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    Lin Cao
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    Die attach is a stem during which a die is taken from the wafer and placing it in the package or lead frame. Wire bonding is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board (PCB) in gold bal bonding, for example, the first bond is done on the bond pad on the chip and the second bond on the lead finger on the package.

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    Die attach is a stem during which a die is taken from the wafer and placing it in the package or lead frame. Wire bonding is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board (PCB) in gold bal bonding, for example, the first bond is done on the bond pad on the chip and the second bond on the lead finger on the package.

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    4 views3 pages

    Positing Application

    Uploaded by

    Lin Cao
    Die attach is a stem during which a die is taken from the wafer and placing it in the package or lead frame. Wire bonding is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board (PCB) in gold bal bonding, for example, the first bond is done on the bond pad on the chip and the second bond on the lead finger on the package.

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    Wafer test Die attach Wire bonding Die attach Die attach is a stem during which a die is taken

    the die from the wafer and placing it in the package or lead frame. This process is made up of two steps, die attach paste or solder placement and accurate placement of the die in the package. As package and die become bigger and the current and speeds go up, it puts greater demands on the die attach machine to dispense the paste in a very controlled way to minimize bond line thickness and keep the die aligned on the lead frame. K&S, AlphaSem and ESEC are popular. Figure 1 illustrates a lead frame prior to die attach, the lead frame is the base to which the die will be attached. Each rectangular pad (substrate) on the lead frame will have a die placed on it during die attach. The die will be connected to the lead frame and finally the lead frame broken apart in the later steps.

    Figure 1 Individual die is removed from a wafer mounting tape, while die attach material, such as epoxy, is dispensed in controlled amounts on to substrates on the lead frame (see Fig 2(a)). Then the die is aligned in the proper orientation position on the substrate (see Fig 2(b)) (National Semiconductor, Semiconductor Packaging Assembly Technology, August 1999).

    (a) Figure 2

    (b)

    1 wire bonding What is wire bonding?

    Wire bonding is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication.

    The purpose of wire bonding is to create electrical interconnection between the IC chip and the package. In gold bal bonding, for example, the l first bond is done on the bond pad on the chip and the second bond is done on the lead finger. The objective of the wire bonding process is to create a perfect interface between the bond wire and the bond pad on the die and the bond wire and the lead finger on the package.

    What are the positioning requirements?

    What are the current solutions? And their advantages and disadvantages?

    Flip chip

    What is the requirements? Current techonology?

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