KEC © semconvectror| _ xragsi/r/a/ar TECHNICAL DATA BIPOLAR LINEAR INTEGRATED CIRCUIT PROGRAMMABLE PRECISION REFERENCES ‘The KIMBI/E/A/AF inteyrated circuits are three terminal programmable shunt regulator diodes, ‘These | rmanolithie IC voltage reference operate as «Tow temperature coefficient zener which is programmable from Vas to 38 volts with two extemal resistors, These deviees exhibit a wide operating current range of 10 to 100mA with a typical dynamic impedance of 022. ‘The characterisies of these references make them excellent replacements for zener diodes in many applications such as digital voltmeters, power supplies, and op amp circu The 2.5 volt reference makes i convenient to obtain f stable reference from 5.0 volt logic supplies, and since the KIABI/E/A/AR operates as a shunt regulstor it can be used as either a positive or negative voltage reference FEATURES + Prograrwable Output Vollage to 38 Vols, Voltage Reference ‘Tolerance © + L0%6(KIAASIA/AB) + Low Dynamic Output Impedance 10.226 + Sink Current Capabifiyy of 10 tw 100nA + Equivalent Foll-Ranue Temperature Coefficient of SOppm/© (Typ Temperature Conmpensited for Operation Over Full Rated Operating Temperature Range + Low Output Noise Voltage MARKING, ‘Type No, Marking KIAGSIF 3A KIAGSIAP ai MAXIMUM RATINGS (Full operating ambient temperature range applies unless otherwise noted.) CHARACTERISTIC ‘SYMBOL RATING UNIT Cathode To Anode Voltaxe Vea 37 V Cathode Current Range, Continuous Is 100150 mA Reference Input Current Range, Continuos Ts =0.05~10 ma Operating Junetion Temperature 7 150 c Operating Temperature 0~85 c Storage Tesmperaare “Twa Power Bs KIAGIA D ‘nal Power Dissipation aE AP z mW ves 1 Tevison No 4 KEC v6KIA431/F/A/AF BLOCK DIAGRAM Reference 0 (®) (k) © Cathode (k) Reference © ®) tS imoactay © anode(A) IARACTERISTICS (Ta-250) TST masrics —__Jsvanou] TEST] ast covomnon [Mn [aw [MAX] UNIT WAI za | 2m v Referee Ir vic Join 1] vicar neta ollage KIA@SIA/AB 2470) | 2496 v Tela Fa Va al Deviation Over Temperature AVect ure TV Vice. fe T0m A, 70 30 mY et toute Tat of Cras We — Pa Po TeerewstopaWatasew | aa? fee ol amma Lot Change in Cathode to Vga | Figure 2] elma Hy to poo se Vag an =10v Reference Input Ta5U . Tk=10mA, RI=10k 9 18 40 4 Care Tat tes a a a me Devinn Orc Tommraure | ate [gue 2| BIO. ROK os | a5 | aa Range - ‘nb Cai : Merman Ca wa [tinwe fra os [19 [ma Ste Cate Care Te [rare 8] Wea, aro = [28 [io [aa Tue t| Vows momma] Pa | Pw Dinumie npn 7a | Ruse 3] ee on 1997.12.11 Revision No: 4 KEC 26KIA431/F/A/AF FIGURE 1-TEST CIRCUIT FOR Vx4 =¥, Input O40 Vy FIGURE 2-TEST CIRCUIT FOR Vigq > Vp “The RIP 4, we | Veet Note 1 The: deviation ps fs the cifferences find mininauny val meter AV is defined ‘biained over the ful Operating ambient temperature range thal apates Vet Max Ypet Min. m1 12 AMBIENT TEMPERATURE The average temperature coefficient of the Reference mp voltage, @Vne Js defined AVes Si pom, Var at 25 V9 c AT Ae x 1 ATalNge at 250) Vax can be positive or negative depending fon whether Vag Min, or Vie Max. occurs a the lower ambient temperature 1997. 12.11 Revision No! 4 RI rot (1+ gg)*T ret XBL KEC FIGURE S-TEST CIRCUIT FOR loge Input O40 Vig ott Example | AVnr ~ 8OmV and slope is positive, Vac at 250-2495V, ATa-70C. 0.008107 © AV = = 458 por TOx(2.405) " Note 2: The dynamic impedance Zay is defined as AVKA Vand Ali When the device is programmed with ovo external resistors, RY and TO, trefer to igure 2) the total dynamic impedance of R Worl = Vl ahKIA431/F/A/AF PRECAUTION FOR USE SOLE ING Flat Package (SOT-89 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties, Especially, surfice mounting is steadily penetrating into industrial segments as a World-wide popular wehmieal «rend Although exposure to high temperature is inevitable during soldering, we recommend limiting the soldering, temperature to low levels as shown in figure for the e of retaining inherent excellent relsbiiy (a) When employing solder reflow method @ Atmospheric temperauare around resin surfaces must be less than 240% length of 10 see Recommend temperature profile vol exceeding the time Precautions on heating, meshed! When resin in kept exposed to high temperature for a Tong time, device reliability: may Therefore, it 38 essential 1o complete soldering in the sh resin from rising bbe marred. st time possible to prevent temperature of (b) When employing halogen lamps or infrared-ray: heater When halogen lamps or infrured-ray heaters are used, avoid deel irradiation onto resin surfaces! such deviees cause extensive localived temperature rise 3% Please keep a reflow solder operating when SOT-89 package's soldering, 1997. 12.11 Revision No! 4 KEC 66