eScrap Refiner's Shopping Cheat SheetGold CPU Recovery Yields And Values These are rough estimates, some valves may vary ‘VERY HIGH" YEILD CPU's — Have 0.25 gram or mare per piece. HIGH? YEILD CPUS - Have fron 0.05 gram up to 0.25 gram per piece. LOW" YELLD CPUs — Have undes 0.05 gram per piece. ‘VERY HIGH YEILD CPU’ (CERAMIC) EC rr chip -RO000)-0.77g per COU ‘Toshiba (server chip) 0.27 g per CPU AMD K5 - 04 gper CPU (DS g is pretty much speculated} ‘Pentium Prone hoy gail of scammers} 0.3 up to (15 g per COU (1 per PU figure is speeaeed ty oa gpl aca Pid le ht ged manag it CPUS cache (ic 386 - 025 g per PU (rin 686-2166? ISEMHE- 01279 perCP {BH 686 PR200-025 ope CPU Original Intel Pentium EO -90Mh2 0.48 g per COU ‘Nba DEC large square not small round heatsink) -038 Silver /0.549 Gold per CPU. HIGH YEILD CPU's (CERAMIC) ‘Grin 486-011 g per COU IBM 586-0. gper PU IBM Blue Lighting DID 486-VS80 gA ~O.11 g per PU “eras lnstramerts #85 0.19 per CU Intel 4865K-03 9 per CPL i486 TAABBDLC-NA2 gp CAL ‘AMO (ary creen fits} -0.11 g per PU (yx 688 -021 9 ger COU (rox Ma -0.18 g per CPU ‘Winchip 0.17 gperCBU Inne 486 0X4 -0.19 oper COU Inte 496 +02 -0.209 per Pu Inmet 1960-016 ger CU M0495 - 0.129 per OU AMD (row fiber} -008 oper CPU ‘AMD KS 0.11 gper PU ‘AMD Athlon-B 900MM 141 per CPU nel Petia & MM (ceramic) 0.12 9 per CPU nel Petia MME rami) O12 per CPULOW YEILD CPUS (less than 0.05 g per CPU) (tel Pentium 1 MIX - biack fibre Celemun -black fibre Celemn- geen fire Glens ne Bert 2st ne Pentium 3 -siat one Pentium 5 alles Pentium 4 types tal Con = al pes ‘tel Core 2 Dwo - all types (neal 13,75, (7 — all types ‘Gold extraction values depend on recovery techniques used One ofthe most neglected processes are cashing {ring oF ceramics in bal il (stone crusher and fine grinding of bre CPUs NOTE: CPUs corein net just gol but sive inthe ser tin, pistinum (most lore CPUs) and palladium These should ‘be tested forand recptetedf detered in AR solution MLCCS (chip capacitors & capacinw ary) on fire CPUs and some ceric contain palladium and ster. (Ceramic (PU Lids (Au plated, assorted): Upto doce /tbof gald pled old mak ids ‘+ Grample caletation 81 various lids = 15585 grams af ids= 12 square inches These yield 305 g of Au. Thats 0.0574 gf Au per lor 2264 of Au/ Kg ‘Gold inside Ceramic EPROM chips (Vintage Ceramic EPROM chips) sa hd plated legs (god inside the windows. ra god plated caps) -7-B per lb Cid plated eos ocd inside the windows, with cid planed caps) 2-4 gper 1b “Tin (or Sve) planed ngs (gold inside the windows gl pated cap) ~05-2 per 1b “Tin (or iver plated igs gcd ine the windows, with ond plated cape) 2-3 gpe 1b (Gold inside chips (plastic black, flatpacks not PU) lpi tegir certain ie A plastictesin type fless than 1 gper bg) «middle yield - all square and rectangular with pins on all 4 sides and 2 ies pin chips om RAM (1-49 peri) tighten pp est fon sand ar tbe be cite amr 5 parka) Neal a ene teas sigafoo lien ose ts Fact ia yl nye (over 6g per ka)RAM Modules (DIMM, SDRAM, et.) Raw weight oF gold pisted fingers. fully asserted RAM sticks ~ 06-09 g/ 100 sticks. ICs on the RAM modules contain precious metals as well and shouid be processed with other plastic Cs such as flatpacks. RAM Sticks with tin piste fingers wil yield precious metals rom (Cs only. Fingers (rom RAM Sticks, AGP, ISA, PC Cards) 1-15 Lb of cose et ngers that ae pated on bth sides should cehrnat lesson gold © 18.35 gms of gold = 4.539237 kilograms ram foger L ge =.005 grams af god. + So# pouhive 74 gof finger than-74 0.005 = 1444 go old approsimately 75999kaat gold. All ther fingers types average between 15-29 / ib ample cation: 40 ls oF PC bases phy yet 25s oF Ager (average. OSI per 1 of board A 600s gaya age cartboard kd boron 4 pallet should yd 3713 bof fingers Tht Boing comerted into gla - 74.25 g/ ‘$1 = 2555 Troy Ce ‘Gold Plated Pins (CPU Socket Pins, Test Pins, Jumper Pins, jumpers, Connector Pins, et.) “Tene ae marytypes of gold pated pins frequency antenna connectors, test pins, jumper pin: true DE imeace “aneors,ecesion ad sos SA, CL, MeP,20-K, PO-E RAM module sockets, ‘etc, These average between 2-69 per ib otis Viel values igh pend en pit processes ued fu or part plating uch a Facing (aves clot [SA and PC! stots, em. Full Gold Plated PCBs (Military Grade PCBs) Depending on plating overage and recoverymnethod may {ied between 1-4.¢cf gid per tb. Full Gold Plated PCBs (Vintage PCBs, Communication Equipment, Cell Phone PCBs) Dapanding on plating coverage and recovery method may ‘eld beeen 05.3 g of gold per ib.SMD LEDs SMD LEDs yield upto 2.43% Gold by ts raw weight no solder incuded in the weight) Yield rates ‘vary depending on LED Manufacare. (Ceramic Crystals aka Resonators (SMD) ‘Ceramic EMD Resonatars cn be harverted fom any high equency operated PCBs imo cel. phones PCBs telecommunication equipment. military creat boards} and mey yield over 2 9 oF ‘gold tb. Palladium in Monolithic Capacitors (MLCCS) Palincum (Minty. Ag ard and oxasionally Por Au ~ 2-258 per mass weight (lean, 10 solde"| Depending on mankfacuringyexr upto 1982 ony 70-75! ‘batch wend comin PMs -15-25 9 by ‘Tantalum Capacitors Scrap (electrolytic caps) ‘There are many favors of rarteum pects beth in thu hole or SMD packaging These _srapcpactors sl for $100-180. Good to \ callet them and sell to 2 refiner! we \ SMD Resistors * ' SMD restos & SMD resin arays ae a nice smell source of iver and Patiacum toe GP pater peop! ee” OOS eer ECMs (cars, trucks, semis with OBD type interface) ECM aka ECU’ (Engine EOM, Transmission £CM ete )are hybrid U's that control your vehicle's engine, interact with ‘sensors. ans so on. These yield good amount of gold sive, ‘palladium and platinum ECM’ casing is made out of Alurinum alloys —can be sold to base metals recyclers.\C2UL Phones (without batteries) ‘Dib of cel phones scrap yields between and 1. 9 of Gold oer cll phones models yield the most RECYCLING SCRAP VS DIGGING HOLES fens Een ct atl phones ade S018. FTI 4, of gold ore pe Sate - :WEIGHTS OF CPUs & ICs 4g 24 pin socket IC (ceramic) 14-24 pinsocket Erm i), 7g-40-pin socket IC (ceramic) 249-40 486 DB g-AMDKGEKG2 118 g-AMD Duron Athlon (ceramic socket A) ‘11. g-AMD Duron /‘Athlon / (plastic socket A) 149 g-AMD Adhion (siot A cartridge only) 330 g-AMD Athlon (slot A passive heatsink) 41.g-AMO elon XP Semon /__ AM / AMD sch) 42 g-Cyral ald) 35 q-HOPARisc 7100/7150, 119 -fnciing HS} 43 g-IBM éxB6L (gold wp) (25 g-IBM 6xBEMX (brown top) 29 g-IDTWinGhip Ca 249-60 (rami), 169-386 cei) 10g-Ine 387 (craic) (24 g-Innel 486 (ceramic) 44 g- Intel 486 Overdrive ‘36 g-- Intel Pentium 60/66 (ceramic - Socket 4), ‘61 g- Intel Pentium 60/66 (god tp ~Secket 4) 175 gletel Penta Overive ncuding HS fn) “48 g--Intel Pentium 75, 90. (gald top -socket 5/7) 30 g--Irtel Pentium (ceramic) 48 g-fincluding HS 70 g- (reuing HS & ar) 20 g- Inte! Pentium (plastic} 38 g -(ineluding HS 63.9 - (reuing HS & ar) 9 glint Perio Pro id) 42 gle Gelern SEB sc package bre cad-NO ache) (Note ALL masses rounded upto next nearest ram “45 g-tel Celeron SEP® slot package (bare cad with cache) 153 g-Iel Perum I SECC slot package (bare ‘aridge-NO hess) (eluding active HS & far) ‘upto 330 g-lmel Peiuml sot package (standard sized passive HS) po 445 g-lme Pentium Il sot package very lange 280 g-met Pertium ll slot package (sandard sized passive HS) upto 370-ltel Penium Il sot package (vey Large Passive 5) 93g Intel Pentium Il Celeron PRGA 370) 25 g-lntel Perum Il / Celeron FPGA 370 Tati) 24 g-ntel Peru (425 socket) 239 g-lntel Peru 1 / Celeron (78 socket) 22 g-lntel Peru 1 / PentiumD / (775 socket) 129 g-intel Xeon Prestria} 59 qed Xeon (Galatin MP) 35 g-te eon Nocona rvindal 877 9-ictucing ‘copper HS) 14 q- Motorola 68020 (ceramic) 7g-Motrls 6586 (rei) 157 q-NEC maar CB rectangular craic uae ode) 35 g-WA/ Git rai ot tom)