Conclusion

Decapsulation is a chemical etching technique for opening IC plastic packages in order to

expose their internal components for examination. Though the process will leaves the die,
bond pads and wire bonds intact. By using low power microscope and high power
microscope, the connections and other materials visible are able to observe such as die, die
attach epoxy, wire bond, leadframe, metal, transistor and resistor. The input/output (I/O)
connection pads on the IC are connected to corresponding terminal pads on the package by
the use of gold or aluminium wire bonds. The I/Os are connection that pass electronic signals
in and out of the chips. In microelectronic devices, IC packaging is very important to
protects, power and cool the devices as well as to provide the electrical and mechanical
connection between the part and outside world.