Mexi Tronic A

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Laser Soldering Process

Enrique Duarte
Thecnical Sesions / Mexitronica
Guadalajara, October 2007

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Enrique Duarte Introduction

Electronic Engineer
14 years of experience
Last 11 years working for Electronic Industry in Process Engineering Area.
Companies:
Process Development Engineer

Black Belt (DMAIC), DFSS (New
thecnologies)

Purpose:
All information presented in this conference is focused in Solving Process
Problems that we have day to day in Flextronics. Using Six Max
Methodologies for existing processes (DMAIC).
Scope:
Based on Laser Soldering Process for SMT connectors that can not be
processed in Reflow Oven because of the plastic properties, they can not
support high temperatures beyond 150C. Also, the q uantity of connector pins
(200, 300, 400) does not guarantee an acceptable quality soldering by hand.
This project was developed on Flextronics Campus South in Building Five.
Team Members for this project:
Ricardo Prez, Javier Cervantes, Efrain Amaral, Eduardo Camarena,
Guillermo Barajas, Roberto Reyes, Ruben Lpez, Arturo Nues, Leopoldo
Zuiga, Machine Supplier, Customer.
3


Six
SixSigma
SigmaProject
Project
Department:
Department:D&E
D&EGuadalajara
GuadalajaraSite
Site
Review
#
R0
Review # R0
Project
ProjectTitle:
Title:Laser
LaserSoldering
SolderingProcess
Process
Project
ProjectLeader:
Leader:Enrique
EnriqueDuarte
Duarte
Project
ProjectDescription:
Description:
The top detractor (Solder Empty Defect in J1

The top detractor
(Solder Empty
Defect inGDL,
J1 is
Connector)
for
the
Customer
ininFlextronics
Connector)
for
the
Customer
Flextronics
GDL,
is
generating
an
unstable
process
with
aaCPK
ofof 0.7
generating
an
unstable
process
with
CPK
0.7
(Laser
(LaserSoldering
SolderingProcess).
Process).
Customer Issue:
Defects Distribution (by issue)
Solder Issues
7.7%
2.6%
2.5%
3.2%
17.0%
55.6%
Laser Soldering process defects
Project
ProjectGoal:
Goal:Reduce
ReduceDefects
Defectsfrom
from2.5%
2.5%to
to
0.5%.
0.5%.To
Toprobe
probeififthe
themachine
machineisiscapable
capablewith
with
customer
requirements
.
customer requirements .
13.9%
Project
ProjectResults:
Results:Defects
Defectsreduced
reducedto
toless
less
than
than0.5%.
0.5%.The
Themachine
machineisisnot
notcapable
capableto
to
work
with
customer
requirements
.
work with customer requirements .

What is the High Level Problem? and Why Is It Important? , Who Are Customers
and Stakeholders?
:
ol s
.
ap
M
s
.
ces
elp
o
H
r
l
P
ic a
s.
n
h
art
c
h
e
C
T
.
tos
iag
e
r
D
a
e
ent
P
on
m
e
B
v
sh
pr o
F i
m
I
ic k
Qu
To
VOC
Escapes
Escapesto
toChina
China, ,ItItcauses
causesproblems
problemsfunctions
functionsin
inCustomer
Customerproducts
products&&
Operations
Operationslines
linesin
inFlextronics
FlextronicsGuadalajara.
Guadalajara.
6

How many connector families will be involved?, What are the projected business
benefits of this project?, What happen if we dont do anything?
We studied two families
of connectors, each one
has 50 models, then in
total they are around 100
models that have to be
under control in laser
soldering process.
Total of Defects
Total Units=
Oportunities per Unit=
DPU =
DPMO=
Process Capability (Zst)=
Process Capability (CP)=
Vis ual Inspection

(Se cond tim e=
120se c)
TOUCH-UP
VISUAL IINSPECTION
9
30
200
0.300
1500
2.97
0.99
J1
J1
FAMILY A
NO
SODF TBE AM
Total of Defects
Total Units=
Oportunities per Unit=
DPU =
DPMO=
Process Capability (Zst)=
Process Capability (CP)=
In these images, there are only examples of solder empty and solder bridge defects.
Solder Empty
Solder bridge
Misaligned
Tombstone
Burn
Project Definition. Projected Business

Benefits:
TOUCH-UP
(SECOND TIME=
120se c)
159
30
300
5.300
17667
2.10
0.70
DEFECT FOUND
FAMILY B
Solder Empty
Solder bridge
Misaligned
Tombstone
Burn
CONTINUE
WITH
NORMAL PROCESS
YES
$$$
Frecuency=
100% (Families UN's, TN's and KBN's)
Solder Wire Consumption per board=
0.30 grs
(Kester Solder Wire P/N 00500098)
Description
Touch-Up time(Second time)=
Inspector time (Second time)=
Description
Solder Wire=
Sec
120
120
Opr-Hour-cost (Dlls) Opr-sec-cost (Dlls)

3.66
0.001016667
6.42
0.001783333
Cost per gr. (Dlls)

0.48
Total cost (Dlls)

0.122
0.214
Facilities (10%)
0.0122
0.0214
Consumption per board (grs)

0.3
Total (Dlls)
0.144
GRAND TOTAL PER BOARD (DLLS)=

Production per Year (include all families)=
PCB's burned per year =
PCBA Cost per Unit (USDollar) =
180000
104
1200
Amountof Loss per

Year(Dlls)=
Total (Dlls)
0.1342
0.2354
0.3696
$217,248.00
0.5136
Flextronics is loosing
200k usd per year
because of the problems
generated in laser
soldering process.
7

Multi-Generational Plan?
More than 20
variables were
identified
Basic Understanding LSP, Mode: Continuos Pad

PARAMETERS TO
ed
PostHeat
Spe
(Models: B)
CONTROL:
A rm
Basic Understanding LSP, Mode: Continuos Pad

(Models: A)
Beam Power
off
PARAMETERS TO
CONTROL:
NOISE:
(x2,y2,z2)
PCB
How the machine works?
Power
.-Clamps
.- PCB Color
.- PCB Thickness
.- Bent Pins or misaligment
D1 .- Residuos
er
B
(C ar i
on s a
n e tta
c t ch
or e
D d to
es
ig th e
n) p
Soldering
Pre-heat
in
s
Softbeam
Laser Light
PARAMETERS TO
CONTROL:
1.- D1
2.-
3.- Pwr0(watts) Pre-heat
4.-Beam Diam (mm)
5.-Tpre (sec)
6.- Pwr1(watts) Feed
Beam Diam
So
ld
softbeam manual
15.-Arm Speed(mm/sec)
d
RevF
Softbeam
Laser Light
Pre-heat
Feed
(x2,y2,z2)
PCB
RevLn
PARAMETERS TO 16.- Pwr2(watts) Postheat
17.- Tpst(sec)
CONTROL:
18.- RevFd (mm/sec)
19.- RevLn(mm)
20.- Tdly(sec)
NOISE:
.-Clamps
.- PCB Color
.- PCB Thickness
D1 .- Residuos
Sp
ee
d(
CP
)
1.- D1
2.-
3.- Beam Power(watts)
4.-Beam Diam (mm)
5.-Wait Time. (sec) Pre-heat
6.- (x,y,z)
Beam Diam
Beam
Origin
Suspipe
bo
t
Ro
Can the Problem Be Broken into Smaller Pieces?
Connector Spec
300
Origin
(x1,y1,z1)
(x1,y1,z1)
PARAMETERS TO
CONTROL:
7.-Robot Speed CP (mm/sec)
connector specs
200
D2
e
Sold
r
r Wi
e
Diam
Feed
7.- (x,y,z)
Wire Adjust
PARAMETERS TO 8.- D2
9.-
CONTROL:
10.- w
w
11.-Feed (mm/sec)
12.-Solder Wire Diam
13.-Wire Adjust (mm)
14.-Tmov (sec)
Y=
Y=Solder
Solderempty,
empty,Xs
Xs==Connectors
ConnectorsAssembly,
Assembly,Machine
MachineParameters,
Parameters,Quality
Qualityinspection.
inspection.AAplanning
planning
was
established
to
attack
the
problem:
2
phases
(Machine
validation
&
Process
Control).
was established to attack the problem: 2 phases (Machine validation & Process Control).
8

Can we Understand better how the Laser Machine works? Lets see some videos
Laser characteristics.
Approximate beam diameter: 0.7mm a 3.0mm
Wavelength: 920nm a 960nm
Max Power or Energy: 4w to 60w
9
Beam Power
off
PARAMETERS TO
CONTROL:
in
Laser Light
er
B
(C ar i
on s a
n e tta
ct ch
or e
D d to
es
ig th e
n) p
Soldering
Pre-heat
Origin
So
tS
pe
ed
(C
P)
Power
.-Clamps
.- PCB Color
.- PCB Thickness
D1 .- Residuos
PCB
ld
NOISE:
(x2,y2,z2)
Ro
bo
1.- D1
2.-
3.- Beam Power(watts)
4.-Beam Diam (mm)
5.-Wait Time. (sec) Pre-heat
6.- (x,y,z)
Beam Diam
Beam

Model: A
(x1,y1,z1)
PARAMETERS TO
CONTROL:
7.-Robot Speed CP (mm/sec)
10
Laser Soldering Processeed

Ar
PARAMETERS TO
CONTROL:
1.- D1
2.-
3.- Pwr0(watts) Pre-heat
4.-Beam Diam (mm)
5.-Tpre (sec)
6.- Pwr1(watts) Feed
Beam Diam
p
mS
Model: B
PostHeat
PARAMETERS TO
CONTROL:
15.-Arm Speed(mm/sec)
d
RevF
Laser Light
(x2,y2,z2)
Feed
Pre-heat
PCB
RevLn
PARAMETERS TO 16.- Pwr2(watts) Postheat
17.- Tpst(sec)
CONTROL:
18.- RevFd (mm/sec)
19.- RevLn(mm)
20.- Tdly(sec)
NOISE:
.-Clamps
.- PCB Color
.- PCB Thickness
D1 .- Residuos
Suspipe
Origin
So
Wir
r
e
ld
Diam
Feed
Wire Adjust
PARAMETERS TO
CONTROL:
(x1,y1,z1)
D2
7.- (x,y,z)
8.- D2
9.-
10.- w
w
11.-Feed (mm/sec)
12.-Solder Wire Diam
13.-Wire Adjust (mm)
14.-Tmov (sec)
11
X1 = Solder Wire
Y= Solder Empty
Can we list all the variables involved in this problem?
X2 = Parameters (pw0-watts, pw1-watts, pw2-watts, Tpre-sec, Tmov-sec,Tdly-sec,

Tpst-sec, Arm Speed-mm/sec, Feed-mm/sec, Diameter, RevFn-mm/sec, RevLn-mm,
beam power, cp).
X3 = Maintenance
X4 = Machine Programs
X5 = Connectors
X6 = PCBA
X7 = Programming Method
X8 =Visual Inspection Criterion
X9 = Training
Y = Discrete Data
(Atributes)
12
13

ls :
Too
.
Z st
R.
s
y
&
is
R
nal
ge
a
A
G
ty
b ili
a
p
Ca
Gage R&R Study
(This study was made only for operators

because of LSP machine doesnt have automatic inspection)
R&R Study. Results

Attribute Agre e me n t Wo rk S he e t
A preliminary Gage R&R study was done to identify quickly all the
improvements to guarantee the acceptable inspection criteria.
Known Population
In this case 10 pieces were utilized of model A and only the top
sides were inspected. Current microscope which is available in
line was used.
3 differents oprs in
differents shifts were
taken for this study.
SOLDER EMPTY
Parameter
G Barajas & E Duarte
Performed By
RAMON
MAURA
FELIPE
Y/N
Y/N
Sample #
Expert
Tri al 1
Trial 2
Tri al 3
Trial 1
Trial 2
Trial 3
Trial 1
Tri al 2
Trial 3
Agree
Agree
10TR
9TR
8TR
7TR
3TR
10TL
9TL
8TL
7TL
3TL
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
1
1
1
0
1
1
1
1
0
1
1
1
1
1
0
1
1
1
1
1
1
1
1
0
0
0
1
1
1
0
1
1
1
0
1
0
1
1
1
0
1
1
1
1
1
0
1
1
1
N
Y
Y
Y
N
N
N
Y
Y
N
N
Y
Y
Y
N
N
N
Y
Y
N
% APPRAISER SCORE
(1)
->
% SCORE VS. EXPERT(2) ->
90%
90%
60%
60%
70%
60%
SCREEN % EFFECTIVE SCORE
(3)
->
50%
SCREEN % EFFECTIVE SCORE vs. EXPERT
Y = Discrete Data
(Atributes)
Note:
Operators
Operatorsneed
needtotobe
bere-trained
re-trained
If % Appraiser Score is low training needs to occur, focus on specific areas (within inspector error)
% Score vs. Expert is an error against known population as deemed by experts
>90% is the target for Screen % Effectiveness Score
The overall efficiency of all the included inspectors with respect to each other
(4) Screen % Effective vs. Expert is an error against a known population as deemed by the experts
The overall efficiency of all the included inspectors with respect to external standard
(1)
(2)
(3)
(4)
-> 50%
Results were very low!
What is Important and How Can I Measure It? How Good Is the Measurement System?
14
2.5
Poor Control
&
Poor Technology
2.0
Zshift (Control)
Where are we located in terms of Zst capability scale?
Poor Control
&
Good Technology
DPMOs = 1500
DPMOs = 17667
A
1.5
CP = 0.70
CP = 0.99
Good Control
&
Poor Technology
1.0
Category of
Worldwide Class!
0.5
1
Zst (Thecnology)
15

Profiling...
Connector top side
Connector
side view
PCB
Connector Bottom side
297C
274C
250C
THIS PROFILE SHOWS THAT THE

BEHAVIOR OF THE TEMPERATURE IS
NOT THE SAME FOR EACH ZONE
DURING SOLDERING PROCESS.
16

Laser Light
Thermocouple Attachment...
Laser Light
Acceptable
Not Acceptable
Thermocouple
Thermocouple
pin
pin
pad
pad
pcb
Acceptable
pcb
Laser Light
Thermocouple
Laser Light
Not Acceptable
pin
pin
Avoid the
shadow
pad
pcb
pad
pcb
Thermocouple
17

Soldering By Hand...
A good recomendation to use the proper

equipment for profiling Laser soldering
process....
Soldering By Laser...
18
19


Too
ls:
st (
e
t
s
si
the
o
p
Hy are).
Squ
ts.
plo
x
Bo
ms
gra
o
t
s
Hi
Chi
Ho is rejected, while Ha is
accepted
Shift
ShiftA2
A2detect
detectthe
themajor
majorquantity
quantityof
ofdefects.
defects.Lasers
Lasersmachines
machineshave
havebetter
better
performance
performancethan
thanXenon
Xenonmachine.
machine.
20

Pins dimensional study.
Top and Bottom have all

pins with different length.
21
90
0.7mm Beam Diam
80
70
60
50
40
BOTTOM
TOP
30
20
Not all the pins are covered with the same temperature
by beam diameter.
10
286
271
256
241
226
211
196
181
166
151
136
121
106
91
76
61
46
31
16
0
1
100
Every point means distance of each pin to the reference line.

22
23

Arm
m
Sp e
m
ed-m
F
eed-mm/sec
Ln
m/se
v
Di Re
c
c,
am
e
s
v
et
o
er
Tm
e
r
i
ec
rW
e
re-s
d
p
l
T
o
Tpst-sec
S
pw
cp
w
2-
am
ec
y-s
pw 1
-wat
ts
Re
vF
nm
m
/s
e
ts
at
Tdl
DOE
be
r
we
po
Softbeam Parameters (Xs)
ts
at
n
atio
z
i
im
chi
O pt
d
agu
T
nate
E
o
i
t
O
D
rac
t
EF
Tes
O
D
y
t
i
l
mal
on
Nor
ecti
S
ss
Cro
IMC
w
0pw
$5000 usd
was the
investment
for these
DOEs
According with the quantity of

variables the study to be chose is a
TAGUCHI DOE for 3 levels & 5
variables.This means to make 27
runs.
po
we
r
According with the quantity of

variables the study will be a
Fractional DOE for 2 levels & 8-4
variables (Resolution IV). This
means to make 16 runs.
cp
be
am
How Do I Close the Gap Between Current and Desired Performance? (Critical Xs)
Critical Xs:
Two
TwoVariables
Variablesare
areCritical
CriticalXs
Xs(Beam
(BeamPower
Power&&CP).
CP).Temperatures
Temperaturespeaks
peakswere
werereduced
reducedtotoavoid
avoidburnings.
burnings.
24

No Of Defects = 10.000 + 3.500 Y -2.625 Z -5.250 Arm Speep PTP -4.000 Arm
Speed CP + 3.500 Beam power + 1.375 PCB Solvent -2.375 Y*Z -4.000 Y*Arm Speed
PTP -6.000 Y*Arm Speed CP + 4.250 Y*Beam Power + 2.625 Y*PCB Solvent + ei
"NEW" PARAMETERS
"OLD" PARAMETERS
Variable
VALUE
Variable
Units
Y
Y11=148, Y12=227, Y21=249.70, Y22=239,30
Z
65.5
Arm Speed PTP
75
Arm Speed CP
2.7
Wait time
0
Beam Power
18
mm
mm
mm/sec
mm/sec
sec
watts
Reducing variation
VALUE
Units
Y
Y11=148.15, Y12=228, Y21=249.70, Y22=239,30
Z
64.5
Arm Speed PTP
80
Arm Speed CP
4
Wait time
0.15
Beam Power
18
Run Confirmation:
Master Program
mm
mm
mm/sec
mm/sec
sec
watts
159
Defects Before Vs After DOE
UNs
TNs
Quantity of Defects
Can We Confirm the Solution on a Small Test?
Tranfer Funtion:
100
90
80
70
60
50
40
30
20
10
0
Defects
decreased
63%
87
75
42
17
Solder Bridge
(Before Doe)
Solder Bridge
(After DOE)
Solder Empty
(Before DOE)
Solder Empty
(After DOE)
62
Type of Defect
Small
Smalltest
testafter
afterimprovements
improvementsconfirmed
confirmedthat
thatfor
forUNs
UNswe
wehave
havedefects
defectsreduction
reduction
inin93%
93%(Zst
(Zst==2.10
2.10toto3.03.
3.03.For
ForTNs
TNswe
wehave
havedefects
defectsreduction
reductioninin77%.
77%.(Zst
(Zst==
2.97
2.97toto3.40.
3.40.
Based
Basedon
onthe
thenew
newparameters
parameterswe
wegenerated
generatedaaMaster
MasterProgram
Programon
onthe
theMachine.
Machine.
25

Eliminating burnings
Connector top side
Connector
side view
PCB
Connector Bottom side
This is an example when

some plastic residuos are
left over the pins and the
laser burns them. The
reaction is very high, then
the pcb catches a high
temperature (783C) to be
burned.
297C
274C
250C
THIS PROFILE SHOWS THAT THE

BEHAVIOR OF THE TEMPERATURE
IS NOT THE SAME FOR EACH ZONE
DURING SOLDERING PROCESS.
Theorically reflow process (tin-lead) window for SMT assembly describes: 60 secs
must be sufficient over 183C to get peaks of temper ature between 217C 230C.
Wave Soldering Process has a work window of: 1.5 3 secs with peaks of 255C.
PROCESS
WINDOW
Then we can conclude that PCB is designed to resist at least the

same work window than Wave Soldering Process and
temperatures above this process window could damage the pcb
(FR4) generating burnings.
246C (0.8 sec)

225C (0.8 sec)
In the previous slide we obtained temperatures peaks like 274C

(1 sec) and 297C (1.5 sec) This means that there is a high risk to
burn the PCB.
Making small changes in the master program obtained of last
DOE study, we have reduced these temperature peaks in order to
work with values less 255C (0.8sec). See the next slides to note
the differences with the results.
IMC study
Intermetalic joint study and

cross section were performed to
asure that acceptables ranges
are achieved.
26

Preheat...... It is better to avoid thermal choke.
27
28

Improvements.
Points
out of
control!!!
4 /2
3 /2
3 /2
3 /2
3 /2
2 /2
2 /2
2 /2
2 /2
1 /2
00
7
00
7
00
7
00
7
00
7
00
7
00
7
00
7
00
7
00
7
00
7
00
7
16
/0
00
7
4/
20
07
4/
20
23
07
/0
4/
30 2 00
7
/0
4/
2
07
00
7
/0
5/
2
14
00
7
/0
5/
21 2 00
7
/0
5/
2
28
00
7
/0
5/
2
04
00
7
/0
6/
2
11
00
7
/0
6/
2
18
00
7
/0
6/
2
25
00
7
/0
6/
20
07
09
/0
02
/0
26
/0
19
/0
12
/0
05
/0
26
/0
19
/0
12
/0
05
/0
29
/0
1 /2
P
s
h
ap
s
Gr
ram
g
o
st
Hi
1 /2
C
SP
/2
00
15
7
/0
1 /2
00
22
7
/0
1 /2
00
29
7
/0
1 /2
00
05
7
/0
2/
12 2 00
7
/0
2/
19 2 00
7
/0
2/
26 2 00
7
/0
2/
05 2 00
7
/0
3/
20
12
07
/0
3/
20
19
07
/0
3
/2
00
26
7
/0
3 /2
00
02
7
/0
4 /2
00
09
7
/0
4 /2
00
16
7
/0
4 /2
00
23
7
/0
4 /2
00
30
7
/0
4 /2
00
07
7
/0
5 /2
00
14
/0
7
5 /2
00
21
7
/0
5 /2
0
28
07
/0
5 /2
00
04
7
/0
6 /2
00
11
7
/0
6 /2
00
18
7
/0
6 /2
00
25
7
/0
6/
20
07
08
/0
1
Qty of Defects Reported
We registered
overtime data
using SPC the
process
performance.
% of Pieces with Defects
ls:
22
/0
Too
15
/0
1 /2

08
/0

How Will Critical Xs be Controlled?
25
De fe cts Reported from China (J1 Conne ctor)
20
15
10
5
Defects Reported from China (J1 Connector)
Date
2.5%
2.0%
1.5%
1.0%
0.5%
0.0%
D ate
Old programs in
softbeam
machines were
deleted. Only the
master program
will be available.
Critical Xs have
specified low
and high limits
to work.
Collection data is needed by Machine, yield, shift, type of defects, type of material, in order to identify
Improvements.
29

Softbeam process must be measured daily to identify significant
variations and take actions. It will be better if types of defects are
separated.
Daily Report
SHIFT Date
A1
B1
A2
B2
QUANTITY OF DEFECTS DETECTED
MACHINE
Connector Inspection
Final Inspection
Total
of
YIELD
Pieces
Produced
QA
We implemented some formats in

order to collect as may information
as needed.
LASER 1
LASER 2
XENON
LASER 1
LASER 2
XENON
LASER 1
LASER 2
XENON
LASER 1
LASER 2
XENON
Yield =
( 1-
(Connector Inspection + Final inpection + QA)
X 100
_____%
Total of pieces produced
Softbeam process must be measured daily to identify significant

variations and take actions. It will be better if types of defects are
separated.
Formato de llenado de parmetros de la Softbeam
Y1
Y2
X2
Y3
Y4
Tdly
X1
Feed
Modelo
Tmov
.- Daily Yields
.- Daily Machine Parameters
.- Set-up Procedure
.- Validation Machine Procedure.
HORA
TURNO
Ing
Proc.
Beam PW1
FECHA
MAQUINA
machines)
Softbeam
parameter collection data
Set-up procedure
30

Softbeam 1
Softbeam
Laser Light
Beam On
,F
ee
d
Beam Power
off
en watts aplicada al
ltimo pin para poder
retirar la soldadura.
d
Re vF
Softbeam
Laser Light
RevFd (300)/10: Es la
Pwr 0
RevLn
1,
Sp
ee
d
Pwr2 (100)/10: Es la potencia
Pw
r
RevLn (20)/10: Es la
So
lder
distancia en mm
con la que la
soldadura es
retirada del ltimo
pin.
velocidad the
retraccin en
mm/seg con la
que la
soldadura es
retirada del
ltimo pin.
Z + (64.50)
Based on
three months
of data
collected, we
calculate
confidence
intervals for
each machine
parameter in
order to
specify the
maximum
and
minimum
values of
tolerance.
Tdly
Pwr 2
robot permanece con el beam abierto

en ltimo pin.
(10-30)/100: Es el tiempo en seg que el
suspipe permanece dispensando
soldadura una vez que el robot se ha
detenido en el ltimo pin.
Z + (68.25)
Tpst (20)/100: Es el tiempo en seg que el
Beam Power (14-16):

Es la potencia en
watts aplicada a
lo largo de todos
los pines.
CP(2.6 3.0): Es la velocidad en
Suspipe
mm/seg con la que el

robot se desplaza a lo
largo de todos los pines.
e
Wir
(60.26)
w
(75.00)
Wait Time (0.15): Es el tiempo

en seg que el robot
espera en el primer pin
antes de moverse a lo
largo de todo el conector.
Pwr0 (140)/10: Es la potencia en

watts aplicada al primer pin
(precalentamiento).
Tpst (20)/100: Es el tiempo en seg que el

robot permanece con el beam abierto
en el primer pin.
Tmov (10-30)/100: Es el tiempo en seg que

el suspipe permanece dispensando
soldadura en el primer pin antes de
que el robot se mueva.
Pwr1 (140-170)/10: Es la
potencia en watts
aplicada a lo largo de
todos los pines.
Speed (26-30)/10: Es la velocidad en

mm/seg con la que el robot se
desplaza a lo largo de todos
los pines.
Feed (80-100)/10: Es la velocidad en

mm/seg con la que la
soldadura es dispensada por
el suspipe.
PTP: Point to Point, es la velocidad con la
PTP: (Point to Point), es la velocidad con
que se desplaza el robot entre

dos puntos. Se mide en % de
la velocodad mxima del
mismo. 75% - 80% son
valores tpicos.
la que se desplaza el robot

entre dos puntos. Se mide en
% de la velocodad mxima del
mismo. 75% - 80% son
valores tpicos.
Modelos con ms variacin: TN13, TN113, TN1987,

TN395, TN1893, TN1873, TN1371C, TN220B.
Modelos con ms variacin:UN398, UN395, UN395B,

UN595B, UN553
Solectron Confidential
125
31

We spent 10 months to close this project....However continuos improvement never

ends, then always there will be something more to improve.
Thank you !
32

Mexi Tronic A

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Laser Soldering Process

Laser Soldering Process

Enrique Duarte Introduction

Process Development Engineer

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Laser Soldering Process

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The top detractor (Solder Empty Defect in J1

Defects Distribution (by issue)

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Vis ual Inspection

Project Definition. Projected Business

Opr-Hour-cost (Dlls) Opr-sec-cost (Dlls)

Cost per gr. (Dlls)

Total cost (Dlls)

Consumption per board (grs)

GRAND TOTAL PER BOARD (DLLS)=

Amountof Loss per

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Basic Understanding LSP, Mode: Continuos Pad

Basic Understanding LSP, Mode: Continuos Pad

How the machine works?

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Can the Problem Be Broken into Smaller Pieces?

7.-Robot Speed CP (mm/sec)

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Laser Soldering Process

7.-Robot Speed CP (mm/sec)

Laser Soldering Processeed

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Can we list all the variables involved in this problem?

X2 = Parameters (pw0-watts, pw1-watts, pw2-watts, Tpre-sec, Tmov-sec,Tdly-sec,

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Laser Soldering Process

Gage R&R Study

(This study was made only for operators

R&R Study. Results

G Barajas & E Duarte

% SCORE VS. EXPERT(2) ->

SCREEN % EFFECTIVE SCORE

SCREEN % EFFECTIVE SCORE vs. EXPERT

Results were very low!

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Laser Soldering Process

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Where are we located in terms of Zst capability scale?

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THIS PROFILE SHOWS THAT THE

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A good recomendation to use the proper

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Pins dimensional study.

Top and Bottom have all

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0.7mm Beam Diam

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