Photofabrication - a process in which the etching pattern is placed over the circuit board

or semiconductor material, the board or chip is placed in a special solution, and the
assembly is exposed to light.

Silver Painting – the meatal is coated with silver paint to keep it away from any dirt and
increase its conducting abilities.

Wire bonding – the wires are connected to each other to form a frame shape.

Polyimide taping – to maintain the position of the lead in the metal, it is taped using
polyimide.

Downset - die pad section onto which the die will be bonded is depressed by downset
tool

Cutting - A technique to produce the most advanced leadframes. It is to keep inner leads
connected during etching process, plating process and taping process to prevent lead tips
transformation problem from occuring. the connected portions are then cut off in the final
process. It is quite effective for preventing the lead from changing its shape during the
plating process, and for accurately maintaining the inner lead position achieved by the
photo fabrication process.

Packaging – the lead frames are packaged (2400 pcs) per container. And named after the
customer who ordered it.