Ichia Company Profile - Dec24 Y10

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Integrity & Honesty, Dedication, Innovation, Achievement 2010 Dec 27
Company Profile for Company Profile for
your fine pitch FPC partner your fine pitch FPC partner

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Integrity & Honesty, Dedication, Innovation, Achievement
Established in 1983
Current Capital : US$ 110 Million
Chairman : Benny Huang
CEO : Jennifer Huang
No. of Employee : 8,000
Global Footprint : 7 presences in Asia, North/South America
Service and Offering : FPC, Keypad, Magnesium Alloy, Cosmetic Sub-Assy.
ichia Technologies, Inc. ichia Technologies, Inc.
Linkou HQ, Taiwan

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History
History
Yr 1983 Company Established for Rubber Keypad Mfg.
Yr 1987 Started Plastic Injection Molding
Yr 1989 Est. 2nd Factory in Penang, Malaysia
Yr 1993 Est. N. America Branch in San Diego, USA
Yr 1995 Est. 3rd Factory in Tijuana, Mexico
Yr 1996 Est. 4th Factory in Zhong Shan, China
Yr 1998 Est. FPC R&D in Hsin-Chu Factory
Yr 1999 Est. 5th Factory in Zhong Shan, China
Yr 2000 set up FPC Division.
Yr 2000 IPO Taiwan stock exchange ( Symbol: 2402 )
Yr 2000 Est. 6th Factory/R&D Center in Lin-Kou, Taipei
Yr 2001 Acquired Landsfair Tech for Magnesium Alloy Mfg.
Yr 2002 Set up 7th Factory in Su Zhou, China
Yr 2004 Dormitory completion in SZ factory

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MVI
-Rubber / FIR / GM / P+R
-Ultra Thin P+R / Metal
-Sheet Type (Plastic, Metal)
-Module (Keypad + LGF + FPC
+ Metal Dome)
2
Component Solutions Component Solutions
FPC
-Single-sided
-Double sided
-Multi layer
-COF
-SMT
1

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Sales
Admin
Div.
Korea
Area
Japan
Area
Taiwan
Team II
CEO
Jennifer Huang
Chairman
Benny Huang
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QA Center
Europe
Area
Panel
Cluster
RIM
Team
Taiwan
Team I
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North
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Consultant, CIO,
Audit, Legal
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Hungary Plant
Mexico Plant
Organization Organization
RD Center FPC Center
Sales & Market
Center
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MVI Center
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Sales Revenue (2004~2010) Sales Revenue (2004~2010)
106
99
88
111
116
144
110
143
155
125
126
116
172
140
0
50
100
150
200
250
300
350
'04 '05 '06 '07 '08 '09 '10 (F)
MMI-Keypad
FPC
Unit : Million in US$
205
199
260
253
280
242
312

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FPC
FPC
Offer & Delivery
Offer & Delivery

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8
Single-sided
FPC
Single-sided
FPC
Single-sided
double access
Single-sided
double access
COF
COF
Double-sided
FPC
Double-sided
FPC
Multi-layer
FPC
Multi-layer
FPC
SMT
ACF bonding
IC bonding
ACP printing
SMT
ACF bonding
IC bonding
ACP printing
Product Portfolio
Product Portfolio

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Application Type FCCL
1/2 oz RA + 10um AD + 1/2mil PI
1/2 oz RA + 10um AD + 1mil PI
1/2 oz RA + 20um AD + 1mil PI
Pick up
Double Side FPC
(Adhesive)
1/2 oz RA + 10um AD + 1/2mil PI
Industrial
Computer
1 oz RA + 18um AD + 1mil PI
CMOS
Double Side FPC
(Adhesive)
1/2 oz RA + 1/2mil PI
Double Side FPC
(Adhesive-less)
Double Side FPC
(Adhesive)
Type FCCL
1/2oz RA Cu + 1mil PI
1/2oz RA Cu + 1/2mil PI
1/3oz ED Cu + 10umAD + 1mil PI
1/2oz RA Cu + 15umAD + 1mil PI
1/2oz RA + 1/2milPI
Single sided FPC
(Adhesive-less)
Single sided FPC
(adhesive)
Multi layer (air gap) FPC
(Adhesive-less)
Double Side FPC
(Adhesive-less)
1/2ozRA+1/2milPI
Type FCCL
1/3 oz ED Cu + 20um PI
1/2oz RA Cu + 12um PI
Multi layer FPC
(adhesive-less)
1/2oz RA Cu + 10um AD
+ 12um PI
Multi layer FPC
(adhesive)
Type FCCL
1/3 oz ED + 20um PI
1/2 oz RA + 1 mil PI
1/2 oz RA + 15 AD + 1mil PI
1/2 oz RA + 15 AD + 1/2mil PI
Double Side FPC
(Adhesive-less)
Double Side FPC
(Adhesive)
Applications Applications
1/3oz ED+25umPI
1/4oz ED+25umPI
1/3oz ED+15um AD+1/2mil PI

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Ichia Suzhou Facility I
Ichia Suzhou Facility I
By end of 2011, this 3 buildings will be all for FPC BG.
Currently, Building-1 for MMI, Building-2 for FPC, Building-3 for Magnesium
Building-1
Building-2
Building-3
FPC
FPC
FPC
2011

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Ichia Suzhou Facility II
Ichia Suzhou Facility II
120,000 sq. meters
MET
30,000 sq. meters
MMI
45,000 sq. meters
(Empty now)

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FPC & SMT Capacity FPC & SMT Capacity
12000
49700
21500
12000
62800
29800
12000
75100
34600
0
10000
20000
30000
40000
50000
60000
70000
80000
90000
2010 Q3 2010 Q4 2011 Q4
S/S
D/S
M/L
Flex : M
2
/ month
* Remark: Current capacity utilization 70%
- 14,000,000 22 (Q2 2011)
80% 12,000,000 18 (Q2 2010)
SMT
( pcs / month)
Current Utilization % Capacity
Lines
2010
Type
I. Bare flex capacity:
II. SMT monthly capacity:

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Max. Panel size
Max. Panel size
Min. pattern Pitch
Min. pattern Pitch
Min. Ring pad
Min. Ring pad
250 mm x 500 mm
250 mm x 500 mm
S/S 38 um ; D/S 80 um; M/L 100um
S/S 38 um ; D/S 80 um; M/L 100um
Ni-Au electrolytic plating Ni:2~9um Au: 0.03~0.09um
OSP 0.2~0.5um
ENIG Ni:1~6um Au: 0.03~0.09um
Sn electrolytic plating 6+/-4um
Immersion Tin 0.3~0.9um
Ni-Au electrolytic plating Ni:2~9um Au: 0.03~0.09um
OSP 0.2~0.5um
ENIG Ni:1~6um Au: 0.03~0.09um
Sn electrolytic plating 6+/-4um
Immersion Tin 0.3~0.9um
Min. via diameter
Min. via diameter
No. of layers
No. of layers
Surface finishing
Surface finishing
Material
Material
0.3 mm
0.3 mm
N/C 0.1 mm ; Laser 0.05 mm
N/C 0.1 mm ; Laser 0.05 mm
1 ~ 6 layer
1 ~ 6 layer
FCCL: PI 50um, 25um, 20um, 12.5um
Cu Foil ED Cu1~1/4OZ ; RA Cu 1~1/3OZ
Cover Coat: PI 25um, 20um, 12.5um,
Solder Mask 9~13um
PSR 17~25um
PIC 25um, 38um
Shielding: EMI film 32um
Silver Paste 9+/-3um
Stiffener: PI, PET, FR4, Metal
FCCL: PI 50um, 25um, 20um, 12.5um
Cu Foil ED Cu1~1/4OZ ; RA Cu 1~1/3OZ
Cover Coat: PI 25um, 20um, 12.5um,
Solder Mask 9~13um
PSR 17~25um
PIC 25um, 38um
Shielding: EMI film 32um
Silver Paste 9+/-3um
Stiffener: PI, PET, FR4, Metal
SMT
SMT
Connector : min pitch 0.4mm
Passive component : min 0201
BGA : min pitch 0.4mm
Connector : min pitch 0.4mm
Passive component : min 0201
BGA : min pitch 0.4mm
IC Bonding
IC Bonding Au-Au Eutectic bonding , min pitch 38 um
Au-Au Eutectic bonding , min pitch 38 um
FPC Manufacturing Capability FPC Manufacturing Capability

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Chip 0201 (01005 in progress)
BGA pitch 0.4mm (0.3mm in progress)
Baking & moisture sensitivity control
Lead Free FPCA RoHS conversion
Automated Optical Inspection (AOI) with in line real time
Shop floor data capture work stations
X-ray for BGA inspection and mechanical joint analysis
Inert atmosphere (Nitrogen) wave soldering
Under-fill, conformal coating, & IC bonding
Solder paste thickness control with laser solder paste measurement
machine
Function test
SMT Capability
SMT Capability

Page. 15
Description Lead Time
Single Sided (+SMT)
Double Sided (+SMT)
Multi-layer (+SMT)
Single Sided (+SMT)
Double Sided (+SMT)
Multi-Layer (+SMT)
Prototype
Mass
Production
7 (+1) days
12 (+1) days
16 (+1) days
3 (+1) weeks
4 (+1) weeks
6 (+1) weeks
Standard Lead Time
Standard Lead Time

Page. 16
MVI Production
MVI Production

Page. 17
Rubber / FI R
FI P (Film In Plastic)
GM (Glue Molding)
P+R (Plastic + Rubber)
Ultra Thin P+R / Metal
Sheet Type (Plastic, Metal)
Clear (Transparent) Touch Keypad
Capacitive Qwerty Keypad
Module (Keypad + LGF + FPC + Metal
Dome)
Experience in Variety of Keypad

Page. 18
Mechanical Vertical
I ntegration
Men machine
interface
Tactile
Backlighting
Decoration
Mechanical
Electronics
Total Solution
Housing
Keypad
Light guide
Metal dome
FPC
Metal parts
Sub-assembly

Page. 19
Housing
(A, B, C Cover)
FPC / Dome
sheet
Input device module
(keypad/Side
Key/Dome/FPC)
Lens / lens
with ITO film
Optical module
Antenna module
I chia MVI Solution
I chia MVI Solution

Page. 20
Keypad
Product
Keypad, NCVM, Light Guide, J ag
Ball,
Metal Frame, FPC, Metal Dome
Keypad, Light Guide,
Metal Frame, FPC, Metal Dome
Keypad, Light Guide, Ni-free plating
Cover, assembly with heat staking
GM Type
LGRF

Page. 21
Mag. Alloy / Cosmetic
Mag. Alloy / Cosmetic
Multi-type Keypad
Back Lighting
Side Key with FPC
FPC with Metal Dome,
LGF
NCVM Decoration Frame
Sub-Assembly

Page. 22
Quality Assurance System
Quality Assurance System

Page. 23
ISO 9001:2000
ISO 14001:2004
UL
TS16949
Aug 2004 June 2006.
Certificate No:C041059
Certificate No:CNABC01-B
Start
Certificate No:E213184
Dec 2006. Q2 2009.
Certificate
No:2009/34066

Page. 24
ISO9001.2000 QS9000.1998 ISO14001.1996
Green PARTNER OF
SONY
PARTNER OF
SAMSUNG SDI
TS16949
PARTNER OF
Samsung Electronics

Page. 25
3D Measuring Equipment High Temperature Chamber Peeling Off Tester
Membrane Thickness X-
Ray Measuring
Equipment
Humidity & Temperature
Chamber
Thermal Shock Tester
Low Temperature Chamber Solder Furnace Instrument Microscope SEM & EDS Metallurgical Microscope
Cyclic Volta Metric Stripping Atomic Absorption Uv Spectrophotometer MIT Folding Endurance Conductivity Scale
Shear Force Tester Electronic Scale High Resistance Meter Chroma Mewte Oblique Microscope
Long arm microscope
Laboratory Laboratory E Equipment quipment
ROHS TESTER
TDR

Page. 26
Laboratory Testing & Analysis
Laboratory Testing & Analysis
Solvent Concentration analysis
Solvent Ionic analysis
Micro-section observation and element analysis
Micro-section observation
Micro-section observation
Miniature dimension measurement
Plating Thickness Measurement
Flexural ability testing
Impedance control
Peeling strength of copper clad or PI film
Solder resistance for material/product
Solvent test
Product durability test
High temperature resistance test
Environmental simulation test
High low resistance test
Function
1 set UV Spectrometer
1 set Atomic Absorption
1 set SEM &EDS Material
Analysis
1 set Instrument Microscope
1 set Metallurgical Microscope
1 set 2.5D Measuring Machine
1 set X-RAY Measuring Equipment
Dimension
Measurement
1 set MIT Folding Endurance Tester
1 set Isolation Impedance between Pattern Tester
1 set Peeling off Strength Tester
1 set Heat Resistance of Solder
1 set Solvent-Resistant Tester
Reliability/Dura
bility Tests
1 set Salt-Spraying Tester
1 set High Temperature Chamber
1 set Humidity & Temperature Chamber
1 set Thermal Cycling Chamber
Environmental
Test
Set Equipment Category

Page. 27
Reliability
Reliability
T
T
est
est
ing
ing
I nsulation resistance test
Peeling off test (copper/ cover lay/ stiffener
Heat resistance of solder Tin
Thermal stock test
Temperature & humidity resistance test
High temperature test
Low temperature test
Solvent resistant
Bendingresistant test

Page. 28
E
n
t
e
r
p
r
i
s
e

V
a
l
u
e
2010 2011 2012 2013
Ichia quality strategy
(milestone)
2014~2018 2009
q Raise The Bar
q High Operation Discipline
q QIS & Pre-Alert System
q QCC/ QIT/ 6 Sigma Activity
Ichia will
integrate
internal &
external
resource to
build up the
superior
products
and fulfill
the
customer
satisfaction
thru the
high
discipline
and capable
work force
across the
industry.
Ichia will
integrate
internal &
external
resource to
build up the
superior
products
and fulfill
the
customer
satisfaction
thru the
high
discipline
and capable
work force
across the
industry.
Re-Building
Re-Enforcement
Customer
Satisfaction
3
QCC/ QIT Improvement Activity
4
Internal Audit (System, Process, Product, QSA, QPA, Supplier)
8 TQM Program Initiative
q Common
Vision/ Mission
q Staff
Recruitment
q QA/ QC
Integration
q Staff Training
& Dev.
10
Quality Cost OptimizeProgram
9
Lean MFGProgram Initiative
7
Customer Satisfaction Program Initiative
1 QA/ QC Integration & Re-Enforcement
5
Quality Information System & ABL Pre-Warning System
6
6 Sigma Improvement Activity
q ReduceCustomer
Complaints
q Customer
Relations
q AUO/ RIM Quality
Recognition
Best I n Class
Best Of I ndustry
2
Enhancement of Human Capability & Management Skill
QA/ QC QA/ QC Organizational Organizational
Formation Formation
Strengthen All Strengthen All
Manufacture, QA, Manufacture, QA,
QC Function & QC Function &
Capability Capability
Aggressiveness Quality Performance: Aggressiveness Quality Performance:
Maximum of First Pass Yield Rate, Maximum of First Pass Yield Rate,
Minimum of Customer Complaint Minimum of Customer Complaint

Page. 29
Thank you
Thank you

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