
U2
7805
3
D1
LED
C2
1 0 0 u /1 6 V
C4
104
U3
L 1 1 1 7 -3 v 3
V in
OUT
3 v 3 r e g u la t o r
C7
2 2 u /1 6 V
C8
104
3 .3 V
AC2
GND
5V
DB1
J1
DB1: Diode-Bridge
1 Ampere
GND
AC 1
C1,
C2,C7,C13:
electrolytic
capacitor
R2
470
R1
1K
D3
L E D g re e n
J11
POWER SUPPLY
C 14
104
1
2
3 v 3 la u n c h p a d
R3
470
3v 3 Launch P ad
Header 2
a. J1: Connector cp ngun 12VAC t bin p. V tnh tin dung, trong mach ny nn chon Domino
cp ngun.
b. DB1: Cu diode 1A, c th dung 4 diode n ghp lai, tuy nhin s dung linh kin cu Diode
(1A, loai tron) s lm mach gon hn.
Cu diode xem thm bi gii thiu linh kin xc nh chn, lu kim tra s th t chn trong
capture v layout gn ng cu diode.
(v d y: chn s 4 (+), chn s 2 (-), 2 chn 1 v 3 l 2 chn AC tng ng vi footprint
trong th vin PayItForward. i vi linh kin Capture khng ng th t chn ny, bn c th
chn Edit part chnh li).
c. Cc loai tu ho: 1000uF, 100uF, 22uF (uF = F = microFara): cn mc in p cho php cao
hn mc p t trn n khi mach hoat ng nhn vi h s an ton khong 1.5 2 ( mch ny,
khi lm vic t 1000u chu p khong 16V, t 100u: 5V, t 22u: 3.3V).
Gi tr ghi in p ghi trn mach l gi tr tham kho, cc ban c th chon tu c mc volt ln hn.
Tu ho l tu phn cc, yu cu pad ng vi chn dng phi c hnh vung hoc ch nht (pad
con lai chn m hnh tron hoc oval /oblong). Khi gn tu ho vo mach, lu cc tnh. Nu
gn nhm (+), (-) s lm tu n.
d. Tu khng phn cc: Tu gm c m hiu 104, tc c gi tr l 100nF hay 0.1uF, tu ny khng c
cc tnh.
Cc loai tu trn dung lm phng in p v loc nhiu cho mach ngun.
e. in tr: R1 (1kOhm), R2, R3, R10 (470 Ohm) loai 1/4W thng thng.
D4
L E D y e lo w
R 10
470
f.
5 V & 3 V 3 O U T 3 .3 V
J14
2
4
6
1
3
5
3v 3 O U T
J2
2
4
6
5V
1
3
5
5V O U T
3. Khi LED
Gm 8 LEDs (loai no cng c).
LED MODULE
3 .3 V
R 11
2
3
4
5
6
7
8
9
R E S IS T O R S IP 9 3 3 0 o h m
D 5
LED
D 6
LED
D 7
LED
D 8
LED
D 9
LED
D 10
LED
D 11
LED
D 12
LED
J17
1
2
3
4
5
6
7
8
PO R T LED
thanh (gm 8 in tr n c 1
chn ni chung vi nhau).
b. J17 l header 8 dung cm dy ni sang cc port tn hiu cua MSP.
Khi chn tn hiu cua MSP430 c mc logic 0 (tng ng nh ni vi GND), LED s sng.
4. Khi ADC
a. J3: cp ngun v kt ni khi ADC.
A D C M O D U LE
J3
1
2
header 2
For ADC module:
+ Pin1 connects to 3V3
+ Pin 2 connects to
ADC channel
R 4
1K
VR 1
10K
"Volume"
varistor
MSP).
c. VR1: bin tr dung thay i gi tr i n p tai pin 2 cua J3. C th s dung bin tr loai
volume cho d vn.
BUTTON MODULE
3 .3 V
3 .3 V
R 6
47K
BT1
+ Nt nhn SW.
R 7
47K
C11, C12:
ceramic
capacitor
SW 2
B T2
C 12
104
SW2,
SW3:
two-pin
buttons
SW 3
0V (mc 0).
1
2
B T1
B T2
header 2
EXTENDED PORT
J6
PO R T 2
header 8
1
2
3
4
5
6
7
8
P
P
P
P
P
P
P
P
2 .0
2 .1
2 .2
2 .3
2 .4
2 .5
2 .6
2 .7
1
2
3
4
5
6
7
8
1 .0
1 .1
1 .2
1 .3
1 .4
1 .5
1 .6
1 .7
COMMUNICATION
PORT
J12
I2 C
1
2
3
P 1 .6
P 1 .7
SCL: P1.6
SDA: P1.7
J13
U AR T
1
2
3
P 1 .1
P 1 .2
RXD: P1.1
TXD: P1.2
1
2
3
4
5
P
P
P
P
J15
SPI
1 .4
1 .5
1 .6
1 .7
STE: P1.4
CLK: P1.5
SOMI: P1.6
SIMO: P1.7
8. Khi Transistor
Khi mach khuych ai c bn dung Transistor BJT
TRANSISTOR
MODULE
5V
C1815.
R 12
1k
D 13
LED
J18
t r a n s it o r
1
header 1
R 13
2k7
Q 1
Q 2SC 1815
Transistor,
TO-92
package
BCN CU LC B