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L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
3 Description
The L293 and L293D devices are quadruple highcurrent half-H drivers. The L293 is designed to
provide bidirectional drive currents of up to 1 A at
voltages from 4.5 V to 36 V. The L293D is designed
to provide bidirectional drive currents of up to 600-mA
at voltages from 4.5 V to 36 V. Both devices are
designed to drive inductive loads such as relays,
solenoids, DC and bipolar stepping motors, as well as
other high-current/high-voltage loads in positivesupply applications.
2 Applications
PACKAGE
L293NE
PDIP (16)
19.80 mm 6.35 mm
L293DNE
PDIP (16)
19.80 mm 6.35 mm
Logic Diagram
1A
1,2EN
2A
3A
3,4EN
4A
1Y
1
7
10
11
2Y
3Y
9
15
14
4Y
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
5
5
15
15
15
15
15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (November 2004) to Revision D
Page
Added ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1
L293, L293D
www.ti.com
1,2EN
1A
1Y
16
15
14
13
12
2Y
2A
11
10
VCC2
VCC1
4A
4Y
HEAT SINK AND
GROUND
3Y
3A
3,4EN
Pin Functions
PIN
NAME
NO.
1,2EN
<1:4>A
<1:4>Y
3,4EN
TYPE
DESCRIPTION
2, 7, 10, 15
3, 6, 11, 14
Driver outputs
4, 5, 12, 13
Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multiple
solid vias
VCC1
16
VCC2
GROUND
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MAX
UNIT
MIN
36
36
Input voltage, VI
VCC2 + 3
Output voltage, VO
1.2
1.2
600
600
mA
150
150
65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the network ground terminal.
V(ESD)
(1)
(2)
2000
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
VIL
TA
(1)
NOM
MAX
UNIT
VCC1
4.5
VCC2
VCC1
36
VCC1 7 V
2.3
VCC1
VCC1 7 V
2.3
0.3 (1)
1.5
70
The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage
levels.
NE (PDIP)
UNIT
16 PINS
(2)
RJA
36.4
C/W
RJC(top)
22.5
C/W
RJB
16.5
C/W
JT
7.1
C/W
JB
16.3
C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
The package thermal impedance is calculated in accordance with JESD 51-7.
L293, L293D
www.ti.com
TEST CONDITIONS
L293: IOH = 1 A
VOH
VOL
VOKH
VOKL
IIH
IIL
ICC1
MIN
TYP
VCC2 1.8
VCC2 1.4
L293: IOL = 1 A
1.2
IO = 0
IO = 0
V
V
V
0.2
100
0.2
10
10
100
13
22
35
60
24
14
24
TYP
MAX
ICC2
1.8
1.3
VI = 0
EN
UNIT
V
VCC2 + 1.3
VI = 7 V
EN
MAX
mA
mA
TEST CONDITIONS
MIN
tPLH
L293NE, L293DNE
L293DWP, L293N L293DN
750
tPHL
L293NE, L293DNE
400
tTLH
L293NE, L293DNE
L293DWP, L293N L293DN
100
tTHL
L293NE, L293DNE
300
350
800
200
CL = 30 pF,
See Figure 2
300
UNIT
ns
ns
ns
ns
5
With Infinite Heat Sink
4
2
Free Air
1
0
50
50
100
150
TA Ambient Temperature C
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
tr
Input
5 V 24 V
Input
50%
50%
10%
Pulse
Generator
(see Note B)
10%
VCC1 VCC2
tw
tPHL
Y
3V
3V
90%
90%
Output
CL = 30 pF
(see Note A)
EN
tPLH
90%
90%
50%
VOH
50%
Output
10%
10%
tTHL
VOL
tTLH
VOLTAGE WAVEFORMS
TEST CIRCUIT
L293, L293D
www.ti.com
8 Detailed Description
8.1 Overview
The L293 and L293D are quadruple high-current half-H drivers. These devices are designed to drive a wide array
of inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current and
high-voltage loads. All inputs are TTL compatible and tolerant up to 7 V.
Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington
source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by
3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in
phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in
the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible
drive suitable for solenoid or motor applications.
On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. On
the L293D, these diodes are integrated to reduce system complexity and overall system size. A VCC1 terminal,
separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293 and L293D
are characterized for operation from 0C to 70C.
16
15
1
14
13
12
11
7
8
2
1
0
1
0
3
10
9
1
0
1
0
VCC2
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
(1)
(2)
(2)
OUTPUT (Y)
EN
VCC1
Current
Source
Input
GND
VCC2
Output
Output
GND
GND
L293, L293D
www.ti.com
24 V
VCC1
16
10 k
VCC2
8
1,2EN
1
1A
Control A
1Y
Motor
2A
2Y
3,4EN
9
Control B
3A
3Y
10
11
4A
4Y
15
14
Thermal
Shutdown
4, 5, 12, 13
GND
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
JA
3
60
40
20
0
0
10
20
30
Side
50
40
mm
24 V
VCC1
10 k
VCC2
8
16
1,2EN
1
Control A
1A
2
1Y
2A
2Y
Motor
3,4EN
9
Control B
3A
10
3Y
4A
15
4Y
11
14
Thermal
Shutdown
4, 5, 12, 13
GND
10
L293, L293D
www.ti.com
SES5001
M1
SES5001
M2
3A
10
4A
15
11
14
16
8
1/2 L293
VCC1
EN
4, 5, 12, 13
GND
(1)
EN
3A
M1 (1)
4A
Run
run
M2
2 SES5001
M
2 SES5001
2A
1A
7
2
16
8
1/2 L293
VCC1
1
EN
4, 5, 12, 13
GND
2A
FUNCTION (1)
Turn right
Turn left
EN
(1)
11
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
1A
2A
FUNCTION (1)
C1
0.22 F
16
L293
1
2
D5
L1
VCC2
IL1
15
+
D1
D8
14
13
12
11
+
D6
VCC1
D4
L2
IL2
10
D7
D3
D2
D1D8 = SES5001
12
L293, L293D
www.ti.com
17.0 mm
11.9 mm
38.0 mm
13
L293, L293D
SLRS008D SEPTEMBER 1986 REVISED JANUARY 2016
www.ti.com
11 Layout
11.1 Layout Guidelines
Place the device near the load to keep output traces short to reduce EMI. Use solid vias to transfer heat from
ground pins to ground plane of the printed-circuit-board.
TTL Logic
1 1,2EN
TTL Logic
2 1A
4A 15
TTL Logic
1 Ampere
3 1Y
4Y 14
1 Ampere
GND
VIAS
VCC1 16
13
12
1 Ampere
6 2Y
3Y 11
1 Ampere
TTL Logic
7 2A
3A 10
TTL Logic
5V to 36V
8 VCC2
3,4EN 9
TTL Logic
1 F
GND
14
L293, L293D
www.ti.com
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12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15
www.ti.com
3-Nov-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
L293DNE
ACTIVE
PDIP
NE
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
L293DNE
L293DNEE4
ACTIVE
PDIP
NE
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
L293DNE
L293DWP
L293DWP
OBSOLETE
SOIC
DW
28
TBD
Call TI
Call TI
0 to 70
L293DWPG4
OBSOLETE
SOIC
DW
28
TBD
Call TI
Call TI
0 to 70
L293DWPTR
OBSOLETESO PowerPAD
DWP
28
TBD
Call TI
Call TI
0 to 70
L293N
OBSOLETE
PDIP
16
TBD
Call TI
Call TI
0 to 70
L293N
L293NE
ACTIVE
PDIP
NE
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
L293NE
L293NEE4
ACTIVE
PDIP
NE
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
L293NE
L293NG4
OBSOLETE
PDIP
16
TBD
Call TI
Call TI
0 to 70
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
www.ti.com
3-Nov-2015
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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