Tutorial 1 DMT243

1. Define Microsystems.
Microsystems

are

microminiaturized

and

integrated

systems

based

on

microelectronics, RF, photonics, MEMS and packaging technologies.

2. Define microelectronics.
Technology of electronic systems made of extremely small electronic parts or
elements.
3. Give FOUR (4) evolution waves in Microsystems Technologies.
The First Technology Wave = Microelectronincs
The Seconds Technology Wave = RF and wireless
The Third Technology Wave = Photonics
The Fourth Technology Wave = MEMS
4. Match FOUR(4) analogy between human body and electronic packaging as depicted in
Figure 1.
Microprocessors = Brains
Power = feeding
Cooling = circulatory system
Protection = skeletal
Signals and from transducer = nervous system
Photonic functions = eye
5. What is the important of Microsystems Packaging?
Every IC and devices has to be packaged
Packaging controls the product performance
Control size of consumer electronics
Control reliability of electronics
Control cost of electronics products
6. From figure 2, explain the simplified version of wafer to system assembly process.

Figure 2
Wafer Fabrication = complex procedure of many repeated sequential processes to produce
complete electrical/photonic circuits.
IC Assembly = Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die
Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish, Electrical Testing
PWB = Used to mechanically support and electrically connect electronic components using
conductive pathways, tracks or traces etched from copper sheets laminated onto a nonconductive
PWB

Assembly = After the printed circuit board (PCB) is completed, electronic

components must be attached to form a functional printed circuit assembly. In through-hole

construction, component leads are inserted in holes. In surface-mount construction, the
components are placed on pads or lands on the outer surfaces of the PWB. In both kinds of
construction, component leads are electrically and mechanically fixed to the board with a
molten metal solder.
System Assembly = that provide all funtions required of the system.
7. Define IC.
An integration of many such circuit blocks (discrete components such as transistors,
diodes, capacitors, resistors were mounted on the PWB) or components on a single
chip
8. List ALL the integration level of IC technologies
Small, medium and large scale integration (SSI,MSI,LSI)
Very large or ultra scale integration (VLSI or ULSI)
Gigascale integration (GSI) and terascale
System-on-chip