Photolithography

layerof
is photolithograph
then developed
TheThis
purpose
the pattern
is toand
deposit
a layer is
oftransferre
photoresi
onto
wafer
on a the
wafer

Purpose

Before applying photoresist, it is

Rinse
and spin
drydirt, and
important
to remove
dust,
other contaminants from the wafers

Wafer
Cleaning

Bake after applying

Apply photoresist
evenly photoresist
in a circular motion

Apply Photoresist

Masks are used to produce patterns on wafers

Mask Alignment and Exposure

Shining
UV lightthat
through
the mask
The
photoresist
has been
exposescan
some
of be
theeasily
photoresist
exposed
then
GLASS
removed,
leaving the unexposed
Cr
photoresist on the wafer
Masks are made of glass and chromium
PHOTORESIST
PR

METAL
WAFER

Before
align mask
Onceexposing,
aligned, expose
to
and UV
wafer
light

After
developing,
hard-bake
the
Place
wafer
in developer
to remove
wafer, andthat
then
you
are exposed
ready to to
photoresist
has
been
etch!
UV
light

Develop