General Information

DDR3 SDRAM

DDR3 SDRAM Product Guide

October 2009

Memory Division

October 2009

General Information

DDR3 SDRAM

1. DDR3 SDRAM Component Ordering Information

1

10

11

K 4 B X X X X X X X - X X X X
Speed

SAMSUNG Memory
DRAM

Temp & Power

DRAM Type

Package Type

Density

Revision
Interface (VDD, VDDQ)

Bit Organization

# of Internal Banks

1. SAMSUNG Memory : K

7. Interface ( VDD, VDDQ)

6 : SSTL (1.5V, 1.5V)

2. DRAM : 4
8. Revision
3. DRAM Type
B : DDR3 SDRAM

4. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb

M
A
B
C
D
E
F
G
H

: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen
: 8th Gen
: 9th Gen

9. Package Type
5. Bit Organization
04 : x 4
08 : x 8
16 : x16

Z
H
J
M

:
:
:
:

FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)

10. Temp & Power

C : Commercial Temp.( 0C ~ 85C) & Normal Power
L : Commercial Temp.( 0C ~ 85C) & Low Power
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks

11. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600

(400MHz @ CL=6, tRCD=6, tRP=6)

(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)

October 2009

General Information

DDR3 SDRAM

2. DDR3 SDRAM Component Product Guide

Density

1Gb D-die

1Gb E-die

1Gb F-die

2Gb B-die

2Gb C-die

Banks

8Banks

8Banks

8Banks

8Banks

8Banks

DDP 2Gb D-die

8Banks

DDP 2Gb E-die

8Banks

DDP 4Gb B-die

8Banks

Part Number

Package & Power,

Temp. (-C/-L) & Speed

Org.

K4B1G0446D

HC(L)F7/F8/H9

256M x 4

K4B1G0846D

HC(L)F7/F8/H9

128M x 8

K4B1G1646D

HC(L)F7/F8/H9

64M x 16

K4B1G0446E

HC(L)F7/F8/H9/K0

256M x 4

K4B1G0846E

HC(L)F7/F8/H9/K0

128M x 8

K4B1G1646E

HC(L)F7/F8/H9/K0

64M x 16

K4B1G0446E

HYF7/F8/H9/K0

256M x 4

K4B1G0846E

HYF7/F8/H9/K0

128M x 8

K4B1G0446F

HC(L)F8/H9

256M x 4

K4B1G0846F

HC(L)F8/H9

128M x 8

K4B1G0446F

HY(L)F8/H9

256M x 4

K4B1G0846F

HY(L)F8/H9

128M x 8

K4B2G0446B

HC(L)F7/F8/H9

512M x 4

K4B2G0846B

HC(L)F7/F8/H9

256M x 8

K4B2G1646B

HC(L)F7/F8/H9

128M x 16

K4B2G0446B

HYF7/F8/H9

512M x 4

K4B2G0846B

HYF7/F8/H9

256M x 8

K4B2G0446C

HC(L)F8/H9

512M x 4

K4B2G0846C

HC(L)F8/H9

256M x 8

K4B2G0446C

HY(L)F8/H9

512M x 4

K4B2G0846C

HY(L)F8/H9

256M x 8

K4B2G0446D

MC(L)F7/F8/H9

512M x 4

K4B2G0846D

MC(L)F7/F8/H9

256M x 8

K4B2G0446E

MC(L)F7/F8/H9

512M x 4

K4B2G0846E

MC(L)F7/F8/H9

256M x 8

K4B4G0446B

MC(L)F7/F8/H9

1G x 4

K4B2G0846B

MC(L)F7/F8/H9

512M x 8

VDD Voltage

1.5V

PKG
78 + 4 ball
FBGA

Avail.

Note

Now

96 + 4 ball
FBGA

1.5V

78 ball
FBGA
96 ball
FBGA

1.35V

Now

78 ball
FBGA

1.5V
78 ball
FBGA

Now

1.35V

1.5V

78 ball
FBGA
96 ball
FBGA

1.35V

Now

78 ball
FBGA

1.5V
78 ball
FBGA

Now

1.5V

78 ball
FBGA

Now

1.5V

78 ball
FBGA

Now

1.5V

78 ball
FBGA

Now

1.35V

* Note : 1.35V product is 1.5V operatable.

October 2009

General Information

DDR3 SDRAM

3. DDR3 SDRAM Module Ordering Information

1

10

11

12

M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits

Speed

DRAM Component Type

Temp & Power

Depth

PCB Revision
Package

# of Banks in Comp. & Interface

Component Revision

Bit Organization
1. Memory Module : M

8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.

2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71 :
78 :
91 :
92 :
93 :

x64
x64
x72
x72
x72

204pin Unbuffered SODIMM

240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM

A
C
E
G

:
:
:
:

2nd Gen.
4th Gen.
6th Gen.
8th Gen.

9. Package
: FBGA(Lead-free)
Z
: FBGA(Lead-free & Halogen-free)
H
: FBGA(Lead-free, DDP)
J
M : FBGA(Lead-free & Halogen-free, DDP)

10. PCB Revision

4. DRAM Component Type

0 : None
2 : 2nd Rev.
4 : 4th Rev.

1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer

B : DDR3 SDRAM (1.5V VDD)

5. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
2G : 2G

33
65
29
57
52
1K
2K

: 32M (for 128Mb/512Mb)

: 64M (for 128Mb/512Mb)
: 128M (for 128Mb/512Mb)
: 256M (for 512Mb/2Gb)
: 512M (for 512Mb/2Gb)
: 1G (for 2Gb)
: 2G (for 2Gb)

6. # of Banks in comp. & Interface

7 :

11. Temp & Power

C : Commercial Temp.( 0C ~ 85C) & Normal Power
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)

12. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600

(400MHz @ CL=6, tRCD=6, tRP=6)

(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)

8Banks & SSTL-1.5V

Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

7. Bit Organization
0 : x4
3 : x8
4 : x16

October 2009

General Information

DDR3 SDRAM

4. DDR3 SDRAM Module Product Guide

4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org.

128Mx 64

128Mx 72

256Mx 64

256Mx 72

Density

1GB

1GB

2GB

2GB

512Mx 64

4GB

512Mx 72

4GB

Part Number

Speed

M378B2873DZ1

CF8/H9

M378B2873EH1

CF8/H9/K0

M378B2873FHS

Raw Card

Composition

Comp.
Version

128M x 8 * 8 pcs

1Gb

D-die

128M x 8 * 8 pcs

1Gb

E-die

CF8/H9

128M x 8 * 8 pcs

1Gb

F-die

M391B2873DZ1

CF8/H9

128M x 8 * 9 pcs

1Gb

D-die

M391B2873EH1

CF8/H9/K0

128M x 8 * 9 pcs

1Gb

E-die

M391B2873FH0

CF8/H9/K0

128M x 8 * 9 pcs

1Gb

F-die

M378B5673DZ1

CF8/H9

128M x 8 * 16 pcs

1Gb

D-die

M378B5673EH1

CF8/H9/K0

128M x 8 * 16 pcs

1Gb

E-die

M378B5673FH0

CF8/H9/K0

128M x 8 * 16 pcs

1Gb

F-die

M378B5773CHS

CF8/H9/K0

256M x 8 * 8 pcs

2Gb

C-die

M391B5673DZ1

CF8/H9

128M x 8 * 18 pcs

1Gb

D-die

M391B5673EH1

CF8/H9/K0

128M x 8 * 18 pcs

1Gb

E-die

M391B5673FH0

CF8/H9/K0

128M x 8 * 18 pcs

1Gb

F-die

M391B5773CH0

CF8/H9/K0

M378B5273BH1

CF8/H9

M378B5273CH0

CF8/H9/K0

M391B5273BH1

CF8/H9

M391B5273CH0

CF8/H9/K0

A(1Rx8)

D(1Rx8)

B(2Rx8)

A(1Rx8)

E(2Rx8)

D(1Rx8)
B(2Rx8)

E(2Rx8)

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

B-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

B-die

256M x 8 * 18 pcs

2Gb

C-die

Internal
Banks

Rank

PKG

Height

Avail.

30mm

Now

30mm

Now

30mm

Now

30mm

Now

Note

78 + 4 ball
FBGA
8

78 ball
FBGA
78 + 4 ball
FBGA

78 ball
FBGA
78 + 4 ball
FBGA

2
78 ball
FBGA

1
78 + 4 ball
FBGA

2
78 ball
FBGA
1

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

Internal
Banks

Rank

PKG

Height

Avail.

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

2GB

4GB

Part Number

Speed

M391B2873EH1

YF8/H9

M391B2873FH0

YF8/H9

M391B5673EH1

YF8/H9

M391B5673FH0

YF8/H9

M391B5773CH0

YF8/H9

M391B5273BH1

YF8/H9

M391B5273CH0

YF8/H9

Raw Card
D(1Rx8)

E(2Rx8)
D(1Rx8)
E(2Rx8)

Composition

Comp.
Version

128M x 8 * 9 pcs

1Gb

E-die

128M x 8 * 9 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

E-die

128M x 8 * 18 pcs

1Gb

F-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

B-die

256M x 8 * 18 pcs

2Gb

C-die

Note

* Note : 1.35V product is 1.5V operatable.

October 2009

General Information

DDR3 SDRAM

4.3 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM
Org.

128Mx 64

256Mx 64

512Mx 64

Density

1GB

2GB

4GB

Comp.
Version

Internal
Banks

Rank

PKG

D-die

96 + 4 ball
FBGA

1Gb

E-die

78 ball
FBGA

64M x 16 * 8 pcs

1Gb

E-die

96 ball

64M x 16 * 8 pcs

1Gb

F-die

78 ball
FBGA

128M x 8 * 16 pcs

1Gb

D-die

128M x 8 * 16 pcs

1Gb

E-die

128M x 8 * 16 pcs

1Gb

F-die

Part Number

Speed

Raw Card

M471B2874DZ1

CF8/H9

A(2Rx16)

64M x 16 * 8 pcs

1Gb

M471B2873EH1

CF8/H9

B(1Rx8)

128M x 8 * 8 pcs

M471B2874EH1

CF8/H9

A(2Rx16)

M471B2873FHS

CF8/H9

B(1Rx8)

M471B5673DZ1

CF8/H9

M471B5673EH1

CF8/H9

M471B5673FH0

CF8/H9

M471B5773CHS

CF8/H9

M471B5273BH1

CF8/H9

M471B5273CH0

CF8/H9

F(2Rx8)

B(1Rx8)
F(2Rx8)

Composition

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

B-die

256M x 8 * 16 pcs

2Gb

C-die

Height

Avail.

30mm

Now

30mm

Now

30mm

Now

Note

78 + 4 ball
FBGA
8

2
78 ball
FBGA

Internal
Banks

Rank

PKG

78 ball
FBGA

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM
Org.

128Mx 64

Density

1GB

Speed

Raw Card

Composition

M471B2873EH1

YF8/H9

B(1Rx8)

128M x 8 * 8 pcs

1Gb

E-die

78 ball
FBGA

M471B2874EH1

YF8/H9

A(1Rx16)

64M x 16 * 8 pcs

1Gb

E-die

96 ball

78 ball
FBGA

M471B2873FHS

256Mx 64

512Mx 64

2GB

4GB

Comp.
Version

Part Number

YF8/H9

M471B5673EH1

YF8/H9

M471B5673FH0

YF8/H9

M471B5773CHS

YF8/H9

M471B5273BH1

YF8/H9

M471B5273CH0

YF8/H9

B(1Rx8)
F(2Rx8)
B(1Rx8)
F(2Rx8)

128M x 8 * 8 pcs

1Gb

F-die

128M x 8 * 16 pcs

1Gb

E-die

128M x 8 * 16 pcs

1Gb

F-die

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

B-die

256M x 8 * 16 pcs

2Gb

C-die

Height

Avail.

30mm

Now

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

Note

* Note : 1.35V product is 1.5V operatable.

October 2009

General Information

DDR3 SDRAM

4.5 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM
Org.

128Mx 72

256Mx 72

512Mx 72

Density

1GB

2GB

4GB

Part Number

Speed

M393B2873DZ1

CF8/H9

M393B2873EH1

CF8/H9

M393B2873FH0

Raw Card

2Gx 72

8GB

Comp.
Version

128M x 8 * 9 pcs

1Gb

D-die

128M x 8 * 9 pcs

1Gb

E-die

CF8/H9

128M x 8 * 9 pcs

1Gb

F-die

M393B5673DZ1

CF8/H9

128M x 8 * 18 pcs

1Gb

D-die

M393B5673EH1

CF8/H9

128M x 8 * 18 pcs

1Gb

E-die

M393B5673FH0

CF8/H9

128M x 8 * 18 pcs

1Gb

F-die

M393B5670DZ1

CF8/H9

256M x 4 * 18 pcs

1Gb

D-die

M393B5670EH1

CF8/H9

256M x 4 * 18 pcs

1Gb

E-die

M393B5670FH0

CF8/H9

256M x 4 * 18 pcs

1Gb

F-die

M393B5173DZ1

CF7/F8

128M x 8 * 36 pcs

1Gb

D-die

M393B5173EH1

CF7/F8

128M x 8 * 36 pcs

1Gb

E-die

M393B5173FH0

CF7/F8

128M x 8 * 36 pcs

1Gb

F-die

M393B5170DZ1

CF8/H9

256M x 4 * 36 pcs

1Gb

D-die

M393B5170EH1

CF8/H9

256M x 4 * 36 pcs

1Gb

E-die

A(1Rx8)

B(2Rx8)

C(1Rx4)

H(4Rx8)

E(2Rx4)

M393B5170FH0

CF8/H9

256M x 4 * 36 pcs

1Gb

F-die

M393B5273BH1

CF8/H9

256M x 8 * 18 pcs

2Gb

B-die

M393B5273CH0

CF8/H9

256M x 8 * 18 pcs

2Gb

C-die

M393B5270BH1

CF8/H9

512M x 4 * 18 pcs

2Gb

B-die

M393B5270CH0

CF8/H9

512M x 4 * 18 pcs

2Gb

C-die

M393B1G70DJ1

CF7/F8

DDP
x 4 * 36 pcs
512M

1Gb

D-die

DDP
x 4 * 36 pcs
512M

1Gb

E-die

256M x 8 * 36 pcs

2Gb

B-die
C-die

B(2Rx8)

C(1Rx4)

F(4Rx4)

1Gx 72

Composition

M393B1G70EM1

CF7/F8

M393B1K73BH1

CF7/F8

M393B1K73CH0

CF7/F8

M393B1K70BH1

CF8/H9

M393B1K70CH0

CF8/H9

M393B2K70BM1

CF7/F8

16GB

H(4Rx8)

E(2Rx4)

F(4Rx4)
M393B2K70CM0

CF7/F8

Internal
Banks

Rank

PKG

Height

Avail.

30mm

Now

30mm

Now

30mm

Now

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

Note

78 + 4 ball
FBGA
8

78 ball
FBGA

78 + 4 ball
FBGA

78 ball
FBGA

78 + 4 ball
FBGA

78 ball
FBGA

78 + 4 ball
FBGA

78 ball
FBGA

78 + 4 ball
FBGA

8
2

78 ball
FBGA

256M x 8 * 36 pcs

2Gb

512M x 4 * 36 pcs

2Gb

B-die

512M x 4 * 36 pcs

2Gb

C-die

DDP
x 4 * 36 pcs
1G

2Gb

B-die

DDP
x 4 * 36 pcs
1G

2Gb

8
4

8
C-die

October 2009

General Information

DDR3 SDRAM

4.6 240Pin DDR3 Registered DIMM (1.35V Product)

240Pin DDR3 Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

2GB

4GB

Part Number

Speed

M393B2873EH1

YF8/H9

M393B2873FH0

YF8/H9

M393B5673EH1

YF8/H9

M393B5673FH0

YF8/H9

M393B5670EH1

YF8/H9

M393B5670FH0

YF8/H9

M393B5773CH0

YF8/H9

M393B5173EH1

YF7/F8

M393B5173FH0

YF7/F8

M393B5170EH1

YF8/H9

M393B5170FH0

YF8/H9

M393B5273BH1

YF8/H9

M393B5273CH0

YF8/H9

M393B5270BH1

YF8/H9

M393B5270CH0

YF8/H9

M393B1G70EM1

YF7/F8

Raw Card
A(1Rx8)

B(2Rx8)

C(1Rx4)
A(1Rx8)
H(4Rx8)

E(2Rx4)

B(2Rx8)

C(1Rx4)

F(4Rx4)
M393B1G70FM0
1Gx 72

8GB

M393B1K73BH1

YF7/F8

M393B1K73CH0

YF7/F8

M393B1K70BH1

YF8/H9

M393B1K70CH0

YF8/H9

M393B2K70BM1
2Gx 72

YF7/F8
H(4Rx8)

E(2Rx4)

YF7/F8

16GB

F(4Rx4)
M393B2K70CM0

YF7/F8

Composition

Comp.
Version

128M x 8 *

9 pcs

1Gb

E-die

128M x 8 *

9 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

E-die

128M x 8 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

E-die

256M x 4 * 18 pcs

1Gb

F-die

512M x 4 *

9 pcs

2Gb

C-die

128M x 8 * 36 pcs

1Gb

E-die

128M x 8 * 36 pcs

1Gb

F-die

256M x 4 * 36 pcs

1Gb

E-die

256M x 4 * 36 pcs

1Gb

F-die

256M x 8 * 18 pcs

2Gb

B-die

256M x 8 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

B-die

512M x 4 * 18 pcs

2Gb

C-die

DDP
x 4 * 36 pcs
512M

1Gb

E-die

DDP
x 4 * 36 pcs
512M

1Gb

256M x 8 * 36 pcs

2Gb

B-die

256M x 8 * 36 pcs

2Gb

C-die

512M x 4 * 36 pcs

2Gb

B-die

512M x 4 * 36 pcs

2Gb

C-die

DDP
x 4 * 36 pcs
1G

2Gb

B-die

DDP
x 4 * 36 pcs
1G

2Gb

Internal
Banks

Rank

PKG

Height

Avail.

78 ball
FBGA

30mm

Now

2
78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

Now

F-die

C-die

Note

Nov. 09
8

78 ball
FBGA

30mm
Now

78 ball
FBGA

Now
30mm
Nov. 09

* Note : 1.35V product is 1.5V operatable.

October 2009

General Information

DDR3 SDRAM

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)

240Pin DDR3 VLP Registered DIMM
Org.

128Mx 72

Density

1GB

Part Number

Speed

M392B2873DZ1

CF8/H9

M392B2873EH1

CF8/H9

M392B2873FH0

CF8/H9

M392B5673DZ1

CF8/H9

Raw Card

K(1Rx8)

Composition

Comp.
Version

128M x 8 *

9 pcs

1Gb

D-die

128M x 8 *

9 pcs

1Gb

E-die

128M x 8 *

9 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

D-die

Internal
Banks

256Mx 72

512Mx 72

2GB

4GB

CF8/H9

128M x 8 * 18 pcs

1Gb

E-die

M392B5673FH0

CF8/H9

128M x 8 * 18 pcs

1Gb

F-die

M392B5670DZ1

CF8/H9

256M x 4 * 18 pcs

1Gb

D-die

M392B5670EH1

CF8/H9

M392B5670FH0

CF8/H9

M392B5773CH0

CF8/H9

M392B5170DJ1

CF8/H9

M392B5170EM1

CF8/H9

M392B5170FM0

CF8/H9

M392B5173FM0

CF7/F8

M392B5273BH1

CF8/H9

M392B5273CH0

CF8/H9

M392B5270BH1

CF8/H9

M392B5270CH0

CF8/H9

M392B1K73BM1

M(1Rx4)

K(1Rx8)

N(2Rx4)

V(4Rx8)
L(2Rx8)

M(1Rx4)

CF7/F8
V(4Rx8)

1Gx 72

256M x 4 * 18 pcs

1Gb

E-die

256M x 4 * 18 pcs

1Gb

F-die

128M x 8 *

9 pcs

1Gb

F-die

DDP
x 4 * 18 pcs
512M

1Gb

D-die

DDP
x 4 * 18 pcs
512M

1Gb

E-die

DDP
x 4 * 18 pcs
512M

1Gb

F-die

DDP
x 8 * 18 pcs
256M

1Gb

F-die

256M x 8 * 18 pcs

2Gb

B-die

256M x 8 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

B-die

512M x 4 * 18 pcs

2Gb

C-die

DDP
x 8 * 18 pcs
512M

2Gb

B-die

Avail.

18.75mm

Now

78 + 4 ball
18.75mm
FBGA

Now

Note

78 ball
FBGA
78 + 4 ball
FBGA

8
1

78 ball
FBGA

78 ball
FBGA
78 ball
FBGA

78 ball
FBGA

18.75mm

Dec. 09

2
Now
1

CF7/F8

DDP
x 8 * 18 pcs
512M

2Gb

C-die

M392B1K70BM1

CF8/H9

DDP
x 4 * 18 pcs
1G

2Gb

B-die

M392B1K70CM0

CF8/H9

DDP
x 4 * 18 pcs
1G

2Gb

C-die

N(2Rx4)

Height

Now

M392B1K73CM0
8GB

PKG
78 + 4 ball
FBGA

L(2Rx8)
M392B5673EH1

Rank

78 ball
FBGA

18.75mm

Now

October 2009

General Information

DDR3 SDRAM

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

240Pin DDR3 VLP Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

2GB

4GB

Part Number

Speed

M392B2873EH1

YF8/H9

M392B2873FH0

YF8/H9

M392B5673EH1

YF8/H9

M392B5673FH0

YF8/H9

M392B5670EH1

YF8/H9

Raw Card
K(1Rx8)

L(2Rx8)

M(1Rx4)

Comp.
Version

128M x 8 * 9 pcs

1Gb

E-die

128M x 8 * 9 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

E-die

128M x 8 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

E-die

M392B5670FH0

YF8/H9

256M x 4 * 18 pcs

1Gb

F-die

M392B5773CH0

YF8/H9

K(1Rx8)

512M x 4 * 9 pcs

2Gb

C-die

M392B5170EM1

YF8/H9

N(2Rx4)

DDP
x 4 * 18 pcs
512M

1Gb

M392B5173FM0

YF7/F8

V(4Rx8)

256M x 8 * 18 pcs

M392B5170FM0

YF8/H9

N(2Rx4)

512M x 4 * 18 pcs

M392B5273BH1

YF8/H9

M392B5273CH0

YF8/H9

M392B5270BH1

YF8/H9

M392B5270CH0

YF8/H9

M392B1K73BM1

YF7/F8

L(2Rx8)

M(1Rx4)

V(4Rx8)
M392B1K73CM0
1Gx 72

Composition

YF7/F8

8GB
M392B1K70BM1

YF8/H9
N(2Rx4)

M392B1K70CM0

YF8/H9

Internal
Banks

Rank

PKG

Height

Avail.

78 ball
FBGA

18.75mm

Now

2
78 ball
FBGA

18.75mm

Now

E-die

1Gb

F-die

1Gb

F-die

256M x 8 * 18 pcs

2Gb

B-die

256M x 8 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

B-die

512M x 4 * 18 pcs

2Gb

C-die

DDP
x 8 * 18 pcs
512M

2Gb

B-die

DDP
x 8 * 18 pcs
512M

2Gb

DDP
x 4 * 18 pcs
1G

2Gb

DDP
x 4 * 18 pcs
1G

2Gb

Now
Dec. 09
78 ball
18.75mm
FBGA
Now

Now

C-die

78 ball
FBGA

B-die
8
C-die

Note

Nov. 09
18.75mm
Now

2
Nov. 09

* Note : 1.35V product is 1.5V operatable.

October 2009

General Information

DDR3 SDRAM

5. RDIMM RCD Information

5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example

4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0

Made in Korea

M393B5170EH1-CH9

0920

5.3 RCD Information

- Example
Voltage
1.5V

1.35V

Vendor

Revision

Module P/N

JEDEC Description On Label

Inphi

GS04 B2

M393B5170EH1-CH9

4GB 2Rx4 PC3-10600R-09-10-E1-P0

IDT

LV DDR3 B0

M393B5170EH1-CH9

4GB 2Rx4 PC3-10600R-09-10-E1-D2

Inphi

LV GS02 C0

M393B5170EH1-YF8

4GB 2Rx4 PC3L-8500R-07-10-E1-P1

IDT

LV DDR3 B0

M393B5170EH1-YF8

4GB 2Rx4 PC3L-8500R-07-10-E1-D2

October 2009

General Information

DDR3 SDRAM

9.00 0.10

0.80 x 10 = 8.00
1.60

#A1 INDEX MARK

4.00

#A1

11.00 0.10

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

9.00 0.10

11 10 9 8 7 6 5 4 3 2 1

0.50 0.05

0.80

11.00 0.10

(Datum A)

0.10MAX

78 + 4Ball FBGA for 1Gb D-die (x4/x8)

0.35 0.05

(0.95)

82 - 0.45 Solder ball

(Post Reflow 0.05 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

Top

Bottom
: Support Ball

0.80 x 10 = 8.00

#A1 INDEX MARK

0.80

1.60

4.00
B

11 10 9 8 7 6 5 4 3 2 1

13.30 0.10

13.30 0.10

0.80 x 15 = 12.00

6.00
0.40

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T

9.00 0.10

0.80

(Datum A)

#A1

0.50 0.05

9.00 0.10

0.10MAX

96 + 4Ball FBGA for 1Gb D-die (x16)

0.35 0.05

(0.95)

100 - 0.45 Solder ball

(Post Reflow 0.05 0.05)

MOLDING AREA
1.10 0.10

(1.90)

0.2 M A B

Bottom

Top

: Support Ball

October 2009

General Information

DDR3 SDRAM

0.80 1.60

#A1 INDEX MARK

3.20

#A1

11.00 0.10

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

0.50 0.05

(Datum A)

11.00 0.10

7.50 0.10
0.80 x 8 = 6.40

0.10MAX

78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)

0.35 0.05

(0.95)

78 - 0.45 Solder ball

(Post Reflow 0.05 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

Top

Bottom

0.80 x 8 = 6.40
0.80 1.60

3.20

#A1 INDEX MARK

B

9 8 7 6 5 4 3 2 1

13.30 0.10

13.30 0.10

0.35 0.05

(0.95)

96 - 0.45 Solder ball

(Post Reflow 0.05 0.05)
0.2 M A B

0.80 x 15 = 12.00

6.00
0.40

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T

0.80

(Datum A)

7.50 0.10
#A1

0.50 0.05

7.50 0.10

0.10MAX

96Ball FBGA for 1Gb E-die (x16)

MOLDING AREA
1.10 0.10

(1.90)

Bottom

Top

October 2009

General Information

DDR3 SDRAM

9.00 0.10

0.80

A
#A1 INDEX MARK

3.20

1.60

#A1

11.50 0.10

0.80 x 12 = 9.60

0.80

4.80

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80

(Datum B)

9.00 0.10

9 8 7 6 5 4 3 2 1

11.50 0.10

(Datum A)

0.10MAX

78Ball FBGA for 2Gb B-die (x4/x8)

0.35 0.05

(0.95)

78 - 0.45 Solder ball

(Post Reflow 0.50 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

TOP VIEW

BOTTOM VIEW

9.00 0.10

0.10MAX

96Ball FBGA for 2Gb B-die (x16)

A
#A1 INDEX MARK

0.80

1.60

3.20

#A1

9 8 7 6 5 4 3 2 1

13.30 0.10

13.30 0.10

0.35 0.05

(0.95)

96 - 0.45 Solder ball

(Post Reflow 0.50 0.05)
0.2 M A B

0.80 x 12 = 12.00

6.00
0.40

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T

0.80

(Datum A)

9.00 0.10

MOLDING AREA

1.10 0.10

(1.90)

BOTTOM VIEW

TOP VIEW

October 2009

General Information

DDR3 SDRAM

10.50 0.10

0.80 x 8 = 6.40
0.80

1.60

#A1 INDEX MARK

4.00

#A1

11.00 0.10

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

10.50 0.10

9 8 7 6 5 4 3 2 1

11.00 0.10

(Datum A)

0.10MAX

78Ball DDP for 1Gb D-die (x4)

0.35 0.05

82 - 0.45 Solder ball

(Post Reflow 0.50 0.05)

1.40 0.10

0.2 M A B

Top

Bottom

9.00 0.10

0.80 x 8 = 6.40
0.80

1.60

#A1 INDEX MARK

3.20

#A1

11.50 0.10

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

9.00 0.10

9 8 7 6 5 4 3 2 1

11.50 0.10

(Datum A)

0.10MAX

78Ball DDP for 1Gb E-die (x4/x8)

0.35 0.05

78 - 0.45 Solder ball

(Post Reflow 0.50 0.05)

1.40 0.10

0.2 M A B

Bottom

Top

October 2009

General Information

DDR3 SDRAM

10.00 0.10

0.80 x 8 = 6.40
0.80

1.60

#A1 INDEX MARK

3.20

#A1

11.50 0.10

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

10.00 0.10

9 8 7 6 5 4 3 2 1

11.50 0.10

(Datum A)

0.10MAX

78Ball DDP for 2Gb B-die (x4/x8)

0.35 0.05

78 - 0.45 Solder ball

(Post Reflow 0.50 0.05)

1.40 0.10

0.2 M A B

Bottom

Top

October 2009

General Information

DDR3 SDRAM

x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

128.95

ECC

SPD

17.30

9.50

N/A

(for x64)

2.30

(for x72)

30.00 0.15

(4X)3.00 0.1

133.35 0.15

(2)
2.50
54.675
A

47.00

Max 4.0

71.00

N/A

(for x64)

ECC

(for x72)

2.50 0.20

1.270 0.10

5.00

0.80 0.05

3.80
1.500.10

2x 2.10 0.15

0.2 0.15

1.00

2.50

Detail A

Detail B

October 2009

General Information

DDR3 SDRAM

x64 204pin DDR3 SDRAM Unbuffered SODIMM

Units : Millimeters
67.60

0.10 M C A B
63.60

20.00

SPD

30.00 0.15

Max 3.8

1.00 0.10
24.80

A
21.00

B
39.00

2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 0.10
0.10 M C A B

0.60
0.45 0.03

1.65

4.00 0.10

2.55
0.25 MAX

1.00 0.10

Detail A

Detail B

October 2009

General Information

DDR3 SDRAM

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters
C

128.95
32.40

18.93

9.74

Max 4.0

54.675

2.30

2.50
A

1.0 max

47.00

1.27 0.10

2.50 0.20

71.00

5.00

0.80 0.05

3.80

0.2 0.15

1.00

0.4

1.500.10

10.9

Detail A

Detail B

Detail C

2x 2.10 0.15

Register

2.50

17.30

Register

30.00 0.15

18.92

0.
50

10.9

9.50

9.76

(2X)3.00

133.35 0.15

Address, Command and Control lines

October 2009

General Information

DDR3 SDRAM

Registered DIMM Heat Spreader Design

1. FRONT PART
Outside

R0 .2

4.65 0.12

2 0.1

2
2.6 0.2

0.15
1.3

1
0.
R

127 0.12

25.6 0.15

31.4

23.6 0.15

11.9

29.77

25.6 0.15

0.65 0.2

130.45 0.15

9.26

1+0/ -0.3

133.15 0.2

1.3

0.4

Inside
Green Line : TIM Attatch Line

7.45

Reg. pedestal line

80.78
119.29
128.5

2. BACK PART
Outside

Inside

Green Line : TIM Attatch Line

October 2009

General Information

DDR3 SDRAM

3. CLIP PART
39.3 0.2
Upper Bending
Tilting Gap

29.77

0.1 ~ 0.3

1.

0.5

4. DDR3 RDIMM ASSY View

Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

1.27

1.05

132.95 133.45

39.3 0.2

19

19 0.1

K
E (Clip open size)

text mark B or K
punch press_stamp

* Dimension Index
Mono

DDP

Note

Min.

Typ.

Max.

Min.

Typ.

Max.

43.9

44.4

6.7

6.8

6.9

7.2

7.3

7.4

5.8

6.3

6.7

6.8

6.9

7.2

7.3

7.4

E (Clip open size)

2.5

3.6

2.6

3.8

October 2009