BUMP TECHNOLOGY

SEMINAR

ON

BUMP TECHNOLOG Y

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CHAPTER 1: INTRODUCTION
This seminar report was created to assist developers in maximizing application performance on new Intel graphics technologies, primarily focused on the new Intel microarchitecture codenamed Ivy Bridge. The document will introduce the new architecture and detail best practices with a focus on the DirectX 9, 10 and 11 APIs. Following the guidelines laid out in this document will help the developers game reach optimal performance on Intel processor graphics while providing a great gaming experience to the largest possible market. As reported by Mercury Research in the second quarter of 2011, Intels combined integrated graphics line currently enjoys the largest market share, standing at 50.4% for desktop parts, 59% for mobile parts. With the introduction of the Intel microarchitecture codenamed Sandy Bridge, the graphics processor has moved onto the same die as the CPU, and is now referred to as processor graphics. In addition, processor graphics has enjoyed numerous architectural improvements that yield significant performance improvements over previous generations of Intel integrated graphics parts. The new generation of microarchitecture, codenamed Ivy Bridge, provides another jump in functionality and performance over Sandy Bridge microarchitecture. Ivy Bridge microarchitecture is manufactured on the new 22nm process technology, incorporating Intels new tri-gate (or 3D) transistor technology. This innovative new process yields greater performance at much lower power. For example, the new tri-gate transistors exhibit 36% faster switching speed than the equivalent transistors on the legacy process at the same voltage. Tri-gate transistors also leak about 10x less current in their off state, resulting in a power saving of approximately 50% when using a comparable performance profile.

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CHAPTER 2: FLIP CHIP

2.1 Flip Chip Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC Chips and Micro electromechanical systems, to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

2.1 The topside of a Celeron-400 in a PPGA packing

2.2 Pin Grid Array

2.2 The pin grid array at the bottom of a XC68020, a prototype of the microprocessor

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2.3 The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. 2 pins are missing.

A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or roughly square and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages such as dual in-line package. PPGA: (Plastic pin grid array) used by Intel for late model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA.

2.4 The underside of a FC-PGA package (the die is on the other side)

A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array integrated circuit packaging in which the die faces downwards on the top of the substrate with the
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back of the die exposed. This allows the die to have a more direct contact with the heat sink or other cooling mechanism. The FCPGA was introduced by Intel with the Coppermine core Pentium

III and Celeron processors based on Socket 370, and was later used for Socket 478based Pentium 4 and Celeron processors. FC-PGA processors fit into zero insertion force Socket 370 and Socket 478-based motherboard sockets; similar packages have also been used by AMD. It is still used today for mobile Intel processors.

2.3 STAGGERED PIN The Staggered pin grid array (SPGA) is used by Intel processors based on Socket 5 and Socket 7. Socket 8 used a partial SPGA layout on half the processor. 2.5 View of the socket 7 321-pin connectors of a CPU

2.6 An example of a socket for a staggered pin grid array package.

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It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put differently: within a square boundary the pins form a diagonal square lattice. There is generally a section in the center of the package without any pins. SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as microprocessors.

2.4 CERAMIC
A ceramic pin grid array is a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD Socket A Athlons and the Duron A CPGA was used by AMD for Athlon and Duron processors based on Socket A, as well as some AMD processors based on Socket AM2 and Socket AM2+. While similar form factors have been used by other manufacturers, they are not officially referred to as CPGA. This type of packaging uses a ceramic substrate with pins arranged in an array.

2.5 ORGANIC
An organic pin grid array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate made out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket. The organic pin grid array was originally introduced for the AMD Athlon XP processors based on Socket A, also used for AMD processors using Socket 754, Socket 939, Socket 940, Socket AM2, and Socket AM2+.

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2.7 An OPGA CPU. Note the brown color - many OPGA parts are colored green. The die is in the center of the device, and the four gray circles are foam spacers to relieve pressure caused by the heat sink from the die.

2.6 Bump Reality

Bump Application is super easy and super faster way to share imformation between two Smart phones. Use Bump to share contact information and photos by simply bumping two phones together. Just open Bump, hold your phones, and gently bump your hands together -Bump will magically do all the rest.

2.7 Vision and Goal Behind Bump Application

The applications and possibilities for bump are enormous .Bump was born as a simple iPhone app for swapping contact information created by our three founders, but as our user base grew, so did our vision. We now have more than 75 million downloads, and a vision of changing the way people use their mobile devices. Our team includes some of the smartest and most talented developers and designers in Silicon Valley, and we all share a common goal: to build something people want and have fun doing it. Bump was part of Y Combinator's summer 2009 batch, and our growth has been fueled by some of the Valley's top investors and VCs, like Ron Conway, Ram Shriram, Sequoia Capital, and Andreessen Horowitz. We're based in downtown Mountain View, the epicenter of Silicon Valley, mere steps from Caltrain to San Francisco.

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2.8 Working of bump application

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CHAPTER 3:BUMP WORKING 3.1 Functionality

Amazing as the concept sounds, Bump allowed users to send contact information, photos, and other objects between phones. With version 3.0 however, only contact information and photos can be sent. Before bumping phones, each user confirms what he or she wants to send to the other user. To use the application, two people bump their phones together, and within about five to ten seconds, a screen appears on both users' screens allowing them to confirm what they want to send to each other. When two users bump their phones, the data is automatically sent through a separate internet server to the other user, which is able to detect when any two phones using the application bump each other. A newer aspect of the application allows two people to bump in order to become friends. A big part of Bump is sending and receiving contact information, so Bump obviously accesses contacts you choose to bump to someone and also adds contacts you receive to the Contacts app on your phone.Also, each time you bump with someone new, the app uses the contacts in your phone's Contacts / Address Book to show you what friends you both have in common. You may opt out of this feature in the app's Settings.It works only in Android Application which is a Linux-based operating system for mobile devices such as smartphones and tablet computers. It is developed by the Open Handset Alliance led by Google. Google purchased the initial developer of the software, Android Inc., in 2005. The unveiling of the Android distribution in 2007 was announced with the founding of the Open Handset releases Alliance, the a consortium code of 86 hardware, under software, theApache and telecommunication companies devoted to advancing open standards for mobile devices. Google Android as open-source, License. The Android Open Source Project (AOSP) is tasked with the maintenance and further development of Android. Android has a large community of developers writing applications ("apps") that extend the functionality of the devices. Developers write primarily in a customized version of Java. Apps can be downloaded from third-party sites or through online stores such as Google Play(formerly Android Market), the app store run by Google. As of February
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2012 there were more than 450,000 apps available for Android, and the estimated number of applications downloaded from the Android Market as of December 2011 exceeded 10 billion. Android was listed as the best-selling smartphone platform worldwide in Q4 2010 by Canalys with over 300 million Android devices in use by February 2012. According to Google's Andy Rubin, as of February 2012 there are over 850,000 Android devices activated every day. Bump Technologies, Inc. ("Bump") provides the Application (as defined below), the related services (the "Bump Services"), and the Site to you subject to the following Terms of Service (these "TOS"), which may be updated by Bump from time to time without notice to you. You can review the most current version of these TOS at any time at By accessing and using the Bump Services and/ or the Bump website at, you accept and agree to be bound by the terms and provision of the TOS. In addition, when using the Bump Services or the Site, you and Bump shall be subject to any additional posted guidelines or rules applicable to such services, including the Bump Privacy Policy found at http://bu.mp/privacy, which may be posted and modified from time to time. All such guidelines or rules are hereby incorporated by reference into the TOS. As used herein, the "Application" shall mean the Bump application which enables users to (a) exchange information, messages, images, photos and other content by "bumping" their cell phones or other wireless devices together, (b) otherwise send information, messages, images, photos and other content to other users of the Bump Application without the necessity of "bumping" cell phones or other wireless devices together, and (c) perform other functions or features which may be added to the Bump Application from time to time; "you", "yours" and "User" shall mean the user of the Application; "we", "us" and "our" shall mean Bump Technologies, Inc., the owner and licensor of the Application. These TOS are immediately effective upon your use of the Application, or your use or access to the Bump Services and/or the Site. If you do not agree to these TOS, you are required to immediately stop all use of and access to the Application, the Bump Services and the Site. 1. License. Bump has the sole authority and discretion to license to you the Application, which license is also governed by the terms of the Licensed Application End User License Agreement found under "Terms of Service" in the iTunes Store for Applications on Apple platforms or, as applicable, the "Terms of Service" in the Android Market on
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Android platforms (collectively, "Other Agreements"). These TOS amend and supplement the Other Agreements and to the extent that these TOS contradict or are inconsistent with the Other Agreements, these TOS control and prevail. We reserve the right to change, modify, and update the Application at any time for any reason, without notice to you. We reserve the right to refuse service to anyone and to discontinue or suspend the Bump Services or Site at any time. We also reserve the right to deny your access to the Application, the Bump Services or Site due to your unprofessional conduct or practices, complaints about you from other Users or members of the public, and other reasons which we consider, at our sole discretion, to be harmful or disruptive. 2. User Signup. We provide the Application for your personal use. You are authorized to download the Application via the iTunes App Store or the Android Market. You acknowledge that by downloading the Application via the iTunes App Store or the Android Market, you are subject to their respective policies, terms of service and other related policies and procedures. You are not required to register with us separately in order to download the Application or to use the Bump Services. We do not charge you for downloading the Application; however, we reserve the right to charge for the Application, or certain features enabled by the Application, at a future date, which we would do by advance written notice to you.In consideration of your use of the Application, the Bump Services and the Site, you represent that you are of legal age to agree to these TOS and form a binding contract with us, and that you are not a person barred from receiving the Bump Services under the laws of the United States or other applicable jurisdiction. You are responsible for maintaining the confidentiality of personal or confidential information residing in your computer, cell phone or wireless device (collectively, "User Devices"), and are fully responsible for all activities that occur through your User Devices and through your use of the Application. You agree to immediately notify us of any unauthorized use of the Application or Bump Services or any other breach of security. We cannot and will not be liable for any loss or damage arising from any unauthorized use of the Application, the Bump Services or your User Devices. 3. Your Representations and Covenants. Your use of each of the Application, the Bump Services and the Site is strictly subject to the following code of conduct at all times. By using the Application, the Bump Services and/or the Site, you represent and covenant that you will not:
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1.

Transmit files, content, photographs, videos, personal or technical data or any

other type of information or data (collectively, "Content") which is false, inaccurate, misleading, defamatory, or libelous; 2. 3. 4. Transmit any Content that you have no rights to, or for which transmission by you Transmit identification documents or sensitive financial information of yourself or Transmit any viruses, malicious code, Trojan horses, worms, corrupted files, or would constitute infringement of third party intellectual property rights; any other person; any other similar software that may damage the operation of another's computer, data or property, or transmit any other harmful or code technology; 5. 6. 7. 8. 9. 10. 11. 12. Bully, intimidate, or harass any User or member of the public; Transmit Content that is obscene, hateful, threatening, pornographic, or that Use the Application, the Bump Services or the Site to do anything fraudulent, Engage in any unruly, disruptive, unprofessional, or offensive conduct while using Violate any laws, third party rights, or any of our Policies (as defined below); Engage in unlawful multi-level marketing, such as a pyramid scheme, using the Transmit unauthorized commercial Content or commercial communications (such Collect third party or our content or information, or otherwise access the

contains nudity or graphic or gratuitous violence; unlawful, misleading, malicious, or discriminatory; the Application, the Bump Services or the Site;

Application, the Bump Services or the Site; as spam) using the Application, the Bump Services or the Site; Application, the Bump Services or the Site using automated means (such as harvesting bots, robots, spiders, or scrapers) without our express advance written permission; 13. Use the Application, the Bump Services or the Site to collect Content from users for commercial or any other kind of use without first obtaining their consent and first making it clear you (and not us) are the one collecting their Content, and posting a privacy policy explaining what Content you collect and how you will use it; 14. 15. Do anything that could disable, overburden, or impair the proper operation of the Facilitate or encourage any violations of these TOS; and
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Application, the Bump Services or the Site, such as a denial of service attack;

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16.

Use our Content or trademarks (including Bump and the Bump logo), or any

confusingly similar marks (other than as part of your authorized use of the Application, the Bump Services or the Site), without our prior written permission. We may remove and/or block transmission of any Content or information that you transmit using the Application, the Bump Services and/or Site if we believe it breaches the above representations and covenants. We may also, at our sole discretion, with immediate effect and without advance notice, restrict or terminate your access to the Application, the Bump Services and/or Site, upon your breach of any of the above representations and covenants. All judgments concerning the applicability of the above terms to your activity shall be at our sole and exclusive discretion. 4. Usage of the Bump Services and Site. You acknowledge that Bump may establish general practices and limits concerning use of the Bump Services and Site at any time, at our discretion, including without limitation the maximum amount of information that can be submitted by an account, the maximum disk space that will be allotted on our servers on your behalf, and the maximum number of times (and the maximum duration for which) you may access the Bump Services and Site in a given period of time. You further acknowledge that we reserve the right to modify these general practices and limits from time to time. 5. Consent to Electronic Communications, Transmissions, Storage and Solicitation. We may send you communications or data regarding the Application, the Bump Services or the Site, including but not limited to (i) notices about your use of the Application, the Bump Services and/or the Site, including any notices concerning your use or violations of applicable terms and conditions, (ii) updates, and (iii) promotional information and materials regarding our products and services, via the Application or Bump Services, or via electronic mail (if you provide us your email address (such as sending us a message regarding the Application)). In order to use the Application and Bump Services, you hereby grant permission for us and our software to utilize the processor, storage and bandwidth of your User Device and network to provide us with certain information about your usage patterns, Session Data and other information about your usage experience. We will use this information as described in the Privacy Policy. You understand that the technical processing and transmission of the Application and the Bump Services, including your user content, may involve (a) transmissions over various networks; and (b)
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changes to conform and adapt to technical requirements of connecting networks or devices, and you accept and agree to these uses. As a result, and also as a result of our network architecture and business practices and the nature of electronic communications, even communications that seem to be intrastate in nature can result in the transmission of interstate communications regardless of where you are physically located at the time of transmission. Accordingly, by agreeing to these TOS, you acknowledge that use of the Bump Services may result in interstate data transmissions. Although we encrypt transmissions between devices, such encryption may not prevent unauthorized viewing of the data, and you should not have any expectation of privacy or security regarding your communications using the Application, the Bump Services or the Site. Always use caution when transmitting personal information. Additionally, we may add features to the Application or Bump Services which will become effective automatically. If we provide you with the ability to opt-out of such features, you may do so in the manner we provide. 7. Intellectual Property Rights. "Bump", "Bump Technologies" and all other trademarks, service marks, slogans, tag lines, graphics and logos used in connection with Bump, the Application, the Bump Services and/or the Site are trademarks or registered trademarks of Bump Technologies, Inc. or its affiliates. Other trademarks, service marks, graphics and logos used in connection with the site or platform may be the trademarks of other third parties. Your use of the Application, the Bump Services or the Site in no way grants you any right or license to reproduce or otherwise use any of our trademarks, third-party trademarks, or any content developed by us or by third parties, except for the normal use of such marks as part of your authorized use of the Application. All use of any such marks shall inure to the owner thereof. 8. Privacy Policy. You hereby authorize us to collect certain personal data about you. Your use of the Application, the Bump Services and the Site is subject to our Privacy Policy found at http://bu.mp/ privacy, which is hereby incorporated into these TOS. Termination. These TOS are terminable at any time by either party. If you terminate these TOS, you agree to no longer access or use the Application, the Bump Services or the Site and you must delete all copies of the Application from any device in your possession. Should you choose to re-access the Application, the Bump Services and/or the Site in the future, your use will be deemed as your acceptance of the TOS in effect at the time when you re-access the Application, the Bump Services and/or the Site.
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9. Indemnification. You agree to indemnify, defend and hold harmless, Bump Technologies, Inc., its affiliates, and their respective officers, directors, employees, agents, licensors, representatives, and third party providers, to and from and against all losses, expenses, damages and costs, including reasonable attorneys' fees, resulting from any violation of these TOS or of any applicable law by you, or due to or arising out of (i) the data or content you submit, post, transmit, distribute, publicize or otherwise make available through the Application or the Bump Services, or (ii) any of your actions when using the Application, the Bump Services and/or the Site. We reserve the right to assume, at our sole expense, the exclusive defense and control of any matter subject to indemnification by you, in which event you will fully cooperate with us in asserting any available defenses. 10. Governing Law. These TOS will be governed by and construed in accordance with the laws of the State of California, as applied to agreements entered into and to be performed entirely within California between California residents, without regard for conflict of laws principles. 11. Venue; Agreement to Exclusive Jurisdiction; No Obligation for User Disputes. You agree that you will resolve any claim, cause of action or dispute you have with us arising out of or relating to these TOS or the use of the Application, the Bump Services or the Site exclusively in a state or federal court located in Santa Clara County. You agree to submit to the personal jurisdiction of the courts located in Santa Clara County, California for the purpose of litigating all such claims. We are not responsible for addressing any disputes between any Users. In the event of a concern, claim or dispute, Users shall communicate directly with the other party in resolving such concern, claim or dispute. In the event we receive complaints about a User, we will investigate the complaint at our sole discretion and may direct the User to respond to the other party directly. 12. Notices. Unless specifically provided otherwise, all notices to us under these TOS must be provided by certified U.S. mail at the sending party's expense. We may provide notice to you by push notification in the Application. Notice sent by mail shall be deemed given three (3) days after the date of mailing. Our address for notices is: 200 W Evelyn Street Ste 200, Mountain View, California 94041, Attn: Legal Department.

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13. Additional Policies. In addition to these TOS and the Privacy Policy, we may develop new policies governing the user experience that we post on the Site (collectively, "Policies"), which shall be effective upon posting. Our Policies may be changed from time to time and such changes take effect when we post them on the Site. When using particular services on the Application, or any Bump Services or Site, you are subject to any posted Policies applicable to such services, which may be posted from time to time. You agree to observe and act in accordance with the Policies. In the event you fail to do so, you agree to promptly correct your action when notified by us. 14. Amendments. We reserve the right, at our sole discretion, to change, modify or otherwise alter these TOS at any time. You can find the most recent version of these TOS at http://bu.mp/tos, with the date of last modification noted above. Such modifications shall become effective immediately upon the posting thereof. Therefore, we encourage you to check the date of these TOS whenever you use the Application, Bump Services or the Site to check if they have been updated. You must review these TOS on a regular basis to keep yourself apprised of any changes. If you do not agree to the revised TOS, your sole recourse is to immediately stop all use of the Application, the Bump Services and the Site. Your continued use of the Application, the Bump Services or the Site following the posting of modifications will constitute your acceptance of the revised TOS. Should you have any questions regarding the use of the Application, please contact us at: support@bu.mp. None of our employees or agents have the authority to vary any of our Policies or these TOS. 15. Waiver. The failure to act with respect to a breach by the other party or by others does not waive a party's right to act with respect to subsequent or similar breaches. 16. Assignment. You will not transfer any of your rights or obligations under these TOS to anyone else without our consent. All of our rights and obligations hereunder are freely assignable by us in connection with a merger, acquisition, or sale of assets, or by operation of law or otherwise. 17. Legal Enforcement. We reserve the right to take steps that we believe are reasonably necessary or appropriate to enforce or verify compliance with any part of these TOS. You agree that we have the right without liability to you to disclose any of your personal information to law enforcement authorities, government officials and or a third party as we believe is reasonably necessary or appropriate to enforce or verify compliance with
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any part of these TOS. In addition, we may disclose information pursuant to subpoenas, court orders, or other requests (including criminal and civil matters) if we have a good faith belief that the response is required by law. This may include respecting requests from jurisdictions outside of the United States where we have a good faith belief that the response is required by law under the local laws in that jurisdiction, apply to Users from that jurisdiction, and are consistent with generally accepted international standards. We may also share information when we have a good faith belief it is necessary to prevent fraud or other illegal activity, to prevent imminent bodily harm, or to protect ourselves and you from people violating these TOS. This may include sharing information with other companies, lawyers, courts or other government entities. Nothing in these TOS shall prevent us from complying with applicable laws. 18. Third Party Beneficiary Rights. These TOS do not confer any third party beneficiary rights. 19. Survival. The following sections shall survive the termination of these TOS: Sections 3 through 26. 20. Headings. Headings are for reference purposes only and do not limit the extent or scope of the corresponding Section. 21. Severability. If for any reason a court of competent jurisdiction finds any provision, or portion thereof, to be unenforceable, the remainder of these TOS shall continue in full force and effect. 22. Entire Agreement. These TOS and all Policies incorporated herein constitute the entire agreement between the parties with respect to the use of the Application, the Bump Services and Site and supersedes all prior or contemporaneous understandings regarding such subject matter, whether oral or written, with the exception of any additional terms and conditions you are required to accept if you choose to use any of our additional services. 23. Special Provisions Applicable to Users Outside the United States. The following provisions apply to users outside the United States: You consent to having your personal data transferred to and processed in the United States. If you are located in a country embargoed by the United States, or are on the U.S. Treasury Department's list of Specially Designated Nationals you will not engage in commercial activities using the Application
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3.2 Manufacturing Steps

1. 2. 3. 4. 5. 6. 7. Integrated circuits are created on the wafer Pads are metalized on the surface of the chips Solder dots are deposited on each of the pads Chips are cut Chips are flipped and positioned so that the solder balls are facing the Solder balls are then remelted (typically using hot air reflow) Mounted chip is underfilled using an electrically-insulating adhesive

connectors on the external circuitry

3.3 WIRE BONDING/THERMOSONIC BONDING

The interconnections in a power package are made using thick aluminium wires (250 to 400 m) wedge-bonded

In typical semiconductor fabrication systems chips are built up in large numbers on a single large wafer of semiconductor material, typically silicon. The individual chips are patterned with small pads of metal near their edges that serve as the connections to an eventual mechanical carrier. The chips are then cut out of the wafer and attached to their carriers, typically via wire bonding such as Thermosoni Bonding. These wires eventually lead to pins on the outside of the carriers, which are attached to the rest of the circuitry making up the electronic system.

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3.3.1 FLIP CHIP

Side-view schematic of a typical flip chip mounting

Processing a flip chip is similar to conventional IC fabrication, with a few additional steps. Near the end of the manufacturing process, the attachment pads are metalized to make them more receptive to solder. This typically consists of several treatments. A small dot of solder is then deposited on each metalized pad. The chips are then cut out of the wafer as normal. Recently, high-speed mounting methods evolved through a cooperation between Reel Service Ltd. and Siemens AG in the development of a high speed mounting tape known as 'MicroTape. By adding a tape-and-reel process into the assembly methodology, placement at high speed, typically 20,000 placements per hour are achievable using standard PCB assembly equipment. To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors on the underlying electronics or circuit board. The solder is then remelted to produce an electrical connection, typically using an ultrasonic or alternatively reflow solder process. This also leaves a small space between the chip's circuitry and the underlying mounting. In most cases an electrically-insulating adhesive is then "underfilled" to provide a stronger mechanical connection, provide a heat bridge, and to ensure the solder joints are not stressed due to differential heating of the chip and the rest of the system.

3.4 Reasons Google Bought Bump Technologies

1.Google gets more multitouch capabilities. Yes, Google already has some multitouch functionality much to Apples chagrin in its Google Android smartphones, but the addition of a three-year-old proven desktop software from Bump Technologies puts a new layer of icing on the multitouch cake. While Apple (NSDQ:AAPL) alread1. Google gets
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more multitouch capabilities. Yes, Google already has some multitouch functionality much to Apples chagrin in its Google Android smartphones, but the addition of a threeyear-old proven desktop software from Bump Technologies puts a new layer of icing on the multitouch cake. While Apple (NSDQ:AAPL) already offers some multitouch capabilities like pinch-to-zoom and flick, BumpTop delivers some gestures that are specific to its 3D desktop software, like the ability to drag two fingers to focus on the desktops back wall. Anything that can differentiate Googles multitouch capabilities from Apples is a feather in Googles cap.y offers some multitouch capabilities like pinch-to-zoom and flick, BumpTop delivers some gestures that are specific to its 3D desktop software, like the ability to drag two fingers to focus on the desktops back wall. Anything that can differentiate Googles multitouch capabilities from Apples is a feather in Googles cap.

2. BumpTop could pave the way for a Google tablet The acquisition of Bump Technologies could mean a touch-screen Google tablet, or gPad, isnt just vapor or rumor. The BumpTop buy comes just as Apple reveals that it sold more than one million Apple iPad tablets since the device hit stores in early April. The ability to build a tablet around a 3D desktop interface gives Google a clear differentiator. And while the Apple iPad is the tablet to beat right now, a Google Android-based tablet, especially one built around BumpTop, could put a stick in Apples spokes. 3. The Bump Technologies purchase is just one piece of Googles master plan. Google has been paving the way dive head first into new markets. Along with Bump, Google this year has also acquired social search company Aardvark; hardware maker Agnilux; Microsoft Office collaboration suite DocVerse; video streaming company Episodic; game application and widget maker LabPixies; online photo editor Picnik; visual search provider Plink; and mobile email search provider reMail. While its not 100 percent clear what Google plans to do with all of its newly-acquired technologies, one thing is certain: Googles plans go well beyond just a 3D multitouch desktop. Combined, Googles 2010 acquisitions have the muscle to build an unstoppable fleet of mobile offerings that tie in everything from video to search and from widgets to a multitouch desktop, with chips and document management thrown in for good measure.
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3.5 Software
PayPal has released a second version of its payment application for Android smartphones, adding the ability to send money between phones by simply tapping the two devices together.Paypal has just released version 2.0 of its Android app, adding new features like the ability to use bump technology to quickly and easily transfer funds between devices.As PayPal notes in its blog entry announcing the new app, this feature has been part of the iPhone PayPal Mobile app since earlier this year. Its a great addition that makes it easy to pay for group dinners or events. The split the check feature also a port from the iPhone app makes dividing a bill and collecting funds super simple. The app also includes other features, like monitoring your balance and sending or requesting funds from individuals directly from the app. The new bump feature should work with other Android or iPhone devices, though I had some problems in my tests, probably because both phones were logged into the same PayPal account.The new feature is the same "bump technology" that PayPal has offered in its mobile app for Apple's iPhone. Another iPhone feature added to the Android app lets groups calculate the portion of a restaurant bill each person owes, and then reimburse on the spot the person paying the tab.

3.6 Security
When Bump application number one priority was creating the best possible user experience . Security of users personal information is a huge part of that experience. With Bump we are in control of deciding with whom we share our information. We don't have to worry about anyone being able to access our information unless we physically bump our phone with someone elses. Finally, we will never share any of our personal information with any third parties.

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CHAPTER 4: APPLICATIONS 4.1 ADVANTAGES

The resulting completed flip chip assembly is much smaller than a traditional carrierbased system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce inductance allowing higher-speed signals, and also conduct heat better.

4.2 Future Plan

What's next: Bump is gearing up to release version 2.0 of its flagship app in the next few months, which the company promises will include a range of new features derived from user feedback. In the long term, the company hopes to become a standard service used by smartphone owners--and once it reaches that point, company management will begin implementing an official revenue model.

4.3 Application
1.Sharinng contacts between two smartphones by bumping them. 2.Sharinng photos between two smartphones.

4.4 Problems and challenges in creating Bump technology

A free iPhone social networking application called Bump, which lets users quickly share personal contact information and photos, created a buzz at the CTIA International wireless conference.Bump, from Bump Technologies Inc. in Mountain View, Calif., first appeared in March, and was distinguished as the billionth download from Apple Inc.'s App Store. Thanks to that achievement, it was prominently featured in an iPhone TV ad and drew the attention of iPhone users -- and six months later, the level of attention seems to have multiplied.Bump aroused the curiosity of analysts and technology buffs at CTIA
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partly because of the way it uses AT&T Inc.'s network and the iPhone's built-in GPS functionality and sensors to help users share their contact information.The Bump allows two users who have loaded the app onto their iPhones clench their devices in their hands and then tap their hands together in a gentle fist bump to begin the exchange of information stored in each phone.A bartender at a CTIA party who noticed mobile phone executives playing with phones in the crowd remarked that Bump is his favorite iPhone app. "I don't know how it works, but you just bump another person, and it works," he said.So, how does it work? IDC analyst Scott Ellison said most Bump users mistakenly believe the device transmits the data over the air via Bluetooth or an infrared signal. However, the app actually relies on AT&T's 3G cellular or EDGE networks or Wi-Fi to transmit the data between phones.The Bump FAQ gives more details about how the phones identify each other and how each knows that the other is ready to transmit data.According to the FAQ, the Bump app runs on the iPhone and a matching algorithm runs on a server in the cloud. The app on the phone uses the sensors on the phone to "feel" the bump, sending that information to the server. The algorithm responds to bumps from phones globally and pairs up phones that "feel" the same bump, and it then routes the contact information between the two phones in the pair. The process takes less than 10 seconds.Ellison said that Bump relies on GPS to give the location of each phone, but it also uses the iPhone's accelerometer, which detects movement.The FAQ says that if two pairs of users bump their phones at the same time and in close proximity to each other -- at a crowded party, for example -- and the server can't identify the specific matches, the pairs will be asked to bump again.The communications between the phones and the server are encrypted for greater security. Once a bump is made, the server will find the two phones that felt the bump and then ask each one to transmit the contact information, but nothing else, the FAQ says. If both users confirm that the match is correct, the information is sent to the other party.Bump Technologies said that it plans to keep the basic version free for the "entire foreseeable future" and that it is working to make the app available for other smartphones equipped with sensing technologies "in the near future."The Apple App Store includes a variety of customer reviews that show how Bump is used. One comment, by someone identified as Paddledave, says the app is "great if you are in a bar and too drunk to trade contacts." Another by a user dubbed cwinfoseeker says, "it's cool but it would be way better if u
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could bump music and apps with ur friends."Ellison said the Bump is "very, very snazzy" and is a good example of the capabilities of emerging mobile technologies.

4.5 Availability
Bump has only been available for download from the App Store for a month, but already the social networking app has secured a place in iPhone app history. Bump became the one billionth download from the App Store when a Connecticut teenager selected the free app on Thursday.It's a pretty fortuitous turn of events for an app that aims to help you exchange contact information by bumping your iPhone or iPod touch with another user. Bump is the first App Store offering from Bump Technologies, the brainchild of ex-Texas Instruments employees David Lieb, Andy Huibers, and Jake Mintz.I spoke with Lieb for a little bit on Friday and found out the origins of Bump. A first year MBA student at the University of Chicago Booth School of Business, Lieb said he was always jotting contact info into his iPhone when at school."I knew there had to be a better way," he said. Lieb contacted Mintz and Huibers and the company was born. There was however, one problem. Huibers, the programming brains behind the project, didn't have a Mac and had never programmed for any Apple platform.Andy bought a Mac the next day and he had the basis for the application done within a week," said Lieb.The finished product exchanges contact data between two mobile devices over any type of wireless connection. Both users open Bump on their respective phones and then, holding the phones, gently bump their hands together.There are actually two parts to the swapping of information-the app running on the iPhone and a server in the cloud. In its simplest form, when two phones literally bump, they send the information to the server--the server then uses an algorithm to match that bump to another phone in the cloud. The users are asked if they want to swap information and once confirmed, the info is swapped, saving the new contact data in each user's respective address book.Bump Technologies has big plans for Bump and the technology used by the app. A paid pro version of the app is in the works, promising the ability to send photos and multiple contacts; look for it in the next few months

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CONCLUSION
Bump Technology has definitely gotten a lot of attention, mostly due to the gimmicky feel of the service, which allows users to swap a wide range of datacontacts, photos and soon, much morewhen they tap two phones together.There have been lots of versions of this kind of thing over the years, of course, using a variety of technologies. But the surge in smartphone popularity and app use has made digitally enabled physical transactions a whole lot easier. These days, even competing operating systems, like those for the Apple iPhone and Google Android devices, can bump in a much nicer way than they are currently doing as companies.

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4. References
[1] Dalrymple, Jim (April 24, 2009). "Meet Bump, the App Store's Billionth

Download". PC World. Retrieved August 17, 2010. [2] All-Time Top 10 Free iPhone Apps". Business Insider. January 19, 2011. [3] Segan, Sascha (April 24, 2009). "Review: Bump, the One Billionth iPhone App". PC Magazine Retrieved August 17, 2010. [4] Benderoff, Eric (April 24, 2009). "New iPhone app works by bump, not touch". Chicago Tribune Retrieved August 17, 2010. [5] Parr, Ben. "Facebook Friending Made Simple: Just Shake Your iPhone". Mashable Retrieved August 17, 2010. [6] Miller, Clair Cain (March 15, 2010). "Owe Someone Money? Just Bump Your Phones". The New York Times. Retrieved August 17, 2010. [7] Kincaid, Jason (October 24, 2009). "Sequoia Capital Invests In Bump Technologies, The iPhone-Tapping Data Swap App". Techcrunch Retrieved February, 4 2011 [8] Kincaid, Jason (October 24, 2009). "Sequoia Capital Invests In Bump Technologies, The iPhone-Tapping Data Swap App". Techcrunch Retrieved February, 4 2011. [9] Hambien, Matt (October 8, 2009). "Bump app draws buzz at CTIA". Computerworld. Retrieved August 17, 2010.

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