A) Issues Known : 1) Package Material Thermal Limits 2) Package Material Thermal Resistance 3) Package Material behaviour in vacuum 4) Package

Material and Device elements Thermal mismatch 5) Package Material behaviour in humidity 6) Package Material Radiation characterization 7) Package variability Lot to Lot, Batch to Batch, Manufacturer to Manufacturer regarding i) Material ii) Processes iii) Workmanship B) Way to Address : 1) Select Standard Manufacturers, viz. Analog Devices, Linear Technology, etc. 2) Select Typical Function Types, viz. References, Clock Drivers, ADCs 3) Select Typical Package Style, viz. TSOP (Thin Small Outline Package) C) Way to Proceed : 1) Known Failure mechanisms : i) Pop-corning (pkg-cracking during soldering and reflow) due to moisture ingress ii) Corrosion of die metal and wirebonds due to moisture & contamination ingress iii) Outgassing of pkg material iv) Lower Radiation tolerance due to lower package material stopping power v) Power dissipation limits in vacuum 2) Two Stage Evaluation : i) Qualification ii) Lot Acceptance Testing 3) Burn-In Boards or typical Application Circuits can be used for characterization 4) Sample size to provide typical confidence levels need to be worked out 5) Logistic support like Power supplies, Oscilloscopes, Signal generators, etc are required

(Test sequence and Qty of devices are given as follows-)

Qualification Tests 1. Radiography/ SAM 2. X and Y structural sectioning 3. Outgassing 4. Serialisation 5. Select Control Samples 6. Physical Dimensions 7. Visual Dimension 8. Pre Conditioning 9. Interim electricals 10. HAST 11. Interim electricals 12. Sample Split Temperature Cycling External Visual Interim electricals SAM 13. TID/ SEE 14. Thermovac Cycle (Powered) LAT Assembled Devices in applications circuit 1. Temperature Cycling 2. Hot and Cold Operational 3. Powered Thermovac 10 cycles Qty 02 01 each 02 100% 02 02 100% 52 52 52 52 30(0), 30(0), 30(0), 30(0) Life Test End Point 22(0) 22(0) 02 05

Interim and end-point electricals can be carried out on dedicated applications circuit with required parameters identified for monitoring Life test can be carried out with a feasible loading circuit with corresponding stimuli designed.