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Hotstamping

LDS(ldsen.html)
2Componentmolding(id2component
Filminsertmolding(filminsertmolding.html)
molding.html)
Hotstamping

Aspecialfilmstructureisbondedwithaninjectionmoldingpartunderpressureand
heatinahotstampingpress.

Basically,thefilmstructureconsistsofacopperfilmbasis,anadhesivesubstanceandasurface
finish.
Foradependablestructurerepresentationduringthestampingprocess,themechanical
characteristicsofthefilmsystemareofmajorimportance.
Themarketprovidesanumberoffilmsystemswithvarioussurfacefinishes.
Hotstampingisacomparativelyeasytouse,dependablemethodfortheproductionofsimple
structures.

Theproductionsequence:

Injectionmolding,plasticpart


Puttingpartinhotstampingpress

Feedinginoffilmsystemandbuildinguppressure

Surfacefusingofpolymerthroughheatinput

Sheeringoffoftheconductorpathmap

Removalofthefilmremains

Ackermann&Bolta

Theperformancecharacteristics:

Representabledegreeofcomplexity:

Small

Designvariance:

2,5D

Conductorpathstructurewidth:

0,5mm

Distancebtw.conductorpaths:

0,5mm

Changeflexibility:

Medium

Variantsuitability:

Yes

Marketacceptance:

Good

Availablepolymerbasis:

Versatile

PlasticmeetsElectronic

MIDTRONIC|MaxPlanckWeg7|D95676Wiesau|Fon+49.9634.88820|info@midtronic.de
(mailto:info@midtronic.de)