You are on page 1of 74

Notes

CHIP Name: X-SAP-WDY-CHIP:BSSP_NOTES


Feeder Class: CL_BSSP_NOTES

Description
In the Notes CHIP, you can store, display, change, or delete notes.

Inports
Port Parameter

Data Element

Parameter Tags

BORTYPE

SWO_OBJTYP

/BSSP/:BORTYPE

Attachments
CHIP Name: X-SAP-WDY-CHIP:BSSP_ATTACHMENTS
Feeder Class: CL_BSSP_ATTACHMENTS

Description
In the Attachments CHIP, you can store, display, change, or delete attachments.

Inports
Port Parameter

Data Element

Parameter Tags

BORTYPE

SWO_OBJTYP

/BSSP/:BORTYPE

General Ledger Account


CHIP Name: X-SAP-WDY-CHIP:BSSP_GL_ACCOUNT
Feeder Class: CL_BSSP_GL_ACCOUNT
BOR Object: BUS3006

Description
This CHIP displays the data of the General Ledger Account.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

SAKNR

SAKNR

/BSSP/:SAKNR

Customer
CHIP Name: X-SAP-WDY-CHIP:BSSP_DEBITOR
Feeder Class: CL_BSSP_DEBITOR
BOR Object: KNB1

Description
This CHIP displays the data of the customer.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

KUNNR

KUNNR

/BSSP/:KUNNR

Vendor
CHIP Name: X-SAP-WDY-CHIP:BSSP_CREDITOR
Feeder Class: CL_BSSP_CREDITOR
BOR Object: LFB1

Description
This CHIP displays the data of the vendor data.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

LIFNR

LIFNR

/BSSP/:LIFNR

Cost Center
CHIP Name: X-SAP-WDY-CHIP:BSSP_COSTCENTER
Feeder Class: CL_BSSP_COSTCENTER
BOR Object: BUS0012

Description
This CHIP displays the data of cost center.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 6

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

KOSTL

KOSTL

/BSSP/:KOSTL

Profit Center
CHIP Name: X-SAP-WDY-CHIP:BSSP_PROFITCENTER
Feeder Class: CL_BSSP_PROFITCENTER
BOR Object: BUS0015

Description
This CHIP displays the data of the profit center.

Inports
Port Parameter

Data Element

Parameter Tags

PRCTR

PRCTR

/BSSP/:PRCTR

KOKRS

KOKRS

/BSSP/:KOKRS

Internal Order
CHIP Name: X-SAP-WDY-CHIP:BSSP_INTERNALORDER
Feeder Class: CL_BSSP_INTERNALORDER
BOR Object: BUS2075

Description
This CHIP displays the data of the internal order.

Inports
Port Parameter

Data Element

Parameter Tags

AUFNR

AUFNR

/BSSP/:AUFNR

User
CHIP Name: X-SAP-WDY-CHIP:BSSP_USER
Feeder Class: CL_BSSP_USER
BOR Object: USER

Description
This CHIP displays the data of the user.

Inports
Port Parameter

Data Element

Parameter Tags

BAPIBNAME

XUBNAME

/BSSP/:BAPIBNAME

Statistical Keyfigure
CHIP Name: X-SAP-WDY-CHIP:BSSP_KEYFIGURE
Feeder Class: CL_BSSP_KEYFIGURE
BOR Object: BUS1138

Description
This CHIP displays the data of the statistical keyfigure.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

STAGR

STAGR

/BSSP/:STAGR

Company Code
CHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANYCODE
Feeder Class: CL_BSSP_COMPANYCODE
BOR Object: BUS0002

Description
This CHIP displays the data of the company code.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

Activity Type
CHIP Name: X-SAP-WDY-CHIP:BSSP_ACTIVITYTYPE
Feeder Class: CL_BSSP_COMPANYCODE
BOR Object: BUS1031

Description
This CHIP displays the data of the activity type.

Inports
Port Parameter

Data Element

Parameter Tags

LSTAR

LSTAR

/BSSP/:LSTAR

KOKRS

KOKRS

/BSSP/:KOKRS

Material
CHIP Name: X-SAP-WDY-CHIP:BSSP_MATERIAL
Feeder Class: CL_BSSP_MATERIAL
BOR Object: BUS1001

Description
This CHIP displays the data of the material.

Inports
Port Parameter

Data Element

Parameter Tags

MATNR

MATNR

/BSSP/:MATNR

WERKS

WERKS

/BSSP/:WERKS

Bank Account
CHIP Name: X-SAP-WDY-CHIP:BSSP_BANK_ACCOUNT
Feeder Class: CL_BSSP_BANK_ACCOUNT
BOR Object: BSSP_ACEXT

Description
This CHIP displays the data of the bank account.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 2

Inports
Port Parameter

Data Element

Parameter Tags

BKKRS

BSSP_BKKRS

/BSSP/:BKKRS

ACNUM_EXT

BSSP_ACNUM_EXT

/BSSP/:ACNUM_EXT

Bank Data
CHIP Name: X-SAP-WDY-CHIP:BSSP_BANK
Feeder Class: CL_BSSP_BANK_DATA
BOR Object: BUS1011

Description
This CHIP displays the data of the bank data.

Inports
Port Parameter

Data Element

Parameter Tags

BANKS

BSSP_BANKS

/BSSP/:BANKS

BANKL

BSSP_BANKL

/BSSP/:BANKL

Business Area
CHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSAREA
Feeder Class: CL_BSSP_BUSINESSAREA
BOR Object: BUS0003

Description
This CHIP displays the data of the business area.

Inports
Port Parameter

Data Element

Parameter Tags

GSBER

GSBER

/BSSP/:GSBER

Business Partner
CHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPARTNER
Feeder Class: CL_BSSP_BUSINESSPARTNER
BOR Object: BUS1006

Description
This CHIP displays the data of the business partner.

Inports
Port Parameter

Data Element

Parameter Tags

PARTNER

BU_PARTNER

/BSSP/:PARTNER

Business Process
CHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPROCESS
Feeder Class: CL_BSSP_BUSINESSPROCESS
BOR Object: BUS1036

Description
This CHIP displays the data of the business process.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

PRZNR

PRZNR

/BSSP/:PRZNR

Commodity
CHIP Name: X-SAP-WDY-CHIP:BSSP_COMMODITY
Feeder Class: CL_BSSP_COMMODITY
BOR Object: BUS5120

Description
This CHIP displays the data of the commodity data.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 3.

Inports
Port Parameter

Data Element

Parameter Tags

COMMODITY_ID

CHAR18

/BSSP/:COMMODITY_ID

Company
CHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANY
Feeder Class: CL_BSSP_COMPANY
BOR Object: BUS0014

Description
This CHIP displays the data of the company data.

Inports
Port Parameter

Data Element

Parameter Tags

RCOMP

RCOMP_D

/BSSP/:RCOMP

Controlling Area
CHIP Name: X-SAP-WDY-CHIP:BSSP_CONTROLLINGAREA
Feeder Class: CL_BSSP_CONTROLLINGAREA
BOR Object: BUS0004

Description
This CHIP displays the data of the controlling area.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

Cost Element
CHIP Name: X-SAP-WDY-CHIP:BSSP_COSTELEMENT
Feeder Class: CL_BSSP_COSTELEMENT
BOR Object: BUS1030

Description
This CHIP displays the data of the cost element.

Inports
Port Parameter

Data Element

Parameter Tags

KSTAR

KSTAR

/BSSP/:KSTAR

KOKRS

KOKRS

/BSSP/:KOKRS

Cost Object
CHIP Name: X-SAP-WDY-CHIP:BSSP_COSTOBJECT
Feeder Class: CL_BSSP_COSTOBJECT
BOR Object: BUS1079

Description
This CHIP displays the data of the cost object.

Inports
Port Parameter

Data Element

Parameter Tags

KSTRG

KSTRG

/BSSP/:KSTRG

Fixed Asset
CHIP Name: X-SAP-WDY-CHIP:BSSP_FIXEDASSET
Feeder Class: CL_BSSP_FIXEDASSET
BOR Object: BUS1022

Description
This CHIP displays the data of the fixed asset.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

ANLN1

ANLN1

/BSSP/:ANLN1

ANLN2

ANLN2

/BSSP/:ANLN2

Functional Area
CHIP Name: X-SAP-WDY-CHIP:BSSP_FUNCAREA
Feeder Class: CL_BSSP_FUNCAREA
BOR Object: BUS0023

Description
This CHIP displays the data of the functional area.

Inports
Port Parameter

Data Element

Parameter Tags

FKBER

FKBER

/BSSP/:FKBER

Futures Account
CHIP Name: X-SAP-WDY-CHIP:BSSP_FUTURES_ACCOUNT
Feeder Class: CL_BSSP_FUTURES_ACCOUNT
BOR Object: BSSP_FUTAC

Description
This CHIP displays the data of the futures account.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 6

Inports
Port Parameter

Data Element

Parameter Tags

FUKRT

FUKRT

/BSSP/:FUTAC

BUKRS

BUKRS

/BSSP/:BUKRS

Securities Account
CHIP Name: X-SAP-WDY-CHIP:BSSP_SECURITIES_ACCOUNT
Feeder Class: CL_BSSP_SECURITIES_ACCOUNT
BOR Object: BSSP_SECAC

Description
This CHIP displays the data of the securities account.

Inports
Port Parameter

Data Element

Parameter Tags

SECAC

BSSP_SECACC

/BSSP/:SECAC

BUKRS

BUKRS

/BSSP/:BUKRS

Security ID Number
CHIP Name: X-SAP-WDY-CHIP:BSSP_FINANCIAL_PRODUCT
Feeder Class: CL_BSSP_FINANCIAL_PRODUCT
BOR Object: BUS1076

Description
This CHIP displays the data of the security ID number.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 2.

Inports
Port Parameter

Data Element

Parameter Tags

SECURITY_NUMBER

VVRANLWTR

/BSSP/:SECURITY_NUMBER

Accounts Payable Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AP
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays links to the accounts payable reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Accounts Receivable Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AR
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays links to the accounts receivable reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Asset Accounting Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AA
Feeder Class: CL_BSSP_FINREP_FI_AA
BOR Object: BUS1022

Description
This CHIP displays links to the asset accounting reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

ANLN1

ANLN1

/BSSP/:ANLN1

ANLN2

ANLN2

/BSSP/:ANLN2

Cost Center Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_CCA
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS0012

Description
This CHIP displays links to the cost center reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

KOSTL

KOSTL

/BSSP/:KOSTL

Document Flow
CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_DOCFLOW
Feeder Class: CL_BSSP_DOCUMENT_FLOW

Description
This CHIP displays a link to the Document Relationship Browser.

Inports
Port Parameter

Data Element

Parameter Tags

BORTYPE

SWO_OBJTYP

/BSSP/:BORTYPE

Email Services
CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_EMAIL
Feeder Class: CL_BSSP_EMAIL

Description
This CHIP displays links to Email Services

Inports
Port Parameter

Data Element

Parameter Tags

BORTYPE

SWO_OBJTYP

/BSSP/:BORTYPE

Internal Order Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_OPA
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS2075

Description
This CHIP displays links to the internal order reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

AUFNR

AUFNR

/BSSP/:AUFNR

KOKRS

KOKRS

/BSSP/:KOKRS

General Ledger Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_GL
Feeder Class: CL_BSSP_FINREP_FI_GL
BOR Object: BUS3006

Description
This CHIP displays links to the general ledger reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

SAKNR

SAKNR

/BSSP/:SAKNR

Product Cost Reporting


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_PC
Feeder Class: CL_BSSP_FINREP_CO_PC
BOR Object: BUS1001

Description
This CHIP displays links to the product cost reporting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports
Port Parameter

Data Element

Parameter Tags

MATNR

MATNR

/BSSP/:MATNR

Asset Accounting Posted Depreciation


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC_C
Feeder Class: CL_BSSP_FINREP_FI_AA
BOR Object: BUS1022

Description
This CHIP displays the posted depreciation in asset accounting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

ANLN1

ANLN1

/BSSP/:ANLN1

ANLN2

ANLN2

/BSSP/:ANLN2

Cost Center Breakdown Actual Planned Costs by


Period
CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_PERIOD_BD_C
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS0012

Description
This CHIP displays the breakdown of actual versus planned costs by period for a certain cost center.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

KOSTL

KOSTL

/BSSP/:KOSTL

Cost Center Cumulative Actual versus Planned Costs


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_ACT_PLAN_AGGR_C
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS0012

Description
This CHIP displays the cumulative actual versus planned costs for a certain cost center.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

KOSTL

KOSTL

/BSSP/:KOSTL

Customer Balances Period Drill Down


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_PERIOD_C
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays a period drill down for customer balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Balances Totals


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS_C
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays the totals for customer balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Due Date Analysis


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS_C
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays a due date analysis for a certain customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Due Date Forecast


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST_C
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays a due date forecast for a certain customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Overdue Analysis


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE_C
Feeder Class: CL_BSSP_FINREP_FI_AR
BOR Object: KNB1

Description
This CHIP displays an overdue analysis for a certain customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

General Ledger Account Balance


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_GL_ACC_BALANCE_C
Feeder Class: CL_BSSP_FINREP_FI_GL
BOR Object: BUS3006

Description
This CHIP displays the data of the G/L account balance.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

SAKNR

SAKNR

/BSSP/:SAKNR

Internal Order Actual vs. Planned Costs by Period


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_PERIOD_BD_C
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS2075

Description
This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

AUFNR

AUFNR

/BSSP/:AUFNR

KOKRS

KOKRS

/BSSP/:KOKRS

Internal Order Cumulative Actual-Planned Costs


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR_C
Feeder Class: CL_BSSP_FINREP_CO_OM
BOR Object: BUS2075

Description
This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

AUFNR

AUFNR

/BSSP/:AUFNR

KOKRS

KOKRS

/BSSP/:KOKRS

Material - Aggregated Actual versus Planned Costs


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR_C
Feeder Class: CL_BSSP_FINREP_CO_PC
BOR Object: BUS1001

Description
This CHIP displays the aggregated actual versus planned costs for a material.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package

Inports
Port Parameter

Data Element

Parameter Tags

MATNR

MATNR

/BSSP/:MATNR

Material - Breakdown Actual versus Planned Costs


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_PERIOD_BD_C
Feeder Class: CL_BSSP_FINREP_CO_PC
BOR Object: BUS1001

Description
This CHIP displays the breakdown of the actual versus planned costs by period for a material.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

MATNR

MATNR

/BSSP/:MATNR

Vendor Balances - Period Drilldown


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_PERIOD_C
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays the period drilldown for vendor balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Balances _ Totals


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS_C
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays the vendor balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Due Date Analysis


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS_C
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays the analysis of the vendor due dates.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Due Date Forecast


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_FORECAST_C
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays the vendor due date forecast.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Overdue Analysis


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE_C
Feeder Class: CL_BSSP_FINREP_FI_AP
BOR Object: LFB1

Description
This CHIP displays the vendor overdue analysis.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Asset Accounting - Posted Depreciation


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC
Feeder Class: CL_BSSP_FINREP_FI_FORM
BOR Object: BUS1022

Description
This CHIP displays the posted depreciation in asset accounting.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

BUKRS

BUKRS

/BSSP/:BUKRS

ANLN1

ANLN1

/BSSP/:ANLN1

ANLN2

ANLN2

/BSSP/:ANLN2

Customer Balances - Totals


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: KNB1

Description
This CHIP displays the totals for the customer balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Due Date Analysis.


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: KNB1

Description
This CHIP displays the due date analysis for a customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Due Date Forecast.


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: KNB1

Description
This CHIP displays the due date forecast for a customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Customer Overdue Analysis.


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: KNB1

Description
This CHIP displays the overdue analysis for a customer.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Internal Order - Cumulative Actual versus Planned


Costs
Chip Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR
Feeder class: CL_BSSP_FINREP_FORM
BOR object: BUS2075

Description
This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Port Parameter

Data Element

Parameter Tags

AUFNR

AUFNR

/BSSP/:AUFNR

KOKRS

KOKRS

/BSSP/:KOKRS

Material Aggregated Actual versus Planned Costs


CHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: BUS1001

Description
This CHIP displays the aggregated actual versus planned costs for a material.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

MATNR

MATNR

/BSSP/:MATNR

Vendor Balances - Totals


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: LFB1

Description
This CHIP displays the totals for the vendor balances.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Due Date Analysis.


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: LFB1

Description
This CHIP displays the analysis of the vendor due dates.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4.

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Due Date Forecast.


CHIP Name: X-SAP-WDY-CHIP: BSSP_FI_AP_DUE_FORECAST
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: LFB1

Description
This CHIP displays the due date forecast for a vendor.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Vendor Overdue Analysis.


CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE
Feeder Class: CL_BSSP_FINREP_FORM
BOR Object: LFB1

Description
This CHIP displays the overdue analysis for a vendor.

Information for Side-by-Side Scenario


Available as of ECC 6.0, Enhancement Package 4

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

Web Services (Bank)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BANKL
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: BUS1011

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

BANKS

BSSP_BANKS

/BSSP/:BANKS

BANKL

BSSP_BANKL

/BSSP/:BANKL

Web Services (Business Partner)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BUPA
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: BUS1006

Description
This CHIP displays links to external web services.

Inports
Port Parameter

Data Element

Parameter Tags

PARTNER

BU_PARTNER

/BSSP/:PARTNER

Web Services (Company)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_RCOMP
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: BUS0014

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

RCOMP

RCOMP_D

/BSSP/:RCOMP

Web Servics (Cost Center)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KOSTL
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: BUS0012

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

KOKRS

KOKRS

/BSSP/:KOKRS

KOSTL

KOSTL

/BSSP/:KOSTL

Web Services (Customer)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KUNNR
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: KNB1

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

KUNNR

KUNNR

/BSSP/:KUNNR

BUKRS

BUKRS

/BSSP/:BUKRS

Web Services
CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS

Description
This CHIP displays links to external Web Services.

Inports
Port Parameter

Data Element

Parameter Tags

BORTYPE

SWO_OBJTYP

/BSSP/:BORTYPE

Web Services (Profit Center)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_PRCTR
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: BUS0015

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

PRCTR

PRCTR

/BSSP/:PRCTR

KOKRS

KOKRS

/BSSP/:KOKRS

Web Services (Vendor)


CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_LIFNR
Feeder Class: CL_BSSP_LAUNCHPAD_LINKS
BOR Object: LFB1

Description
This CHIP displays links to external Web Services

Inports
Port Parameter

Data Element

Parameter Tags

LIFNR

LIFNR

/BSSP/:LIFNR

BUKRS

BUKRS

/BSSP/:BUKRS

You might also like