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Positive-Voltage Regulators: Features
Positive-Voltage Regulators: Features
POSITIVE-VOLTAGE REGULATORS
1FEATURES
• 3-Terminal Regulators
2 • High Power-Dissipation Capability
• Output Current up to 1.5 A • Internal Short-Circuit Current Limiting
• Internal Thermal-Overload Protection • Output Transistor Safe-Area Compensation
COMMON
COMMON
E OUTPUT
L ET OUTPUT COMMON
COMMON
SO INPUT
INPUT
OB
COMMON
COMMON
OUTPUT OUTPUT
TE
O LE COMMON COMMON
S
OB INPUT INPUT
DESCRIPTION/ORDERING INFORMATION
This series of fixed-voltage integrated-circuit voltage regulators is designed for a wide range of applications.
These applications include on-card regulation for elimination of noise and distribution problems associated with
single-point regulation. Each of these regulators can deliver up to 1.5 A of output current. The internal
current-limiting and thermal-shutdown features of these regulators essentially make them immune to overload. In
addition to use as fixed-voltage regulators, these devices can be used with external components to obtain
adjustable output voltages and currents, and also can be used as the power-pass element in precision
regulators.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerFLEX, PowerPAD are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 1976–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
µA7800 SERIES
SLVS056M – MAY 1976 – REVISED JANUARY 2009 ....................................................................................................................................................... www.ti.com
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
SCHEMATIC
INPUT
OUTPUT
COMMON
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θJP is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
(1) Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately. All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across
the output.
APPLICATION INFORMATION
+V µA78xx +VO
0.33 µF 0.1 µF
IN OUT
+ µA78xx G
VI IL
COM
− −VO
R1
IO
0.33 µF 0.1 µF
R2
A: The following formula is used when Vxx is the nominal output voltage (output to common) of the fixed regulator:
Input µA78xx
R1
0.33 µF VO(Reg)
Output
IO
IO = (VO/R1) + IO Bias Current
1N4001
2 µF 1 µF 0.1 µF
1N4001
−20-V Input µA7915C VO = −15 V
1N4001
−VO
Reverse-Bias Protection
Occasionally, the input voltage to the regulator can collapse faster than the output voltage. This can occur, for
example, when the input supply is crowbarred during an output overvoltage condition. If the output voltage is
greater than approximately 7 V, the emitter-base junction of the series-pass element (internal or external) could
break down and be damaged. To prevent this, a diode shunt can be used as shown in Figure 7.
VI µA78xx +VO
www.ti.com 7-Jun-2010
PACKAGING INFORMATION
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Jan-2009
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Jan-2009
Pack Materials-Page 2
MECHANICAL DATA
Thermal Tab
(See Note C)
0.360 (9,14)
0.295 (7,49)
0.350 (8,89)
NOM
0.320 (8,13)
0.420 (10,67)
0.310 (7,87)
0.410 (10,41)
1 3
0.025 (0,63)
Seating Plane
0.031 (0,79)
0.004 (0,10)
0.100 (2,54) 0.010 (0,25) M
0.005 (0,13)
0.200 (5,08)
0.001 (0,03)
0.041 (1,04)
0.010 (0,25) 0.031 (0,79)
NOM
Gage Plane
3°– 6°
0.010 (0,25)
4073375/F 12/00
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