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SWITCHMODE
MJE13007 MJF13007
POWER TRANSISTOR 8.0 AMPERES 400 VOLTS 80/40 WATTS
MAXIMUM RATINGS
Rating CollectorEmitter Sustaining Voltage CollectorEmitter Breakdown Voltage EmitterBase Voltage Collector Current Continuous Collector Current Peak (1) Base Current Continuous Base Current Peak (1) Emitter Current Continuous Emitter Current Peak (1) RMS Isolation Voltage (for 1 sec, R.H. < 30%, TA = 25C) Test No. 1 Per Fig. 15 Test No. 2 Per Fig. 16 Test No. 3 Per Fig. 17 Proper strike and creepage distance must be provided Total Device Dissipation @ TC = 25C Derate above 25C Operating and Storage Temperature Symbol VCEO VCES VEBO IC ICM IB IBM IE IEM VISOL 4500 3500 1500 MJE13007 MJF13007 Unit Vdc Vdc Vdc Adc Adc Adc V CASE 221A06 TO220AB MJE13007
PD TJ, Tstg
80 0.64
40* 0.32
Watts W/C C
65 to 150
THERMAL CHARACTERISTICS
Thermal Resistance Junction to Case Junction to Ambient Maximum Lead Temperature for Soldering Purposes: 1/8 from Case for 5 Seconds RJC RJA TL 1.56 62.5 260 3.12 62.5 C/W CASE 221D02 ISOLATED TO220 TYPE UL RECOGNIZED MJF13007
(1) Pulse Test: Pulse Width = 5.0 ms, Duty Cycle 10%. *Measurement made with thermocouple contacting the bottom insulated mountign surface of the *package (in a location beneath the die), the device mounted on a heatsink with thermal grease applied *at a mounting torque of 6 to 8lbs.
Designers Data for Worst Case Conditions The Designers Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves representing boundaries on device characteristics are given to facilitate worst case design.
MJE13007 MJF13007
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Characteristic *OFF CHARACTERISTICS CollectorEmitter Sustaining Voltage (IC = 10 mA, IB = 0) Collector Cutoff Current (VCES = 700 Vdc) (VCES = 700 Vdc, TC = 125C) Emitter Cutoff Current (VEB = 9.0 Vdc, IC = 0) SECOND BREAKDOWN Second Breakdown Collector Current with Base Forward Biased Clamped Inductive SOA with Base Reverse Biased *ON CHARACTERISTICS DC Current Gain (IC = 2.0 Adc, VCE = 5.0 Vdc) (IC = 5.0 Adc, VCE = 5.0 Vdc) CollectorEmitter Saturation Voltage (IC = 2.0 Adc, IB = 0.4 Adc) (IC = 5.0 Adc, IB = 1.0 Adc) (IC = 8.0 Adc, IB = 2.0 Adc) (IC = 5.0 Adc, IB = 1.0 Adc, TC = 100C) BaseEmitter Saturation Voltage (IC = 2.0 Adc, IB = 0.4 Adc) (IC = 5.0 Adc, IB = 1.0 Adc) (IC = 5.0 Adc, IB = 1.0 Adc, TC = 100C) DYNAMIC CHARACTERISTICS CurrentGain Bandwidth Product (IC = 500 mAdc, VCE = 10 Vdc, f = 1.0 MHz) Output Capacitance (VCB = 10 Vdc, IE = 0, f = 0.1 MHz) Collector to Heatsink Capacitance, MJF13007 SWITCHING CHARACTERISTICS Resistive Load (Table 1) Delay Time Rise Time Storage Time Fall Time Inductive Load, Clamped (Table 1) Voltage Storage Time Crossover Time Fall Time * Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%. VCC = 15 Vdc, IC = 5.0 A Vclamp = 300 Vdc IB(on) = 1.0 A, IB(off) = 2.5 A LC = 200 H TC = 25C TC = 100C TC = 25C TC = 100C TC = 25C TC = 100C tsv tc tfi 1.2 1.6 0.15 0.21 0.04 0.10 2.0 3.0 0.30 0.50 0.12 0.20 s s s (VCC = 125 Vdc, IC = 5.0 A, IB1 = IB2 = 1.0 A, tp = 25 s, Duty Cycle 1.0%) td tr ts tf 0.025 0.5 1.8 0.23 0.1 1.5 3.0 0.7 s fT Cob Cchs 4.0 14 80 3.0 MHz pF pF hFE 8.0 5.0 VCE(sat) VBE(sat) 1.2 1.6 1.5 1.0 2.0 3.0 3.0 Vdc 40 30 Vdc IS/b See Figure 6 See Figure 7 VCEO(sus) ICES IEBO 0.1 1.0 100 Adc 400 Vdc mAdc Symbol Min Typ Max Unit
MJE13007 MJF13007
1.4 VBE(sat), BASEEMITTER SATURATION VOLTAGE (VOLTS) IC/IB = 5 1.2 VCE(sat), COLLECTOREMITTER SATURATION VOLTAGE (VOLTS) 10 5 2 1 0.5 0.2 0.1 0.05 TC = 40C 25C 100C 0.05 0.1 0.2 0.5 1 2 5 10 IC/IB = 5
0.8
0.05
0.1
0.2
0.5
10
0.05
0.1
0.2
0.5
10
100
Cob 100
VCE = 5 V
1 0.01
0.1
10
10 0.1
10
100
1000
Figure 5. Capacitance
MJE13007 MJF13007
100 50 IC, COLLECTOR CURRENT (AMPS) 20 10 5 2 1 0.5 0.2 0.1 0.05 0.02 0.01 TC = 25C DC 5 ms
BONDING WIRE LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT CURVES APPLY BELOW RATED VCEO
TC 100C GAIN 4 LC = 500 H VBE(off) 5 V 0V 2 V 100 200 300 400 500 600 700 800 VCEV, COLLECTOREMITTER CLAMP VOLTAGE (VOLTS)
0 1000 0
10
0.4
0.2
0 20
40
60
80
100
120
140
160
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 6 is based on TC = 25C; TJ(pk) is variable depending on power level. Second breakdown pulse limits are valid for duty cycles to 10% but must be derated when T C 25C. Second breakdown limitations do not derate the same as thermal limitations. Allowable current at the voltages shown on Figure 6 may be found at any case temperature by using the appropriate curve on Figure 8. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. Use of reverse biased safe operating area data (Figure 7) is discussed in the applications information section.
1 0.7 0.5 D = 0.5 D = 0.2 0.2 0.1 0.07 0.05 D = 0.1 D = 0.05 D = 0.02 t1 t2 DUTY CYCLE, D = t1/t2 0.1 0.2 0.5 1 2 5 t, TIME (msec) 10 20 50 P(pk) RJC(t) = r(t) RJC RJC = 1.56C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) TC = P(pk) RJC(t) 100 200 500 10 k
0.02
0.01 0.01
MJE13007 MJF13007
1 0.5 0.3 0.2 D = 0.1 0.1 0.05 0.03 0.02 0.01 0.01 D = 0.05 SINGLE PULSE t1 t2 DUTY CYCLE, D = t1/t2 P(pk) RJC(t) = r(t) RJC RJC = 3.12C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) TC = P(pk) RJC(t) D = 0.5 D = 0.2
0.02
0.05
0.1
2 3
10
1K
2K 3K 5K
MJE13007 MJF13007
Table 1. Test Conditions For Dynamic Performance
REVERSE BIAS SAFE OPERATING AREA AND INDUCTIVE SWITCHING
VCC 1 F 150 3W 100 3W MPF930 MPF930 +10 V 50 500 F Voff MUR105 MJE210 RB2 COMMON 150 3W MTP12N10 1 F RB1 A IB IB TUT 51 4V 5.1 k VCE D1 MTP8P10 MTP8P10 100 F L MUR8100E IC Vclamp = 300 Vdc +125 V RC RB TUT SCOPE
RESISTIVE SWITCHING
+15 V
TEST CIRCUITS
V(BR)CEO(sus)
Inductive Switching L = 200 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1
RBSOA L = 500 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1 VCC = 125 V RC = 25 D1 = 1N5820 OR EQUIV.
CIRCUIT VALUES
TEST WAVEFORMS
IC ICM
tf CLAMPED
tf UNCLAMPED t2
t1 ADJUSTED TO OBTAIN IC Lcoil (ICM) t1 VCC t2 Lcoil (ICM) Vclamp VCE IB1 IB
TYPICAL WAVEFORMS
VCE PEAK
25 s +11 V
0 9V tr, tf < 10 ns DUTY CYCLE = 1.0% RB AND RC ADJUSTED FOR DESIRED IB AND IC
IB2
VOLTAGE REQUIREMENTS (continued) In the four application examples (Table 2) load lines are shown in relation to the pulsed forward and reverse biased SOA curves. In circuits A and D, inductive reactance is clamped by the diodes shown. In circuits B and C the voltage is clamped by the output rectifiers, however, the voltage induced in the primary leakage inductance is not clamped by these diodes and could be large enough to destroy the device. A snubber network or an additional clamp may be required to keep the turnoff load line within the Reverse Bias SOA curve. Load lines that fall within the pulsed forward biased SOA curve during turnon and within the reverse bias SOA curve during turnoff are considered safe, with the following assumptions: (1) The device thermal limitations are not exceeded. (2) The turnon time does not exceed 10 s (see standard pulsed forward SOA curves in Figure 6). (3) The base drive conditions are within the specified limits shown on the Reverse Bias SOA curve (Figure 7). CURRENT REQUIREMENTS An efficient switching transistor must operate at the required current level with good fall time, high energy handling 6
capability and low saturation voltage. On this data sheet, these parameters have been specified at 5.0 amperes which represents typical design conditions for these devices. The current drive requirements are usually dictated by the VCE(sat) specification because the maximum saturation voltage is specified at a forced gain condition which must be duplicated or exceeded in the application to control the saturation voltage. SWITCHING REQUIREMENTS In many switching applications, a major portion of the transistor power dissipation occurs during the fall time (tfi). For this reason considerable effort is usually devoted to reducing the fall time. The recommended way to accomplish this is to reverse bias the baseemitter junction during turn off. The reverse biased switching characteristics for inductive loads are shown in Figures 13 and 14 and resistive loads in Figures 11 and 12. Usually the inductive load components will be the dominant factor in SWITCHMODE applications and the inductive switching data will more closely represent the device performance in actual application. The inductive switching characteristics are derived from the same circuit used to specify the reverse biased SOA curves, (see Table 1) providing correlation between test procedures and actual use conditions. Motorola Bipolar Power Transistor Device Data
MJE13007 MJF13007
SWITCHING TIME NOTES
In resistive switching circuits, rise, fall, and storage times have been defined and apply to both current and voltage waveforms since they are in phase. However, for inductive loads which are common to SWITCHMODE power supplies and any coil driver, current and voltage waveforms are not in phase. Therefore, separate measurements must be made on each waveform to determine the total switching time. For this reason, the following new terms have been defined. tsv = Voltage Storage Time, 90% IB1 to 10% Vclamp trv = Voltage Rise Time, 1090% Vclamp tfi = Current Fall Time, 9010% IC tti = Current Tail, 102% IC tc = Crossover Time, 10% Vclamp to 10% IC An enlarged portion of the turnoff waveforms is shown in Figure 13 to aid in the visual identity of these terms. For the designer, there is minimal switching loss during storage time and the predominant switching power losses occur during the crossover interval and can be obtained using the standard equation from AN222A: PSWT = 1/2 VCCIC(tc) f Typical inductive switching times are shown in Figure 14. In general, trv + tfi tc. However, at lower test currents this relationship may not be valid. As is common with most switching transistors, resistive switching is specified at 25C and has become a benchmark for designers. However, for designers of high frequency converter circuits, the user oriented specifications which make this a SWITCHMODE transistor are the inductive switching speeds (tc and tsv) which are guaranteed at 100C.
SWITCHING PERFORMANCE
10000 VCC = 125 V IC/IB = 5 IB(on) = IB(off) TJ = 25C PW = 25 s 10000 7000 5000 tr
ts
t, TIME (ns)
t, TIME (ns)
1000
100
IC 90% Vclamp tsv trv tc Vclamp IB 90% IB1 10% Vclamp 10% IC 90% IC tfi
10000 Vclamp tti t, TIME (ns) 5000 2000 1000 500 200 100 50 20 TIME 10 0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 tfi IC/IB = 5 IB(off) = IC/2 Vclamp = 300 V LC = 200 H VCC = 15 V TJ = 25C
tsv
tc
2% IC
MJE13007 MJF13007
Table 2. Applications Examples of Switching Circuits
CIRCUIT SERIES SWITCHING REGULATOR
COLLECTOR CURRENT 16 A
TIME DIAGRAMS
TC = 100C
A
VCC VO
+ Notes:
1
700 V 1
See AN569 for Pulse Power Derating Procedure. TURNON (FORWARD BIAS) SOA ton 10 s DUTY CYCLE 10% PD = 3200 W 2 300 V TURNOFF (REVERSE BIAS) SOA 1.5 V VBE(off) 9 V DUTY CYCLE 10% VCC + N (Vo) + LEAKAGE SPIKE VCE VCC + N (Vo) VCC ton
TIME
FLYBACK INVERTER
COLLECTOR CURRENT
16 A TC = 100C
IC toff t
VCC
VO N
LEAKAGE SPIKE
See AN569 for Pulse Power Derating Procedure. TURNON (FORWARD BIAS) SOA ton 10 s DUTY CYCLE 10% PD = 3200 W 2 300 V TURNOFF (REVERSE BIAS) SOA 1.5 V VBE(off) 9 V DUTY CYCLE 10% VCE 2 VCC VCC + TURNOFF VCC 400 V 1 COLLECTOR VOLTAGE 2 VCC 700 V 1 t
PUSHPULL INVERTER/CONVERTER
16 A TC = 100C
IC toff ton t
C
VCC
COLLECTOR CURRENT
VO
8A
TURNON
Notes:
1
See AN569 for Pulse Power Derating Procedure. TURNON (FORWARD BIAS) SOA ton 10 s DUTY CYCLE 10% PD = 3200 W 2 300 V 8A TURNOFF (REVERSE BIAS) SOA 1.5 V VBE(off) 9 V DUTY CYCLE 10%
SOLENOID DRIVER
SOLENOID
VCC
400 V 1
700 V 1
MJE13007 MJF13007
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED FULLY ISOLATED PACKAGE LEADS MOUNTED FULLY ISOLATED PACKAGE LEADS MOUNTED FULLY ISOLATED PACKAGE LEADS
CLIP
CLIP
0.107 MIN
0.107 MIN
HEATSINK 0.110 MIN Figure 15. Screw or Clip Mounting Position for Isolation Test Number 1
HEATSINK
HEATSINK
* Measurement made between leads and heatsink with all leads shorted together
MOUNTING INFORMATION
440 SCREW PLAIN WASHER
CLIP
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
MJE13007 MJF13007
PACKAGE DIMENSIONS
B
4 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
F C T A S
Q
1 2 3
H K Z L V G D N
R J
DIM A B C D F G H J K L N Q R S T U V Z
INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 0.080 BASE COLLECTOR EMITTER COLLECTOR
MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 2.04
STYLE 1: PIN 1. 2. 3. 4.
C S U
H K Y
G N L D
3 PL M
J R
0.25 (0.010)
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10
*MJE13007/D*
MJE13007/D