HARDWARE_DISCUSSION

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Updated Jul 1, 2011 by phuongmi...@gmail.com

Chuyn mc v thit k phn cng

K m thm chuyn mc ny nhm to iu kin cho cc k s hardware c th trao i, tho lun, chia
s nhng kinh nghim ca mnh. Mi ng gp kin ca 1 thnh vin s gp phn cho s pht trin k
thut nhng non tr ca VN chng ta.
Cc kit trn TopKit4You c to ra nhm phc v cho ngi bt u hoc l sn phm nh gi c
th quyt nh sn xut a ra sn phm thng mi hon chnh. C nhn hoc t chc cng ty thng
qua cc ti liu trn wiki ny c th tng hp li v to ra h thng ng nht.
Hy vng lung ny s to c sn chi bnh ng cho cc bn yu thch lnh vc in t ni chung v
lnh vc ch to h thng nhng ni ring.

PQFP208 Pakage, tng d m kh

AT91SAM9260 tn ti vi 2 loi package PQFP208 v LFBGA217. i vi k s hardware th vic chn
package ca CPU l 1 trong nhng vic u tin cn lm. Sau y chng ta s tm hiu 1 s u v
nhc im ca hai kiu package ny.

PQFP208
Kch thc vt l ca PQFP208 c th tham kho hnh di y:

u im
- D thit k trong layout, PCB 2 layers l .
- Chn a ra ngoi d debug.
- Quy trnh hn vo PCB n gin.

Nhc im
- Kch thc to, nng, cng knh.
- Do chn rt c cao --> cc pin rt yu d b cong vnh.
Do chn rt yu, v th cc thao tc hn theo kiu th cng phi ht sc cn trng. Nu p qu lc ln
pin th s ra hin tng pin b lch qua 1 bn, rt kh iu chnh li v tr ban u.
Trong qu trnh chip hot ng, nhit tng cao, cc chn rt dn n v nhit. Cc mi hn th cng d
b bong, kt ni gia pin v SMD pad b mt, gy ra tnh trng li khi chy chng trnh ng dng.

LFBGA217

u im
- Kch thc nh gn, tit kim khng gian PCB ng k.
- S lng pin v mt pin cao.
- bn c hc cao.

Nhc im
- Vic thit k PCB i hi k thut cao, PCB nhiu lp.
- Cn phi tun th theo quy trnh nht nh trong qu trnh hn IC.
- Do cc chn di bng nn rt kh debug phn cng.

Nhn Xt
Xt v mt lp rp th cng, quy trnh hn BFGA217 tuy phc tp nhng nu tun th ng cch th thi
gian thc hin s ngn hn v tin cy trong hot ng cng cao hn so vi vic s dng PQFP208.

Thit k PCB s dng LFBGA217

ARM MPU c nhiu cp khc nhau, chp c cu hnh cng cao th cu trc v (pakage) cng phc
tp, thm ch i vi cc chp c cu hnh thp nh sn xut vn cho option package BGA, n gin v
n c li im chim t khng gian PCB. Cu trc ma trn (ball matrix) gip thu gn kch thc die ng
k, mt d s lng chn rt ln (c th ln n hn 600 pins).
Bn l k s thit k phn cng cho ARM th chc chn s c 1 thi im no s lm vic vi cc
chp BGA ny. Bi vit ny mnh gii thiu mt s thng tin, cch i dy nh th no chng ta c th

gim thiu s ng kt ni, bi v cc thit k da trn BGA i hi mt i dy v sp xp linh kin

rt cao.

Package BGA c dng ma trn cc ball (lm bng ch bi), cc hng c nh du theo cc k t A, B,
C, D... v cc ct c nh du theo th t 1,2,3,4. Nu ta nhn k, gc ca chp (nhn t mt di)
c k hiu mi tn nhm biu th v tr chn A1. Thng s c bn ca BGA m chng ta cn bit l
pitch, y l khong cch ngn nht ga 2 ball lin k nhau. Pitch c nhiu gi tr khc nhau, ty theo
tng loi chp bao gm : 1.27, 1.0, 0.8, 0.5, 0.4 ... Trong bi vit ny ta tm hiu cch i dy (BGA route
escape) cho loi pitch 0.8 mm LFBGA 217 pin, loi v ny c s dng cho mt s chp ARM9 ca
ATMEL bao gm AT91SAM9260, AT91SAM9261, AT91SAM9G20...
i dy, cc ball lp nm ngoi chng ta c th kt ni trc tip vo trace, lp lin k c th i xuyn
qua k h gia 2 ball ca lp ngoi. Ta c th i 1 hoc 2 trace trong cng 1 khe, tuy nhin, s trace
cng nhiu th rng ca trace s gim ( m bo khong cch ti thiu trace to trace, trace to smd
pad...) tr khng c tnh ca ng truyn s tng ln, nh vy iu kin kt cu rng buc ca PCB b
ph v (v d tr khng chun l 50 ohm). Hnh sau biu th cch i dy lp ngoi v lp lin k i vi
chip LFBGA217:

Vic i dy cc lp ball bn trong tr nn kh khn hn. Chng ta s s dng vias thc hin cng
vic ny, hin nay ngi ta c th s dng nhiu k thut vias khc nhau:
+ Through vias: Via n gin v c in l through hole (xuyn t trn xung di, chi ph sn xut thp
nht)
+ Micro vias: Chn smd ca ball (land pad) s c khoan 1 l nh bng laser, l ny n thng vi layer
lin k bn di (di Top layer).
+ Blind vias: L c khoan t layer mt ngoi n layer mt trong, nhng khng xuyn qua PCB, ta
khng th nhn xuyn qua l via c v th mi c tn gi l "via m".
+ Burry vias: L via c khoan v n thng cc layer nm bn trong, nu xem t 2 mt (TOP &
BOTOM) th ta ko th thy l vias ny bng mt thng, chnh v th ngi ta gi l "via chn".
v d trn ta s dng through hole vias, n gin v r tin nht. C nhiu cc b tr l vias khc nhau,
thng dng v n gin chng ta s b tr n nm trng tm ca hnh vung to bi 4 balls. Vic t
cc vias ny rt n gin, tool design PCB ta set grid vi phn gii l BGA pitch/2, khi y vic t
cc vias ny tr nn d dng hn,sau khi t cc vias ny xong, ta c th dng trace kt ni cc vias
n cc smd land pad. i vi tool Allegro PCB editor th cc thao tc ny cc k n gin, ta ch vit
copy connect line v paste vo ng v tr th l xong, xem hnh minh ha cch b tr vias

Cc lp bn trong c th c i dy vi Layer Bottom, ta nn i dy theo kiu i xng vi hai trc x,y,

iu ny gip gim tnh phc tp cho vic route escape.

Mt thit k c xem l tt nu cc t in decoupling nm st chn VCC nu c th. Cch tt nht t

cc t ny layer BOTTOM. Thng thng cc chn VCC ca chip c tip ngun b cc lp PWR.
Ta nn set ch full contact ga cc PWR PLANE vi cc vias PWR thay v s dng cc nan hoa
thermal (xem hnh) nhm m bo in tr nh nht.

Tuy nhin, v d LFBGA217 trn ta s dng 2 layer, v th cc ng PWR s c i bi lp BOT

hoc TOP m thi. Hnh sau minh ha cch b tr cc t decoupling:

Vi rng trace 6 mils, dy PCB khong 0.86 mm th tr khng c tnh 167 ohm. Vic phi hp cho
PCB 2 layer rt kh thc hin, tuy nhin ta c th khc phc v ci thin h s phn x bng cch thm
vo cc in tr Rs (chip array resistor, t gn v tr MPU): Z source + Rs = Z trace, trong Z souce l
tr khng ra ca chp BGA, Ztrace l tr khng ca trace. thit k trn Rs = Ztrace - Zsource = 167 8.5 = 158.5 ohm, kh ln so vi gi tr chun (22-33 Ohm).
Ring v chip AT91SAM9 s dng b nh SDRAM v th vic phi hp tr khng ko cn i hi cao lm,
ta c th khc phc bng cch gim khong cch ga MPU v SDRAM hoc tng gi tr drive strengh
ca source pin.
Ring tn hiu SDRAM SCLK ta c gng duy tr tr khng l 50 ohm, khong cch vi cc trace khc ti
thiu l 20 mils.

Kt lun, vi PCB 2 lp, chng ta c th thit k h thng ARM chy h iu hnh Linux vi chi ph u
t tt nht.