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Introducere
Microscopie optica
Microscopie electronica
Scanning Tunneling
Microscope (STM)
Atomic Force Microscope
(AFM)
Analiza de raze X
Spectrometrie in infrarosu cu
transformata Fourier (FTIR)
Spectroscopie de electroni
Auger (Auger or AES)
Spectroscopie de fotoelectroni
cu raze X (XPS)
Fluorescenta de raze X (XRF)
Spectroscopie Raman
Spectroscopie
Electromagnetica
De raze X
UV/Vis (optica)
EDS
WDS
XPS/ESCA
XRF
UV/Vis
Ultraviolet
Infrarosu
Spectroscopy
Outputs
Inputs
e-
A+
e-
A+
Sample
Electrons Out
Probe:
Electrons
Auger electrons
Secondary electron
imaging
Backscattered
electron imaging
Electrons In
e-
e-
Transmitted
electrons
Electron diffraction
Photons out
Energy Dispersive
Spectroscopy
Wavelength
Dispersive
Spectroscopy
Sample
9
Probe: Photons
Photons Out
Photons In
Infrared
Visible
Ultraviolet
X-Rays
FTIR
Raman
Visible
Ultraviolet
X-Ray Fluorescence
X-Ray Diffraction
Electrons Out
XPS, X-ray
Photoelectron
Spectroscopy
e-
Sample
10
Probe: Ions
Ions Out
SIMS, Secondary
Ion Mass
Spectrometry
Ions In
A+
A+
Sample
11
BRAGGS LAW
n = 2 d sin
Constructiveinterferenceonlyoccursforcertainscorrelatingtoa(hkl)plane,
specificallywhenthepathdifferenceisequaltonwavelengths.
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10
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Exemple deaplicatii
Examinarea probelor pregatite metalografic, la mariri mult peste cele
permise demicroscopia optica;
Examinarea suprafetelor de rupere si ale suprafetelor atacate adanc,
permitand vizualizarea punctelor mult mai indepartate decat este posibil prin
microscopie optica;
Evaluarea orientarii cristalografice aleelementelor structurale,pe suprafete
pregatite metalografic:graunti individuali,precipitate,dendrite,etc.;
Evaluarea compozitiei chimice a elementelor structurale submicronice
(incluziuni,precipitate,particule produse deuzura);
Evaluarea gradientilor compozitionali pe distante depeste 1m;
Examinarea dispozitivelor semiconductoare.
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Probe
26
13
Limitari
Calitatea imaginilor pe probele plate,cumar fi cele metalice polizate si
atacate,este ingeneralinferioara microscopiei optice,lamariri desub
300400x;
Rezolutia,mult superioara microscopiei optice,este inferioara
microscopiei electronice prin transmisie si microscopiei electronice prin
transmisie cubaleiaj.
Capabilitati aletehnicilor complementare
Difractia derazeX:furnizeaza informatii cristalografice;
Microscopia optica:mai rapida,mai ieftina,imagini mai bune lamariri de
pana la3004x;
Microscopia electronica prin transmisie:furnizeaza informatii din
structura intima amaterialului:dislocatii,distributia limitelor launghiuri
mici,clustere devacante,etc.Rezolutie superioara dar necesita probe
subtiri.
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Aliaj Al-Ti-B
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Pulbere TiO2
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Nanoparticule de carbon
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Latex
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Pulbere de aur
Au30
particles number
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40
30
20
10
0
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40
45
50
55
60
65
70
diameter (nm)
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23
Au10
30
particles number
25
20
15
10
0
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
diameter (nm)
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48
24
49
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