SEMiX341D16s

Absolute Maximum Ratings Symbol

IFAV IFSM i2t

Conditions
Tc = 85 C Tc = 100 C Tj = 25 C Tj = 130 C Tj = 25 C Tj = 130 C

Values
340 290 2500 2000 31250 20000 1700 1600 -40 ... 130 -40 ... 125

Unit
A A A A A2s A2s V V C C V V

Recitifier Diode sin. 180 10 ms 10 ms

SEMiX 13

VRSM VRRM Tj Module

Bridge Rectifier Module (uncontrolled) SEMiX341D16s

Tstg Visol AC sinus 50Hz 1 min 1s

4000 4800

Characteristics

Features
Terminal height 17 mm Chips soldered directly to isolated substrate

Symbol
Diode VF V(TO) rT IRD Rth(j-c) Rth(j-c) Module Rth(c-s) Ms Mt a w

Conditions
Tj = 25 C, IF = 400 A Tj = 130 C Tj = 130 C Tj = 130 C, VRD = VRRM per diode per diode

min.

typ.

max.
1.75 0.9 2.7 4.5

Unit
V V m mA K/W K/W

Typical Applications*
Input Bridge Rectifier for AC/DC motor control power supply

sin. 180

0.22

K/W K/W K/W

per chip per module to heat sink (M5) to terminals (M6) 3 2.5 350 0.04 5 5 5 * 9,81

K/W Nm Nm m/s2 g

D by SEMIKRON Rev. 66 25.03.2010 1

SEMiX341D16s

Fig. 4L: Power dissipation per module vs. direct current

Fig. 4R: Power dissipation per module vs. case temperature

Fig. 6: Transient thermal impedance vs. time

Fig. 7: On-state characteristics

Fig. 8: Surge overload current vs. time

Rev. 66 25.03.2010

by SEMIKRON

SEMiX341D16s

spring configuration

SEMiX 13
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.

by SEMIKRON

Rev. 66 25.03.2010