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Chapter 0

Overview to Integrated

Circuits

1956Shockley,

Bardeen, Brattain
"for their researches on
semiconductors and their discovery

of the transistor effect"


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First transistor
Bell Labs, 1948

(IC)
logic
2000 JackBipolar
Kilby
1960s

"for his part in the invention of the


integrated circuit"
ECL 3-input Gate
Motorola 1966

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Intel 4004 (1971)


1000
1 MHz

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Intel (2014)

2014, Core i7, 5960X Haswell :


26, 22 ,
355 mm2,
3.5GHz, 20MB .

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1004M
smartphones
Small
Signal RF

2000 2008 2009 2010 2011 2012 2013


Units

435M 1177M 1130M 1391M 1546M 1738M 1822M

Power
RF

Power
Management

Analog
Baseband

Source: IDC Worldwide Mobile Phone Tracker, Jan. 27, 2014.


Digital Baseband
(DSP + MCU)

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Apple A8 Processor

(GPU)

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(CPU)


Moores Law

1929
Intel
PhD, Caltech, 1954
67
8

1965Moore IC()
1824

IC
IC
18

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IC

feature size ()
5(um, micron)

0.13 um -> 90nm -> 65nm -> 45nm (40nm)


28nm/22nm/14nm
10nm
nm nanometer1(1/1,000,000,000)

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10

1959
1960
1961
1962
1963
1964
1965
1966
1967
1968
1969
1970
1971
1972
1973
1974
1975

LOG2 OF THE NUMBER OF


COMPONENTS PER INTEGRATED FUNCTION

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16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0

Electronics, April 19, 1965.

11

(ROM)

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12

IC

Source: SIA 2007


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13

(CPU)

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cost:

-per-transistor

1
0.1

Fabrication capital cost per transistor (Moores law)

0.01
0.001
0.0001
0.00001
0.000001
0.0000001
1982

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1985

1988

1991

1994

1997

2000

2003

2006

2009

2012

16

IC
https://www.youtube.com/watch?
v=JDROPMoNZpk

17

IC

18

Silicon Wafer

12 (30cm)

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IC ()

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ICPizza

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IC

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22

IC

M7

M6
M5
M4
M3
M2
M1
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IC ?

24

Intel CPU

Tzi-Dar Chiueh

25

Power (Watts)

100
P6
Pentium proc
10
8086 286
1

8008
4004

486
386

8085
8080

0.1
1971

1974

1978

1985

1992

2000

Year

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Source: Intel

26

IC
100000

18KW
5KW
1.5KW
500W

Power (Watts)

10000
1000
100

Pentium proc

286 486
8086 386
10
8085
8080
8008
1 4004
0.1
1971 1974 1978 1985 1992 2000 2004 2008
Year

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Source: Intel

27

Power Density (W/cm2)

10000

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1000
100

Rocket
Nozzle
Nuclear
Reactor

8086
Hot Plate
10 4004
P6
8008 8085
Pentium proc
386
286
486
8080
1
1970
1980
1990
2000
2010
Year

Source: Intel

28

1664

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?
1965 2015?
30

10nm, 5nm

(3D)

3D ( FinFET)

(3D IC)

(Monolithic 3D IC)

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System in package

31

3D IC ---

(13, 32)

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3D IC --- (TSV)

Through-silicon Via (TSV)

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300mm 30mm.

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Monolithic () 3D IC

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IC

do this good job

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