"

4
5
1.1 5
1.2 7
1.3 8
1.4 9
1.5

10

1.6

10

1.7

11

(17)
2.1 17
2.2 20
-1-

FOXCONN Microsystem Corporation

AMBIT

"
2.3 24
2.4 24
2.5 30
2.6 31
2.7 33
2.8 SFIS 36

41
3.1 SOP
41
3.1.1

41

3.1.2 42
3.1.3 43
3.1.4 44
3.2 47

65
4.1 65
-2-

FOXCONN Microsystem Corporation

AMBIT

 "
4.2 (66)
4.3 (75)

77

-3-

FOXCONN Microsystem Corporation

AMBIT

"

1.
2.
3. COM

-4-

FOXCONN Microsystem Corporation

AMBIT

 "

1.1
Hon Hai
CMM (Component module move)
CEM (Contract Manufaction service)
IBSC (Internet Business Solution Center)
PCEG (Personal Computer Enclosure group) FOXTEQ
CCBG (Connector & cable business group)
CPBG (Competition business group)
ESBG (Enterprise system business group)
SABG (system assembly business group)
NWE (Net Work Enclosure)
NSE (Network system enclosure)
Stamping tool shop II
NSG (Network system group)
Prototype workshop
NFE (Network flexible enclosure)
Steel factory
Foxcavity = HZ = Hong Zhun
PCE molding tooling workshop
Stamping tool shop I
-5-

FOXCONN Microsystem Corporation

AMBIT

"
PCE
Hua Nan test and measurement center

MPE (mobile phone enclosure)

MBE (mobile phone and notebook enclosure)

MGE (Alloy magnesium alloy enclosure)

Engineer standard
Document center (database center)
Design Center
Painting ()
Assembly ()
Stamping ()
Education and Training
proposal improvement/creative suggestion

Technological exchange and study

Technology and Development Committee

BS Brain Storming
QCC
Quality Control Circle
PDCA :Plan Do Check Action

DCC delivery control center Quality control system

Manufacturing control system

Management control system
7S
Classification (sorting, organization)-seiri
Regulation (arrangement, tidiness)-seiton
Cleanliness (sweeping, purity)-seiso
Conservation (cleaning/cleanliness) -seiktsu
Culture (discipline)-shitsuke
Save
Safety .

-6-

FOXCONN Microsystem Corporation

AMBIT

 "
1.2
QC
FQC
IPQC
OQC
IQC
TQC
POC
QA
OQA
QE
FAI
FAA
CP
CPK
SSQA
FMEA
FQC

quality control
final quality control
in process quality control
output quality control
incoming quality control
total quality control
passage quality control
quality assurance
output quality assurance
quality engineering
first article inspection
first article assurance
capability index
capability process index
standardized supplier quality audit
failure model effectiveness analysis

-7-

FOXCONN Microsystem Corporation

AMBIT

"
AQL
S/S
ACC
REE
CR
MAJ
MIN
Q/R/S
P/N
L/N
AOD
UAI
FPIR
PPM

Acceptable Quality Level

Sample size
Accept
Reject
Critical
Major
Minor
Quality/Reliability/Service
Part Number
Lot Number
Accept On Deviation
Use As It
First Piece Inspection Report
Percent Per Million

//

1.3
SPC
SQC

Statistical Process Control

Statistical Quality Control

-8-

FOXCONN Microsystem Corporation

AMBIT

 "
GRR
DIM
DIA
N
QIT
ZD
QI
QP
TQM
RMA
7QCTools

Gauge Reproductiveness & Repeatability

Dimension
Diameter
Number
Quality Improvement Team
Zero Defect
Quality Improvement
Quality Policy
Total Quality Management
Return Material Audit
7 Quality Control Tools

Engineering Change Notice

Engineering Change Order
Process Change Notice
Product Management Plan
Standard Inspection Procedure

()
()

1.4
ECN
ECO
PCN
PMP
SIP

-9-

FOXCONN Microsystem Corporation

AMBIT

"
SOP
IS
BOM
PS
SPEC
DWG

Standard Operation Procedure

Inspection Specification
Bill Of Material
Package Specification
Specification
Drawing

Engineering Standard
China General
International Workman Standard
International Standard Organization
General Specification

PCE

Production & Material Control

1.5
ES
CGOO
IWS
ISO
GS

1.6
PMC
- 10 -

FOXCONN Microsystem Corporation

AMBIT

 "
PCC
PPC
MC
DC
QE
QA
QC
PD
LAB
IE
R&D

Product control center

Production Plan Control
Material Control
Document Center
Quality Engineering
Quality Assurance
Quality Control
Product Department
Laboratory
Industrial Engineering
Research & Design

()
()
()

Pieces
Pairs
Carton
Pallet/skid

(,)
()

1.7
PCS
PRS
CTN
PAL

- 11 -

FOXCONN Microsystem Corporation

AMBIT

"
PO
MO
D/C
ID/C
SWR
L/N
P/N
OEM
PC
CPU
A.S.A.P
E-MAIL
N/A
QTY
I/O
NG
C=0
APP

Purchasing Order
Manufacture Order
Date Code
Identification Code
Special Work Request
Lot Number
Part Number
Original Equipment Manufacture
Personal Computer
Central Processing Unit
As Soon As Possible
Electrical-Mail
Not Applicable
Quantity
input/output
Not Good
Critical=0
Approve

()

/
,

,,

- 12 -

FOXCONN Microsystem Corporation

AMBIT

 "
CHK
ASS'Y
T/P
5WIH
6M
4MTH
SQA
DQA
MQA
SSQA
LRR
SPS
DT
MT
DVD
VCD
LCD
CAD

Check

Assembly
,
True Position

When, Where, Who, What, Why, How to

Man, Machine, Material, Method, Measurement, Message
Man, Material, Money, Method, Time, How
,,,,()
Strategy Quality Assurance

Design Quality Assurance

Manufacture Quality Assurance

Sales and service Quality Assurance

Lot Reject Rate

Switching power supply

Desk Top
()
Mini-Tower
()
Digital Video Disk
Video Compact Disk
Liquid Crystal Display
Computer Aided Design
- 13 -

FOXCONN Microsystem Corporation

AMBIT

"
CAM
CAE
PCB
CAR
NG
WDR
PPM
TPM
MRP
OS
TBA
D/C
P/P
EMI
RFI
MMC
MMS

Computer Aided Manufacturing

Computer Aided Engineering
Printed Circuit Board
Correction Action Report
Not Good
Weekly Delivery Requirement
Percent Per Million
Total Production Maintenance
Material Requirement Planning
Operation System
To Be Assured
Drawing Change
Plans & Procedure
Electrical-Music Industry
Electrical Magnetic Interference
Read Frequency Input
Maximum Material Condition
Maximum Material Size

- 14 -

FOXCONN Microsystem Corporation

AMBIT

 "
LMC
LMS
LED
QBR
CIP
FGI
CNC
B2C
B2B
AVL
POP
EOL
VDCS
PDCS
GRN
A/R
A/P

Least Material Condition

Least Material Size
lighting-emitting diode
Quarter Business Record
Continuous improvement process
Forecasted Goal Inventory
Computerized numeral controller
Business to customer
Business to business
Approved vendor list
Procedure of packaging
End of life
Vender defect correcting sheet
Process defect correcting sheet
Goods receiving note
Accounting receivable
Accounting payable

- 15 -

FOXCONN Microsystem Corporation

AMBIT

"
NOTE:

- 16 -

FOXCONN Microsystem Corporation

AMBIT

 "

2.1
president
operator
position
general manager
special assistant
deputy manager |'depjuti| =vice
manager
deputy supervisor=vice=
supervisor
group leader
line leader
supervisor
responsible department
Human Resources Department

Head count
production department
planning department
QC Section
stamping factory
painting factory
molding factory
administration / general affairs
dept./
production unit
meeting minutes
distribution department
subject
conclusion
decision items

pre-fixed finishing date

Color management
Visual management
production capacity
first count
first check
second count
second check
quantity of physical inventory
second count
physical inventory
physical count quantity
difference quantity
spare parts physical inventory
- 17 -

FOXCONN Microsystem Corporation

AMBIT

"
list
cause analysis
waste materials
description
specification
model
work order
revision
remark
registration
registration card
to control
application form for purchase

consume, consumption
to notify
to fill in
to collect, to gather

statistics
cosmetic inspection standard

computer case ()
personal computer enclosure

front plate
rear plate
chassis |'si|
bezel panel
Hood
base pan
bezel
riser card
flat cable
Top driver cage
bottom driver cage
resin film

raw materials
materials
steel plate
roll/coil material
spare parts =buffer
plastic parts
sheet metal parts/stamping parts

material check list

finished product
semi-finished product
good product/accepted goods/
accepted parts/good parts
defective product/non-good parts

disposed goods
warehouse/hub
packing material

- 18 -

FOXCONN Microsystem Corporation

AMBIT

 "
basket
plastic basket
flow chart
production tempo
lots of production
manufacture procedure
to revise, modify
to switch over to, switchto,
switching over
engineering bottleneck, project
difficulty
glove(s)
glove(s) with exposed fingers

bottleneck
Band-Aid
Industrial alcohol
broom

mop
vacuum cleaner
rag
garbage container
garbage can
garbage bag
liaison
lamp holder
to mop the floor
to clean a table
air pipe
delivery deadline
die worker
production, to produce
equipment
resistance
beacon
coolant

crusher
club car
plate
power button
reset button
forklift
Workshop traveler
trailer =long vehicle
Hydraulic trolley
hydraulic hand jack
casing = containerization
velocity
patent
coordinate
supply and demand
career card
barricade
carton box
- 19 -

FOXCONN Microsystem Corporation

AMBIT

"
to pull and stretch

work cell/work shop

sub-line

die change
to fix a die
to repair a die
punch set
punch pad
punch holder
stripper pad
up stripper
upper plate
lower plate
die pad
die holder
die set

bottom block
bottom plate ()
upper supporting blank
upper padding plate blank
top plate
top block
stripping plate ()
outer stripper
inner stripper
lower stripper
punch
insert ()
deburring punch

2.2
plain die
pierce die
forming die
progressive die
stage die
compound die
shearing die
riveting die
feature die
male die
female die
cavity
core
- 20 -

FOXCONN Microsystem Corporation

AMBIT

 "
groove punch
stamped punch
round punch
special shape punch
bending block
roller
baffle plate
located block
supporting block for location

air cushion plate

air-cushion eject-rod
trimming punch
stiffening rib punch = stinger

ribbon punch
reel-stretch punch
guide plate

sliding block
sliding dowel block
die locker
pressure plate =plate pinch
thickness gauge
cutting die, blanking die
die block
folded block
sliding block
location pin
lifting pin
die plate, front board
padding block
stepping bar
panel board
to load a die
to unload a die
active plate

lower sliding plate

upper holder block
upper mid plate
spring box
spring-box eject-rod
spring-box eject-plate
bushing block
cover plate
guide pad
pilot
trim
pierce
pocket for the punch head
slug hole
radius
shim/wedge/heel/pad/spacer/gas
ket
torch-flame cut
- 21 -

FOXCONN Microsystem Corporation

AMBIT

"
set screw
form block
round pierce punch =die button

shape punch =die insert

stock located block
metal plate
miller
grinder
tolerance
score =groove
sliding block lathe
active plate
baffle plate
cover plate
groove punch
air-cushion eject-rod
spring-box eject-plate

capability
parameter
factor
driller
set up die
height of die setting up

analog-mode device
inner guiding post
inner hexagon screw
dowel pin
coil spring
lifter pin
eq-height sleeves =spool
pin
lifter guide pin
guide pin

wire spring
outer guiding post
stop screw
located pin
outer bush
press specification
die height
flow mark
welding mark
post screw insert
self tapping screw
stripper plate
piston
handle mold
flash mold
positive mold
split mold
die lifter

- 22 -

FOXCONN Microsystem Corporation

AMBIT

 "
top stop
bottom stop
one stroke
to continue, cont.
to grip(material)
location lump, locating piece,
location block
reset
to file burr
embedded lump |in'bed| |lmp|

stamping-missing
to tight a bolt
to loosen a bolt
punched hole
to cut edge =side cut =side scrap

to bending

to pull, to stretch
engraving, to engrave
stamping
to stake
designing, to design
design modification

gauge(or jig)
pedal
stopper
flow board
torque
spline =the multiple keys
quenching
tempering
annealing
carbonization
alloy

tungsten high speed steel

moly high speed steel
forming (,)
draw hole
bending
emboss
dome
semi-shearing
stamp mark
deburr or coin
punch riveting
side stretch
reel stretch
groove
stamp letter ()
tick-mark nearside
tick-mark farside
extension DWG
- 23 -

FOXCONN Microsystem Corporation

AMBIT

"
procedure DWG

die structure DWG

2.3
punch, press
punching machine
hydraulic machine
jack
decoiler
manufacture management

stamping, press

feeder
rack, shelf, stack
taker
to reverse material
to load material
to unload material
to return material/stock to
scraped |'skrpid|

scrape ..v.;
robot
production line
packaging tool
packaging

hot runner
runner plat

valve gate
band heater

2.4
well type
insulated runner
- 24 -

FOXCONN Microsystem Corporation

AMBIT

 "
spindle
spear head
slag well
cold slag
air vent
welding line
eject pin
knock pin
return pin
sleeve
stripper plate
insert core
runner stripper plate
guide pin
eject rod (bar)
subzero
three plate
runner system

stress crack
orientation
sprue gate
nozzle
sprue lock pin (
)
slag well
side gate
edge gate
tab gate
film gate
flash gate
slit gate
fan gate
dish gate
diaphragm gate
ring gate
submarine gate

tunnel gate
pin gate
runner less
sprue less

long nozzle
spur ;
waste
board
sliding rack
to impose lines
to compress, compressing
character die
to feed, feeding
material change, stock change

feature change
prepare for, make preparations
for
- 29 -

FOXCONN Microsystem Corporation

AMBIT

"
rotating speed, revolution

abnormal handling

2.5
Assembly line
Layout
Conveyer
Rivet machine
Rivet gun
Screw driver
Electric screw driver
Hydraulic machine
Pneumatic screw driver
automation
to stake, staking, riveting
add lubricant oil
argon welding

cylinder
robot
conveying belt
transmission rack
to draw holes
bolt
nut
screw
identification tag
screwdriver plug
automatic screwdriver
to move, to carry, to handle
be put in storage

packing
staker = riveting machine
fit together
fasten ()
fixture ()
pallet/skid
barcode
barcode scanner
fuse together
fuse machine/heat stake
processing, to process
delivery, to deliver
to return delivery to. to send

- 30 -

FOXCONN Microsystem Corporation

AMBIT

 "
delivery back to return of goods

easily damaged parts

standard parts

to lubricate
spring
spare tools location/buffer

spare molds location

tox machine

volatile
degrease
rinse
alkaline etch
desmot
D.I. rinse
Chromate
Anodize
seal
scraped products

disposed products
dismantle the die
auxiliary function
heater band
thermocouple
derusting machine
degate
dryer
induction
induction light

2.6
phosphate
viscosity
alkalidipping
main manifold
organic solvent
demagnetization ;
high-speed transmission

heat dissipation
rack

- 31 -

FOXCONN Microsystem Corporation

AMBIT

"
response =reaction =interaction

ram
edge finder
concave
convex
cold slug
blush

gouge ;
satin texture
witness line
grit
granule =pellet =grain
sand blasting
grit maker
cushion

fillet ;
roller pin formality
cam driver
shank
crank shaft

exposed metal/bare metal

excessive defect
critical defect
major defect
minor defect
not up to standard

cosmetic defect
lack of painting
slipped screw head/slippery
slipped thread
missing part
wrong part
oxidation

2.7
qualified products, up-to-grade
products
defective products, not
up-to-grade products
defective product box
poor processing
poor incoming part
- 33 -

FOXCONN Microsystem Corporation

AMBIT

 "
defective threading
poor staking
deficient purchase
deficient manufacturing
procedure
cosmetic inspection
inner parts inspection
blister
angular offset
dent
scratch
deformation
filings
defective label
abrasion
Breaking.
(be)broken,(be)cracked
short

nick
speck
shine
splay
gas mark
delaminating
speckle
mildewed =moldy = mouldy
deformation
burr()flash()
poor staking
excessive gap
grease/oil stains
inclusion
shrinking/shrinkage
mixed color
fold of packaging belt
painting make-up

discoloration
water spots
impurity
Mismatch
failure, trouble
deformation
rust
peel
Shrink
Contamination
water spots
Gap
label error
Missing label
rejection criteria
Suspected rejects
abrasion
Texture surface
- 34 -

FOXCONN Microsystem Corporation

AMBIT

"
corrugated containe
Delaminating
splattering
Gouge
puckering

dirt grime
blush
sink
Hickey
labels and logos
Configuration labels

Streak
stains
Blotch

discoloration
Inclusion
slug mark

2.8 SFIS

1. SFIS
2. SMO
3. DCT

Shop Floor Integrated System.

SFIS Monitor. SFIS

Data Control Terminal.
.

- 35 -

FOXCONN Microsystem Corporation

AMBIT

 "
4. DIC

Data Interface Controller. SMO DCT

.

5. Wireless Gun

6. Receiver

7. Charger

8. Barcode Printer

9. Laser Printer

10. Employee Barcode

11. Error Code

12. Reason Code

13. Key Parts

14. Route

SFIS

15. Vender

16. Customer

17. SN

Serial Number.

- 36 -

FOXCONN Microsystem Corporation

AMBIT

"

INSP

SMT ICT

R_INSP

INSP

SMT_TU

SMT (PCBA )

SMT_IN

SMT

SMT_OUT
ATE

SMT
1. Hi-PotOpen ShortFunction Test

2. Tray Serial Number

R_ATE
T_INPUT
T_ICT
R_T_ICT
ASSY

ATE
ADSL
W/S .
T_ICT
ADSL .

- 37 -

FOXCONN Microsystem Corporation

AMBIT

 "
RI
R_RI
FT
R_FT

ADSL Run-in ( Run-in )

Run-in
ADSL Final Test
Final Test

PACK_BOX

PACK_CTN

Tray Carton

PACK_PALT

FQA
R_FQA

FQA
FQA

STOCKIN

LOADING

()

SHIPPING

WS
SC_SMT

PPM
SMT
- 38 -

FOXCONN Microsystem Corporation

AMBIT

"
SMT_PRE_SC

SMT

SC_TEST

PCBA

TEST_PRE_SC
SC_FG
FG_PRE_SC
SC_RE

PCBA

- 39 -

FOXCONN Microsystem Corporation

AMBIT

 "
NOTE:

- 40 -

FOXCONN Microsystem Corporation

AMBIT

"

3.1
3.1.1

ADSL(Asymmetrical Digital Subscriber Loop)

DC/DC Charger (~)

Gauge
Hybrid IC
Inverter
LAN
Modem
SPSSwitching power supply
DTDesk Top()

MTMini-Tower()
DVDDigital Video Disk
VCDVideo Compact Disk
LCDLiquid Crystal Display
CADComputer Aided Design
CAMComputer Aided Manufacturing
CAEComputer Aided Engineering
PCBPrinted Circuit Board
EMIElectrical-Music Industry
Electrical Magnetic Interference

- 41 -

FOXCONN Microsystem Corporation

AMBIT

 "
3.1.2
RT : Receiving Ticket
IQC : Incoming Quality Control
SMT : Surface mounting technology
ICT:In circuit tester
AOI : Auto optical inspection
V/I:Visual inspection
T/U: Touch Up
SNAP :
Hi-pot Test :
F/T : Final test
Programming :
Programming check :
O/S (Open / short test)/
B/I (Burn-In)
R/I (RUN-IN )

ORT (On-going Reliability Test)

ATE(Automatic Test Equipment)
Inspection
LCR Meter ,,
Pack
FQA (Final Quality Assurance)
CQA Customer Quality Assurance

OOBOut Of Box
Repair (T/S; Trouble Shooting)
R/WRework

IPQCIn-Process Quality Control

PCBA(Printed Circuit Board Assembly)

Open Short Test

- 42 -

FOXCONN Microsystem Corporation

AMBIT

"
3.1.3

1. Constant Temperature Soldering Iron
2. Conveyor
3. ESD Wrist strap
4. Fixture
5. Furnace
6. High Speed Machine
7. Laser Scribe
8. Microscope
9. Oven
10. Partition
11. Paste Roller
12. Printer
13. Probe
14. Probe Card
15. Reflow

- 43 -

FOXCONN Microsystem Corporation

AMBIT

 "
16. Scanner
17. Screen Cleaner

3.1.4

1. Barcode
2. Bracket
3. Capacitor
4. Capillary
5. Carton
6. Ceramic Substrate
7. Coil
8. Conductive Sponge
9. Conductor Paste
10. Connector
11. Crystal (XTAL)

- 44 -

FOXCONN Microsystem Corporation

AMBIT

"
12. Dielectric Paste
13. Diode
14. Epoxy
15.
EPROM
(Erasable
and
Programmable Read Only Memory)
16. Fuse
17. Golden Finger
18. Header
19. Heat Sink
20. IC (Integrated Circuit)
21. Inductor
22. Insulator
23. Jack
24. Mylar
25. Over-glass Paste
26.PRO(Programmable
Read
Only
Memory)

()
()

()

- 45 -

FOXCONN Microsystem Corporation

AMBIT

 "
27. Resistor
28. Resistor Array
29. Resistor Paste
30. Silicone
31. SIMM Socket
32. Socket
33. Solder Paste
34. Switch
35. Thermal
36. Transformer
37. Transistor

IC

- 46 -

FOXCONN Microsystem Corporation

AMBIT

"
3.2
) 5S
5S (SEIRI)(SEITON)
(SEISO)(SEIKETSU)(SHITSUKE)
()"S"5S
5S

) ABC (Activity-Based Costing)

ABC ABM(Activity-Base Management)

) ASP Application Service Provider

IT
- 47 -

FOXCONN Microsystem Corporation

AMBIT

 "

) AVL (Approved Vendor List)

) BOM (Bill Of Material)

BOM
MRP BOM

90 PCBA
95 Driver Bundle
97 Engine
98 ()

) BPR (Business Process Reengineering)

(Function-Organization)
Process-Oriented Organization

- 48 -

FOXCONN Microsystem Corporation

AMBIT

"
BPR
1.

2.

3.

) BSC (Balanced Score Card)

(Balanced Scorecard)

) CPM (Critical Path Method)

(critical
path)(chain of activities)

(critical activities)(management efforts)

- 49 -

FOXCONN Microsystem Corporation

AMBIT

 "
) CPM (Complaint per Million)

1 1 100 1
1 20

) CRM (Customer Relationship Management)

Data Mining

) CRP (Capacity Requirement Planning)

CRP

MPS CRP

) DBE (Drum-Buffer-Rope)
TOC (Drum Schedule)
(Rope Schedule)( Murphys Law)
- 50 -

FOXCONN Microsystem Corporation

AMBIT

"

Drum-Buffer-Rope Drum Buffer

Rope

Drum
(drum)
Buffer
(buffer)

Rope (feedback)

(rope)

) DMT (Design Maturing Testing)

EMC

) DVT

(Design Verification Testing)

Debug
- 51 -

FOXCONN Microsystem Corporation

AMBIT

 "
) DSS (Decision Support System)

Vlugt,1989

) ECRN

(Engineer Change Request Notice)

BOM

) EIS (Executive Information System)

) EMC (Electric Magnetic Capability)

) EOQ (Economic Order Quantity)

) ERP (Enterprise Resource Planning)

1998 ERP
- 52 -

FOXCONN Microsystem Corporation

AMBIT

"

) FAE

(Field Application Engineer)

(PM)

) FCST (Forecast)

) FMS (Flexible Manufacture System)

1960

- 53 -

FOXCONN Microsystem Corporation

AMBIT

 "
) FQC (Finish or Final Quality Control)

) IPQC (In-Process Quality Control)

) IQC (Incoming Quality Control)

IQC

) ISO (International Organization for Standardization)

1946 9000
14000 18000

ISO

ISAR (Initial Sample Approval Request)

ISAR
- 54 -

FOXCONN Microsystem Corporation

AMBIT

"
JIT (Just In Time)
JIT ()

JIT
1.
2.

3.JIT

JIT Lead Time

) KM (Knowledge Management)

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) L4L (Lot-for-Lot)

) LTC (Least Total Cost)

) LUC (Least Unit Cost)

) MES (Manufacturing Execution System)

MES (Customer Order Management ,COM)(Material

Management System, MMS) (Work In Process Tracking , WIP)(Production
Scheduling System , PSS)(Statistical Process Control , SPC)(Equipment Management
System, EMS) PDM (PDM Integration Interface) ERP (ERP
Integration Interface)
MES

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) MPS (Master Production Scheduling)

...

) MRP (Material Requirement Planning)

MRP Joseph A. OrlickyGeorge W. Plossl
Oliver W. Wight 1970 American Production and Inventory
Control Society APICS MRP MPS
BOM

Forward Scheduling ()

Backward Scheduling ()

Independent Demand ()

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Dependant Demand ()

) MRPII (Manufacturing Resource Planning)

Wight 1981 MRP MRP

) OLAP (On-Line Analytical Processing)

(Data Warehouse)

OLAP 1.2.
3.OLAP

OLAP
OLAP (Historical data)(aggregate data)
OLAP
) OLTP (On-Line Transaction Processing)

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OLAP OLTP OLTP (Data Warehouse)

(Relational Database, RDB)OLAP
OLTP
OLAP

) OPT (Optimized Production Technology)

Eli Goldratt 70
(Optimized Production Timetable)80 Goldratt
(Theory of Constraints)OPT

) OQC (Out-going Quality Control)

) PDM (Product Data Management)

CAD 3D
NC CAE
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(common data)

) PERT (Program Evaluation and Review Technique)

(project)
(net-work) (activity)

(project duration)
(bottle neck) (scheme)
PERT (planning)(doing)
(controlling)

) POH (Product on Hand)

) QCC (Quality Control Circle)

) RCCP (Rough Cut Capacity Planning)

(RRP) (RCCP)(CRP)
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/(I/O) MRP RCCP MPS
MRP CRP RCCP

RCCP
1. Capacity planning using overall factors(CPOF)
2. The Bill of Labor approach(BOL)

3. Resource Profile Approach(RPA)

) SCM (Supply Chain Management)

1.
2.
3.
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) SIS (Strategic Information System)

EIS EIS
SIS

) SPC (Statistic Process Control)

Cp Cpk

) TOC (Theory Of Constraints)

(
)

()

) TPM (Total Production Management)

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8 Total Preventive Maintenance Total

Production Management Total Productivity Management
JIPM
500

) TQM (Total Quality Management)

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NOTE:

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4.1
5S,,,,
6sigma6
AIAuto Insertion
AQLAccept Quality Level
B/IBurn In ()
BOMBill Of Material
BTOBuild To Order
CAD/CAMComputer Aided Design /
Manufacturing /
CALalibration ()
CARCorrective Action Response
CCRCustomer Complain Requirement /

Charge
CNDCannot Duplicate ,

CR Critical (CR>MA>MI)
CSCustomer Service
CTOConfigure To Order
Debit Note ()
DELL's Survey Form DELL

ECNEngineering Change Notice

ECREngineering Change Request
EMIElectro Magnetic Interference
ENGEngineering ()
ESDElectro static Discharge
FAEField Application Engineering

FAIFirst Article Inspection

FNFactory Notice

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FRRField Return Rate
FRUField Replacement Unit

Hi-Pot
Hold(shipping, production) (,)
ICTIn-Circuit Test (PC )
IEIndustrial Engineering
IPQCIn-Process Quality Control

IQCIncoming Quality Control

ISOInternational Organization for Standardization

JITJust In Time (,)

MAMajor
MEMechanical Engineering
MFGManufacturing ()

4.2
4.2.1 (Specification or Spec).
1.1 BOM: Bill of material

1.2 S/N: Spec notice

1.3: ES : Electrical Spec
1.4: PK: Schematic
1.5: PD: Physical dimension
ES: Input characteristics

1.1 Input voltage range

1.2 Input frequency range
1.3 Max .input AC current
1.4 Inrush current(cold start)
1.5 Efficency:60% Min. At nomall line
60% 115/230V,

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Noise test
Static output characteristics
Dynamic output characteristics
Rise time DC
Hold up time DC
Short circuit protection
Hi-pot(dielectric withstand voltage)

Primary to secondary AC TO DC.

Primary to safety ground AC TO FG.
Secondary to protection) DC TO FG.
Insulation resistance .
Leakage current .
Electrical
regulation
voltage / current
ripple / noise / buzz
frequency / load

Protection:
OVP(over voltage protection)
OPP(over power protection)
OCP(over current protection)
OTP(over temp protection)
no power (NOP
full load / low load
broken / blow out (BRO)
damage / adjust
open / short
oscilloscope
SPEC(
model:
revision:
issued date:
P/N:
description:
remark:

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reported by:
checked by:

approved by:

4.2.2 FN(factory notice):/ ECN (engineering change notice)

Immediated change
Running change
ECN: old rev.( new rev. (

drawing no / customer / alteration ref (//

)

4.2.3 Department
MFG: manufacturing
AI: auto insertion
Performing
SMD
QA: quality assurance
VQA
PQC ,FQC
Calibration , safety
PE: production engineering

TE: test engineering

ME: mechanical engineering
IE: industrial engineering
HR: human resources
Material
PC: production control
purchasing
warehouse
ENG: engineering
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document center

4.2.4 Safety
UL (Underwriters Laboratories)

CSA (Canadian Standards Association)

TUV
VDE
NEMKO

DEMKO
CCEE (China Commission for Conformity
Certification of Electronal Equipment )

CCIB (China Commodity Inspection Bureau)

4.2.5 Other
FAX (): date, to, fm, subject, dear, TKS, best
regards.
FAR: issue, description, corrective action,
preventive action, analysis, defect, failure,
supplier /vendor.

ISO: International Organization for Standardization

Quality Manual:
Procedure:
Quality policy: Quality ,Reliability
, Excellence .

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4.2.6 Contraction()
AQL: accept quality lecer
ATS: auto test system
CR: critical
ESD: electrostatic discharge
FET: field effective transistor
ICT: in - circuil test
MA: major
MI: minor
MRB: material review board
NTC: negative temperature characteristic
O/I: operation instruction

PWM: pulse width modification

S/N: series number
SMD: surface mounting device
WIP: work in progress ()
JIT: just in time
IR: infra-red
PDPC: process, decisionprogram, chart
QCCA: quality control circle activities
CWQC: company-wide quality control
QCCA: quality control circle activities
CWQC: company-wide quality control

4.2.7 Component()
bobbin
shield
bridge diode
triode

cable tie
tape
capactitor(cap)

screw tapping

case

screw machine

ceramic capacitor

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terminal
chip capacitor

transformer(X'FMR)

chip resistor
transistor
choke
tube
connector
varistor
control board
VR(variableresistance)

diode
washer
epoxy
zener
fan
jumper wire
lock washer

PCB
nut
tubber foot
TEFLON
stand-off

LED label

output wire
NTC
inductor
star washer
IC sping
washer
heat sink
socket
glue
solder bar
FET
regulator

filter
resistor
insulator
switch
output cable
photo couple

fuse
ricer
fuse clip
screw
fuse holder

quarter
since ..

week

after
before

4.2.8 Time()
month
period
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date
Jan. (Janury)
Feb.(February)
Mar.(March)
Apr.(April)

May
Jun.(June)
Jul.(July)
Aug.(August)
Sept.(September)
Oct.(October)

Nov.(November)

Dec.(December)

Mon=Monday
Tue=Tuesday

Wed=Wednesday

Thu=Thursday
Fri=Friday
Sat=Saturday
Sun=Sunday

damage
receive
find
replace
fix
send

go
take ,
happen
touch
improve
wind (,),

insert
issue
make ,

data
defect
disposition

engineer
failure
file

inspector

4.2.9 Ver. ()
change
pay
check
produce
come
provide

4.2.10 Non()
action ,
analysis
condition

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4.2.11 Process ()
assembly
method
burn-in(B/I)
model
component
noise
flux
pallet
function test
paper
gravity

plan
Hi-pot test
position
insertion
problem
ORT
procedure
packing
product
solder machine
production

station
record
supplier/vendor
remark
temperature
report
humidity
requirement
torque
sample

touch-up(T/U)(
)
target
layout
trace()
location
waybill
manager
operator
technician

gold
gray
green

orange
red
silver

violet(purple)
white
yellow

4.2.12 Color()
black
blue
brown

4.2.13
:
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10+e6=264.2
:
1 =1 =103 (g)
1 =453.59 (g)
:
(L)
1 (H)=103 =106

(R) 1 =103 =106

1m=10dm=10*10cm=10*10*10
mm
1inch=25.4mm
:
1 =10*10 =104
=106=1.5-e3
:
1
=10+e3=10+e6=10+e9=10+e3=

(C)
1 =106 =1012
(V)
1 =103 =106
(A)
1 =103 =106
(f)
1(MHz)=103 (KHz)=106
(Hz)

4.3

1. Bottom side of PCB

2. Cold Solder

3. Component Damage

4. Empty Solder

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5. Float

6. Oxidation

7. P/N (Part Number)

8. Polarity

9. Shift

10. Short

11. Solder Ball

12. Solder Icicle

13. Solder Residue

14. Substrate

15. Top side of PCB

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NOTE:

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(2003/07/01)

1.:
2
3.: ()
4.,: + () ++
5.+ = = =
ISO9001 = = = ISO9002
6.
7. ()

8.
(1.BTN: Build To Need
(2.BTO: Build To Order
(3.BTI:Build To Inventory
(4.DTN: Delivery To Need
(5.DTO: Delivery To Order
(6.CCP: Channel Configuration Program Compaq
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(7.CTO:Configuration To Order
9.:
TIER 1:PC ,(COMPAQ,DELL, HP, IBM)
TIER 2: PC , 5-20 (ACER, GATEWAY 2000,
PACKARD BELL NEC)
TIER 3:PC (,,)
TIER 4:CLONE PC (,)
10.:
Time To Market
Time To Volume
Time To Money ,
11.
12. +
13.
14.
15. ()
16. =+++(/:+)
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17.
18.
19. : ,,
20. : ==
21. : () (/)
22. : (/)
23. :
24. :
:
:
25. : +.
26. (1. (2. (3. (4.
27. : (1.2.3.(4..
28. Designing Review(): .
29. OEM:
30. ODM:
31. Connector & Cable Designing Review:
DR1 DR2 DR3 DR4
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DR5 DR6 DR7
32. PCE Designing Review:
DR1 DR2 DR3 DR4
DR5 DR6
33.PC : .
34. PC :
1. (High speed transmission) 2. (Heat dissipation)
3. /
(EMI/RFI) 4. (Acoustics) 5.(Power distribution)6. (Mechanical design) 7.
(Product styling & Cosmetics) 8. (Environmental protection & recycling)
35. Barebone
36. PCE Level--IV
Level 1 Parts manufacturing, Non-painted stamping parts + Molding parts ,
+
Level 2 Parts assembly + Cover painted +
Level 3 Computer case
Level 4 Computer case +SPS and /or Flat cable and / or Backplane +//

Level 5
Level 4 +FDD kitted with Heatsink and /or fan 4 + /
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37.PCE Level--VIXI
Level 6 Level 5 +Mother board and test
Level 7 System kitted with I/O devices (key board ,mouse) & user manual & power cord accessories
/
Level 8 Assembly high-price & customer-optioned: CPU,DRAM,HDD, CD-ROM,Add-on cards
: ,,,,
Level 9 Install OS and system test and ship-out ,
Level 10 Software Download and Diagnostic Test. ,,
Level 11 Racked Monitor with PC.system and Diliver PC
38.PCE
39.MRP
Material Requirement Planning
40.MRP
Manufacturing Resource Planning
41.ERP:
Enterprise Resource Planning
42.SCM:
Supply Chain Management
43. --(,...
)
44.--
45. JIT (Just in time) () WELL PLANNING = = ZERO
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DEFECT ().
46. "",: ", "
47. :
48. : ()
49. (1.; (2.;3.
; (4.; (5. JIT ; (6..
50. : +.
51. : Proforma Inv. .
52.: Bill Inv. .
53. : ,.
54. : ,.
55. ISO9001: --/...
56. ISO9002: --.
57. TPM: (Total Production Management).
57. 5S: .
58. : .
59. : ; .
60. 3C : COMPUTER COMMUNICATION CONSUMER -ELECTRONIC(
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FOXCONN Microsystem Corporation

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)
61. : ().
62. (): .
63. :
(1. (2.(3.(4.(5.(6.(7.
(8. (9.
64. : ().
65. : (1. (2. (3. (4.
66. : "".
67. : .
68. : ,.
69. 4 : +.
70. : "".
71. : .
72. : (1.,;
( 2. ,.
73. :(1. (2. (3..
74. : ,.
75. : .
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76. : .
77. : ,.
78. : ,.
79. 3C99,: 3C:; ; . 99:
; ; .
: A. ; B. ; C. ; D.
; E. ; F. ; G.
; H. .
80. : (1. (2. 3. 4. 5. 6.
(7..
81. : (1.
(2.
(3.
(4.
(5.
(6..
82. (SCM): (1.
(2.
(3.
83. 21 : A.B.C.
D.E.F.
.
84. 10 : ////.
85. : (1.
(2.
(3. .
86. : , .
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87. : //.
88. : 1. //()2. //
89.
90. ()//
91. (1.
(2.
(3.
(4.
(5. (6.

(7.
92. (1.
(2.
(3.
(4.
(5. (6.

(7.
93. ,
94. ()//()
95. / / / /
96. (1. (2. (3. (4.
(5. (6. (7. (8.
(9. (10. (11. (12.

97. CEM(CM)Contract Electronic Manufacture

98. / / / /
99. CMMComponet + Module + Move + +
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100. CMMSComponet + Module + Move + Service + + +
101. / /
102. 1. 2. 3. ()
4. 5.6. (7.
103. //
104. Execution (E=SAP) Speed (S)+ Accuracy(A)+(P)Precison
105. +
106. (KPI)1. Key Performance Index.2. .
107. : (1.(2.,
,.
108. : (1.(2.?
?
109. : ,
(1.,;(2.,.
110.: ,,.
111. : (1. (2. (3. (4. (5.+.

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NOTE:

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