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21708K PDF
21708K PDF
Description:
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA04
1.7-5.5
400 kHz(1)
2.5-5.5
400 kHz
I, E
24LC04B
Note 1:
Features:
Single Supply with Operation down to 1.7V for
24AA04 Devices, 2.5V for 24LC04B Devices
Low-Power CMOS Technology:
- Read current 1 mA, typical
- Standby current 1 A, typical
2-Wire Serial Interface, I2C Compatible
Schmitt Trigger inputs for Noise Suppression
Output Slope Control to eliminate Ground Bounce
100 kHz and 400 kHz Clock Compatibility
Page Write Time 3 ms, typical
Self-Timed Erase/Write Cycle
16-Byte Page Write Buffer
Hardware Write-Protect
ESD Protection >4,000V
More than 1 Million Erase/Write Cycles
Data Retention >200 Years
Factory Programming Available
Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN, MSOP and 5-lead SOT-23 or 4-lead
Chip Scale
Pb-Free and RoHS Compliant
Temperature Ranges:
- Industrial (I): -40C to +85C
- Automotive (E): -40C to +125C
Block Diagram
HV
Generator
WP
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
Page
Latches
I/O
SCL
YDEC
SDA
VCC
VSS
Sense Amp.
R/W Control
Package Types
PDIP/MSOP/SOIC/TSSOP
A0
VCC
DFN/TDFN
SOT-23-5
SCL
Vss
WP
A0 1
8 VCC
A1 2
7 WP
A2 3
VSS 4
6 SCL
A1
WP
A2
SCL
VSS
SDA
Note
1:
Pins A0, A1 and A2 are not used by the 24XX04. (No internal connections).
2:
SDA
Vcc
CS (Chip Scale)2
VCC
VSS
SCL
SDA
5 SDA
(Top Down View,
Balls Not Visible)
* 24XX04 is used in this document as a generic part number for the 24LC04/24LC04B devices.
DS21708K-page 1
24AA04/24LC04B
1.0
ELECTRICAL CHARACTERISTICS
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
Automotive (E):
Min.
Typ.
Max.
Units
Conditions
D1
VIH
D2
0.7 VCC
D3
VIL
D4
VHYS
Hysteresis of Schmitt
Trigger inputs
D5
VOL
D6
ILI
D7
0.3 VCC
0.05 VCC
(Note)
0.40
ILO
D8
CIN,
COUT
Pin capacitance
(all inputs/outputs)
10
pF
D9
0.1
mA
D10
ICC read
D11
ICCS
Note:
Standby current
0.05
mA
0.01
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
DS21708K-page 2
24AA04/24LC04B
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
Automotive (E):
Min.
Typ.
Max.
Units
Conditions
FCLK
Clock frequency
400
100
kHz
THIGH
600
4000
ns
TLOW
1300
4700
ns
TR
300
1000
ns
TF
300
ns
(Note 1)
THD:STA
600
4000
ns
TSU:STA
600
4700
ns
THD:DAT
ns
(Note 2)
TSU:DAT
100
250
ns
10
TSU:STO
600
4000
ns
11
TAA
900
3500
ns
12
TBUF
1300
4700
ns
13
TOF
20+0.1CB
250
250
ns
14
TSP
50
ns
(Notes 1 and 3)
15
TWC
ms
16
Endurance
1M
Note 1:
2:
3:
4:
DS21708K-page 3
24AA04/24LC04B
FIGURE 1-1:
2
3
SCL
7
SDA
IN
10
6
14
12
11
SDA
OUT
FIGURE 1-2:
SCL
6
10
SDA
Start
DS21708K-page 4
Stop
24AA04/24LC04B
2.0
PIN DESCRIPTIONS
TABLE 2-1:
Name
PDIP
SOIC
TSSOP
DFN
TDFN
MSOP
SOT23
CS
Description
A0
Not Connected
A1
Not Connected
A2
Not Connected
VSS
Ground
SDA
SCL
Serial Clock
WP
Write-Protect Input
VCC
2.1
2.2
2.3
Write-Protect (WP)
2.4
A0, A1, A2
DS21708K-page 5
24AA04/24LC04B
3.0
FUNCTIONAL DESCRIPTION
4.0
BUS CHARACTERISTICS
4.1
4.3
FIGURE 4-1:
(A)
4.5
Acknowledge
4.2
4.4
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SCL
SDA
DS21708K-page 6
Data
Allowed
to Change
Stop
Condition
24AA04/24LC04B
5.0
DEVICE ADDRESSING
Operation
Control
Code
Block Select
R/W
Read
1010
Block Address
Write
1010
Block Address
FIGURE 5-1:
CONTROL BYTE
ALLOCATION
Read/Write Bit
Block
Select
Bits
Control Code
S
B0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
x = dont care
FIGURE 5-2:
Control Byte
Control
Code
B
0 R/W
A
7
A
0
Block
Select
bits
x = dont care
DS21708K-page 7
24AA04/24LC04B
6.0
WRITE OPERATION
6.1
Byte Write
6.2
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX04 in the same way as
in a byte write. But instead of generating a Stop condition the master transmits up to 16 data bytes to the
24XX04, which are temporarily stored in the on-chip
page buffer and will be written into memory once the
master has transmitted a Stop condition. Upon receipt
of each word, the four lower-order Address Pointer bits
are internally incremented by 1. The higher-order 7
bits of the word address remain constant. If the master
should transmit more than 16 words prior to generating
the Stop condition, the address counter will roll over
and the previously received data will be overwritten. As
with the byte write operation, once the Stop condition is
received an internal write cycle will begin (Figure 6-2).
Note:
6.3
Write Protection
FIGURE 6-1:
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1
Bus Activity
x = dont care
DS21708K-page 8
Control
Byte
Word
Address
S
T
O
P
Data
x B0 0
Block
Select
Bits
P
A
C
K
A
C
K
A
C
K
24AA04/24LC04B
FIGURE 6-2:
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 x x B0 0
Control
Byte
Bus Activity
x = dont care
Block
Select
Bits
Word
Address (n)
Data (n)
S
T
O
P
Data (n + 15)
Data (n + 1)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21708K-page 9
24AA04/24LC04B
7.0
ACKNOWLEDGE POLLING
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21708K-page 10
24AA04/24LC04B
8.0
READ OPERATION
8.3
Sequential Read
8.1
The 24XX04 contains an address counter that maintains the address of the last word accessed, internally
incremented by 1. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to 1, the 24XX04 issues an acknowledge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX04 discontinues transmission
(Figure 8-1).
8.2
8.4
Noise Protection
Random Read
FIGURE 8-1:
S
T
A
R
T
SDA Line
S 1
Bus Activity
x = dont care
Control
Byte
S
T
O
P
Data (n)
x x B0 1
Block
Select
Bits
P
A
C
K
N
o
A
C
K
DS21708K-page 11
24AA04/24LC04B
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
Bus Activity
Master
S
T
A
R
T
Word
Address (n)
Control
Byte
Block
Select
Bits
Bus Activity
A
C
K
A
C
K
Bus Activity
Master
SDA Line
Bus Activity
P
A
C
K
Block
Select
Bits
N
o
A
C
K
x = dont care
FIGURE 8-3:
S
T
O
P
Data (n)
S 1 0 1 0 x x B0 1
S 1 0 1 0 x x B0 0
SDA Line
Control
Byte
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
1
A
C
K
A
C
K
A
C
K
A
C
K
N
o
A
C
K
DS21708K-page 12
24AA04/24LC04B
9.0
PACKAGING INFORMATION
9.1
8-Lead TSSOP
Example:
24LC04B
I/P e3 13F
0527
Example:
24LC04BI
SN e3 0527
13F
Example:
XXXX
4L04
TYWW
I527
NNN
13F
8-Lead MSOP
Example:
XXXXXT
4L4BI
YWWNNN
52713
5-Lead SOT-23
XXNN
Example:
M33F
Example:
234
527
13
DS21708K-page 13
24AA04/24LC04B
Example:
A34
527
13
XXX
YWW
NN
Example:
SOT-23
TSSOP
DFN
TDFN
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
I Temp.
E Temp.
24AA04
4A04
4A04T
B3NN
231
A31
24LC04B
4L04
4L4BT
M3NN
N3NN
234
235
A34
A35
Note:
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21708K-page 14
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DS21708K-page 24
24AA04/24LC04B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21708K-page 25
24AA04/24LC04B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21708K-page 26
24AA04/24LC04B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21708K-page 27
24AA04/24LC04B
APPENDIX A:
REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Revision D
Added DFN package.
Revision E
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read.
Revision F (01/2007)
Revised Features section; Changed 1.8V to 1.7V in
Tables and text; Revised Ambient Temperature,
Section 1.0; Replaced Package Drawings; Revised
Product ID section.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
Revision H (01/2009)
Added TDFN Package; Updated Package Drawings.
Revision J (03/2009)
Added 4-lead Chip Scale Package.
Revision K (03/2009)
Added 4-lead Chip Scale Package Diagram and Land
Pattern.
DS21708K-page 28
24AA04/24LC04B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
DS21708K-page 29
24AA04/24LC04B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
RE:
Reader Response
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply?
Device: 24AA04/24LC04B
N
Literature Number: DS21708K
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
DS21708K-page 30
24AA04/24LC04B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
/XX
Temperature Package
Range
Examples:
a)
b)
Device:
24AA04:
24AA04T:
Temperature I
Range:
E
= -40C to +85C
= -40C to +125C
c)
d)
e)
f)
g)
Package:
MC =
P
=
SN
=
ST
=
MS =
OT
=
MNY(1)=
CS16K(2) =
DS21708K-page31
24AA04/24LC04B
NOTES:
DS21708K-page 32
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP,
PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Total Endurance, TSHARC, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21708K-page 33
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
India - New Delhi
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Denmark - Copenhagen
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Fax: 886-2-2508-0102
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Fax: 86-29-8833-7256
Thailand - Bangkok
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Fax: 66-2-694-1350
Italy - Milan
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Fax: 31-416-690340
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Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
02/04/09
DS21708K-page 34