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Chip
Wire
Conductive epoxy
Die bond pad
Epoxy molding compound
(IC case)
ESCtut11a
1 of 2
Prerequisite tutorials:
1. Quick Tips to Using IDEAS
and
Creating Parts
2. Sketching and Constraining
3. Extruding and Revolving
4. ESC: Cooling a Simple Electronic System
Recommended tutorials:
1. ESC: Modifying a Design to Improve
Performance
2. ESC: Modeling a Heat Sink in Natural
Convection
3. ESC: Forced Convection in a Telephone
Switch
4. ESC: Forced Convection in a Telephone
Switch
5. ESC: Natural Convection in a Card Cage
2 of 2
Setup
1 of 1
1 of 3
Name the larger part IC Case and Put Away the part.
2 of 3
3 of 3
1 of 9
Fe
Al
Cu
Emissivity
Thickness
(mm)
Thermal
Conductivity
(W/m C)
Material Type
(Isotropic or
Orthotropic)
Component
Chip
Iso
149
0.508
1.0
Iso
300
0.150
1.0
Leadframe
Ortho
1.0
IC Case
Iso
kx=300 0.150
ky=0.63
0.63
N/A
PC Board
Iso
17.7
0.85
1.6
1.0
Things to notice
The IC Case will be meshed with solid elements.
Meshing
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Meshing
3 of 9
Save as group
Use a Quadrilateral Shell Mesh, a Physical Property of
0.15mm and an Element Length of 2.33 mm.
To select the Leadframe material, pick other on the
define mesh form. Then, on the Materials form, set the
material type filter to Orthotropic.
Things to notice
The defaults you set on the Beam Mesh Definition form
apply only for beam elements, not for shell elements.
Try to make a habit of creating groups just after
selecting the geometry. This facilitates any further
picking of your geometry and speeds up boundary
condition definition.
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Meshing
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Meshing
5 of 9
12
Meshing
6 of 9
top
light blue
middle
dark green
bottom orange
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Meshing
7 of 9
Things to notice
The top surface mesh will convect heat to the
fluid.
The bottom surface mesh will be used to couple
the IC case to the PC Board (Radiation and
Conduction through Air).
The middle surface mesh will be used to couple
the Chip, the Leadframe and the Die Bond Pad
to the IC Case.
Optional
Again create any groups you forgot to create.
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Meshing
8 of 9
Optional
You can define a Bias
using the Mapped
Options to get a finer
mesh near the center
of the Wind Tunnel
where the Plastic
Quad Flat Pack is
located. A bias factor
of 2 was used on the
example shown above
and at right.
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Meshing
9 of 9
All done
Check I-DEAS Prompt.
0.0001 (type in and press Return)
Lower Label
Yes (three times)
If there are no coincident nodes in the model the last
two picks (Yes, Yes) are unnecessary.
Save your model file.
File
Save
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1 of 2
2 of 2
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Assembling
2of 2 (continued)
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Boundary Conditions
1 of 3
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Boundary Conditions
2 of 3
Chip surface
Die Bond Pad surface
Coefficient
5000
2. Chip to IC Case
Use k of The Chip and 50 % of its thickness:
k/l = 149 W/mC /(0.5 x 0.000508m)= 586000 W/m2C
Primary Elements:
Secondary Elements:
Coupling Type:
Value:
Chip surface
IC Case Middle surface
Coefficient
586000
Boundary Conditions
2 of 3 (cont.)
4. Leadframe to Case
Use kx of the Leadframe and 50 % of its thickness.
Use a multiplying factor of 2 to take into account
heat dissipation from both sides.
k/l = 300 W/mC /(0.5 x 0.00015m)= 4000000 W/m2C
Multiplying factor: 2
Primary Elements:
Secondary Elements:
Coupling Type:
Value:
Leadframe surface
IC Case Middle surface
Coefficient
8000000
Boundary Conditions
2 of 3 (cont.)
6. Leads to PC Board
Most of the Heat Transfer process here occurs by
conduction along the length of the Leads outside
the IC Case. So lets first calculate an absolute heat
transfer coefficient for one lead.
A =Cross section of one lead = 0.0002m x 0.00015m
= 3.0E-8 m2
l = 0.0015 m
k = 300 W/mC
k*A/l= 6E-3 W/C so for 256 leads: 1.536 W/C
To obtain a length based thermal coupling, divide this
value by the outer perimeter of the Leadframe.
1.536 W/C / (4 x .028 m) = 13.71 W/mC
Primary Elements: Leadframe Outer Edges
(Use group to select the edges)
Secondary Elements:
PC Board surface
Coupling Type:
Edge
Value:
13.71
7. IC Case to PC Board
In this model, we did not explicitly model fluid
underneath the IC Case. In reality there is an air gap of
0.2mm. Model conduction through this air gap using a
Thermal Coupling:
k = 0.0263 W/mC (Air)
k/l = 0.0263 W/mC / 0.0002 m= 131 W/m2C
Primary Elements:
Secondary Elements:
Coupling Type:
Value:
Boundary Conditions
2 of 3 (cont.)
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Boundary Conditions
3 of 3
Vent
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1 of 1
Wrap up
You have completed the Component-Level Thermal
and Flow Analysis ESC tutorial. Be sure to save your
work before exiting I-DEAS.
File
Save
See also...
Help, Manuals, Table of Contents
Simulation: Thermal Analysis Users Guide
I-DEAS Electronic System Cooling
29