TDA7266SA

7W+7W DUAL BRIDGE AMPLIFIER

WIDE SUPPLY VOLTAGE RANGE (3.5-18V)

MINIMUM EXTERNAL COMPONENTS
NO SWR CAPACITOR

TECHNOLOGY BI20II

NO BOOTSTRAP
NO BOUCHEROT CELLS
INTERNALLY FIXED GAIN

STAND-BY & MUTE FUNCTIONS

SHORT CIRCUIT PROTECTION

THERMAL OVERLOAD PROTECTION

CLIPWATT15
ORDERING NUMBER: TDA7266SA

DESCRIPTION
The TDA7266SA is a dual bridge amplifier specially
designed for LCD Monitor, PC Motherboard, TV and
Portable Radio applications.

Pin to pin compatible with: TDA7266S, TDA7266,

TDA7266M, TDA7266MA, TDA7266B, TDA7297SA
& TDA7297.

BLOCK AND APPLICATION DIAGRAM

VCC
470F
3

0.22F

IN1

100nF

13
1

OUT1+

OUT1-

15

OUT2+

14

OUT2-

ST-BY

S-GND

0.22F
IN2

Vref

12

+
+
-

MUTE

PW-GND

+
D94AU175B

September 2003

1/11

TDA7266SA
ABSOLUTE MAXIMUM RATINGS
Symbol

Parameter

Value

Unit

Vs

Supply Voltage

20

IO

Output Peak Current (internally limited)

Ptot

Total Power Dissipation (Tamb = 70C)

Top

Operating Temperature

Tstg, Tj

20

0 to 70

-40 to 150

Value

Unit

Typ = 1.8; Max. = 2.5

C/W

48

C/W

Storage and Junction Temperature

THERMAL DATA
Symbol

Parameter

Rth j-case

Thermal Resistance Junction-case

Rth j-amb

Thermal Resistance Junction-ambient

PIN CONNECTION (Top view)

15

OUT2+

14

OUT2-

13

VCC

12

IN2

11

N.C.

10

N.C.

S-GND

PW-GND

ST-BY

MUTE

N.C.

IN1

VCC

OUT1-

OUT1+
D03AU1463

ELECTRICAL CHARACTERISTCS
(VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified)
Symbol
VCC
Iq

Parameter

Test Condition

Supply Range

Total Quiescent Current

VOS

Output Offset Voltage

PO

Output Power

THD 10%

Total Harmonic Distortion

PO = 1W

THD

Min.

6.3

Typ.

CT
AMUTE

Supply Voltage Rejection

11

18

65

mA

120

mV

7
0.05

40

56

dB

60

dB

Mute Attenuation

60

80

dB

150

GV

Closed Loop Voltage Gain

2/11

0.2

46

Thermal Threshold

GV

Crosstalk

Tw

Voltage Gain Matching

f = 100Hz, VR =0.5V

Unit

50

PO = 0.1W to 2W
f = 100Hz to 15KHz
SVR

Max.

25

26

27

dB

0.5

dB

TDA7266SA
ELECTRICAL CHARACTERISTCS (continued)
(VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified)
Symbol

Parameter

Ri

Input Resistance

VTMUTE

Mute Threshold

VTST-BY
IST-BY
eN

Test Condition

Min.

Typ.

25

30

Max.

for VCC > 6.4V; Vo = -30dB

2.3

2.9

4.1

for VCC < 6.4V; Vo = -30dB

VCC/2
-1

VCC/2
-075

VCC/2
-0.5

0.8

1.3

1.8

100

St-by Threshold
St-by Current V6 = GND
Total Output Voltage

Unit

A Curve; f = 20Hzto 20KHz

150

APPLICATION SUGGESTION
STAND-BY AND MUTE FUNCTIONS
(A) Microprocessor Application
In order to avoid annoying "Pop-Noise" during Turn-On/Off transients, it is necessary to guarantee the right Stby and mute signals sequence. It is quite simple to obtain this function using a microprocessor (Fig. 1 and 2).
At first St-by signal (from P) goes high and the voltage across the St-by terminal (Pin 7) starts to increase exponentially. The external RC network is intended to turn-on slowly the biasing circuits of the amplifier, this to
avoid "POP" and "CLICK" on the outputs.
When this voltage reaches the St-by threshold level, the amplifier is switched-on and the external capacitors in
series to the input terminals (C3, C53) start to charge.
It's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device
goes in play mode causing a loud "Pop Noise" on the speakers.
A delay of 100-200ms between St-by and mute signals is suitable for a proper operation.
Figure 1. Microprocessor Application
VCC
C1 0.22F
IN1

C5
470F
OUT1+

OUT1-

15

OUT2+

14

OUT2-

13

C6
100nF

ST-BY R1 10K

C2
10F

S-GND

9
Vref

C3 0.22F
IN2
MUTE R2 10K

12

+
+
-

C4
1F

PW-GND

+
D95AU258A

3/11

TDA7266SA
Figure 2. Microprocessor Driving Signals
+VS(V)

VIN
(mV)

VST-BY
pin 7
1.8
1.3
0.8
VMUTE
pin 6
4.1
2.9
2.3

Iq
(mA)

VOUT
(V)
OFF
ST-BY

PLAY
MUTE

MUTE

ST-BY

OFF
D96AU259mod

B) Low Cost Application

In low cost applications where the P is not present, the suggested circuit is shown in fig.3.
The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage
divider.
The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by
and mute threshold exceeding, avoiding "Popping" problems.

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TDA7266SA
Figure 3. Stand-alone low-cost Application
VCC

C3 0.22F
R1
47K

IN1
ST-BY

R2
47K

C1
470F
OUT1+

OUT1-

15

OUT2+

14

OUT2-

13

C2
100nF

C4
10F

S-GND

9
-

Vref
C5 0.22F

12

IN2

MUTE

PW-GND

+
D95AU260A

Figure 4. Distortion vs Frequency

Figure 5. Gain vs Frequency

THD(%)

Le vel(dB r)
5.0000

10

4.0000

Vcc = 11V
Rl = 8 oh m
Po ut = 1W

3.0000
V cc = 11 V
Rl = 8 o h m

2.0000
1.0000
0.0
-1.000
P o u t = 100 m W

0.1

-2.000
-3.000
P o u t = 2W

-4.000
0.0 10

-5.000
100

1k

fr eq ue nc y (Hz)

10k

20k

10

100

1k

10k

100k

fr equenc y (Hz)

5/11

TDA7266SA
Figure 6. Mute Attenuation vs Vpin.8

Figure 8. Quiescent Current vs Supply Voltage

Iq (mA)

Attenua tion (dB)

10

70

65

-10
60

-20
-30

55

-40

50

-50
45

-60
-70

40

-80

35

-90
30

-100

1.5

2.5

3.5

4.5

Figure 7. Stand-By attenuation vs Vpin 9

Attenuation (dB)

0.2

0.4

0.6

0.8

1.2

1.4

Vpin.7 (V)

6/11

10

11

12

Vsupply(V)

Vpin .6(V)

10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120

1.6

1.8

2.2

2.4

13

14

15

16

17

18

TDA7266SA
Figure 9. PC Board Component Layout

Figure 10. Evaluation Board Top Layer Layout

Figure 11. Evaluation Board Bottom Layer Layout

7/11

TDA7266SA
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important
the dimensioning of the Heat Sinker RTh (C/W).
The parameters that influence the dimensioning are:
Maximum dissipated power for the device (Pdmax)
Max thermal resistance Junction to case (RTh j-c)
Max. ambient temperature Tamb max
Quiescent current Iq (mA)
Example:
VCC = 11V, Rload = 8ohm, RTh j-c = 2.5 C/W , Tamb max = 50C
2

Vc c
- + Iq Vc c
Pdmax = (N channels) -------------------------2 R loa d
-------------2
Pdmax = 2 ( 3.0 ) + 0.5 = 6.5 W
150 T am b max
150 50- 2.5 = 12.8C/W
- R T h j-c = --------------------(Heat Sinker) R Th c-a = ---------------------------------------6.5
P d max
In figure 12 is shown the Power derating curve for the device.
Figure 12. Power derating curve
25

Pd (W)

20
(a)

15
(b)
10
(c)
5

0
0

40

80
Tamb (C)

8/11

120

160

a)

Infinite Heatsink

b)

7 C/ W

c)

10 C/ W

TDA7266SA
Clipwatt Assembling Suggestions
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 13.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 13. Example of right placement of the clip

9/11

TDA7266SA
mm

inch

DIM.
MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.2

0.126

1.05

0.041

0.15

0.006

1.55

0.061

Weight: 1.92gr

0.49

0.55

0.019

0.022

0.67

0.73

0.026

0.029

1.14

1.27

1.4

0.045

0.050

0.055

G1

17.57

17.78

17.91

0.692

0.700

0.705

H1

12

0.480

H2

18.6

0.732

H3

19.85

0.781

17.95

0.707

L1

14.45

0.569

L2

10.7

OUTLINE AND
MECHANICAL DATA

11

11.2

0.421

0.433

L3

5.5

0.217

2.54

0.100

M1

2.54

0.100

0.441

Clipwatt15

0044538

10/11

TDA7266SA

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11

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