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STPS2045CT/CF/CG/CFP

POWER SCHOTTKY RECTIFIER


MAIN PRODUCT CHARACTERISTICS
IF(AV)

2 x 10 A

VRRM

45 V

Tj (max)

175 C

VF (max)

0.57 V

A1
K
A2

FEATURES AND BENEFITS


VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
INSULATED PACKAGE: ISOWATT220AB,
TO-220FPAB
Insulating voltage = 2000V DC
Capacitance = 12pF

DESCRIPTION
Dual center tap Schottky rectifier suited for
SwitchMode Power Supply and high frequency DC
to DC converters.
Packaged either in TO-220AB, ISOWATT220AB,
TO-220FPAB or D2PAK, this device is especially
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.

A1

A2

TO-220AB
STPS2045CT

A2
A1

ISOWATT220AB
STPS2045CF

A2

A2
K
A1

A1

D2PAK
STPS2045CG

TO-220FPAB
STPS2045CFP

ABSOLUTE RATINGS (limiting values, per diode)


Symbol

Parameter

VRRM

Repetitive peak reverse voltage

IF(RMS)

RMS forward current

IF(AV)

Average forward
current = 0.5

A
A

10

ISOWATT220AB
TO-220FPAB

Tc = 125C

Per device

20

IRRM

Repetitive peak reverse current

IRSM

Non repetitive peak reverse current

* :

30
Per diode

tp = 10 ms sinusoidal

dV/dt

Tc = 155C

Surge non repetitive forward current

Tj

Unit

45

TO-220AB / D PAK

IFSM

Tstg

Value

180

tp = 2 s square
F = 1kHz

tp = 100 ms square

Storage temperature range


Maximum operating junction temperature *
Critical rate of rise of reverse voltage

-65 to +175

175

10000

V/s

dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j a )

August 2002 - Ed: 3E

1/7

STPS2045CT/CF/CG/CFP
THERMAL RESISTANCES
Symbol
Rth (j-c)

Parameter
Junction to case

Rth (c)

Value

Unit
C/W

TO-220AB / D2PAK

Per diode
Total

2.2
1.3

ISOWATT220AB
TO-220FPAB

Per diode
Total

4.5
3.5

TO-220AB / D2PAK

Coupling

0.3

ISOWATT220AB
TO-220FPAB

2.5

When the diodes 1 and 2 are used simultaneously:


Tj (diode 1) = P (diode1) x Rth(j-c) (per diode) + P (diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (Per diode)
Symbol

Parameter

IR *

Reverse leakage current

Tests Conditions
Tj = 25C

Pulse test :

Forward voltage drop

Tj = 125C

IF = 10 A

Tj = 25C

IF = 20 A

Tj = 125C

IF = 20 A

* tp = 380 s, < 2%

To evaluate the conduction losses use the following equation :


P = 0.42 x IF(AV) + 0.015 IF2(RMS)

2/7

Typ.

Max.

Unit

100

15

mA

0.5

0.57

VR = VRRM

Tj = 125C
VF *

Min.

0.84
0.65

0.72

STPS2045CT/CF/CG/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).

Fig. 2: Average current versus


temperature (=0.5, per diode).

PF(av)(W)

IF(av)(A)

= 0.1
= 0.05

= 0.2

12

= 0.5

TO-220AB
DPAK

Rth(j-a)=Rth(j-c)

10

6
=1

ISOWATT220AB
TO-220FPAB

Rth(j-a)=15C/W

2
1
0

ambient

IF(av) (A)
0

=tp/T

2
tp

10

11

12

Fig. 3-1: Non repetitive surge peak forward current


versus overload duration (maximum values, per
diode) (TO-220AB and D2PAK).

=tp/T

Tamb(C)

tp

25

50

75

100

125

150

175

Fig. 3-2: Non repetitive surge peak forward current


versus overload duration (maximum values, per
diode) (ISOWATT220AB, TO-220FPAB).

IM(A)

IM(A)
140

100

120

80

100
60

80

Tc=75C

Tc=75C

60

Tc=100C

40

Tc=125C

IM

20

1E-2

1E-1

1E+0

0
1E-3

t(s)

1E-2

1E-1

1E+0

Fig. 4-2: Relative variation of thermal transient


impedance junction to case versus pulse duration
(ISOWATT220AB, TO-220FPAB).

Zth(j-c)/Rth(j-c)

Zth(j-c)/Rth(j-c)
1.0

1.0

0.8

0.8
0.6

= 0.5

= 0.5

0.4

0.4

0.2

=0.5

Fig. 4-1: Relative variation of thermal transient


impedance junction to case versus pulse duration
(TO-220AB and D2PAK).

0.6

Tc=125C

IM

20

t(s)

=0.5

0
1E-3

Tc=100C

40

= 0.2

0.2

= 0.1

tp(s)

Single pulse

0.0
1E-4

1E-3

1E-2

=tp/T

1E-1

= 0.2
= 0.1

tp

1E+0

tp(s)

Single pulse

0.0
1E-3

1E-2

1E-1

=tp/T

1E+0

tp

1E+1

3/7

STPS2045CT/CF/CG/CFP
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values, per diode).

Fig. 6: Junction capacitance versus reverse


voltage applied (typical values, per diode).

C(pF)

IR(A)

1000

5E+4

F=1MHz
Tj=25C

Tj=150C

1E+4

Tj=125C

1E+3

500

Tj=100C
Tj=75C

1E+2
Tj=50C

1E+1

200

Tj=25C

1E+0
VR(V)
1E-1

10

15

20

25

VR(V)
30

35

40

45

Fig. 7: Forward voltage drop versus forward


current (maximum values, per diode).

100

10

20

50

Fig. 8: Thermal resistance junction to ambient


versus copper surface under tab (Epoxy printed
circuit board, copper thickness: 35m).

IFM(A)

Rth(j-a) (C/W)

100.0

80
Tj=125C
Typical values

70
60

Tj=25C

10.0

50
40

Tj=125C

30

1.0

20
10

VFM(V)
0.1
0.0

4/7

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

S(Cu) (cm)
0

10

15

20

25

30

35

40

STPS2045CT/CF/CG/CFP
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
A
E

Min.

C2

L2

D
L
L3
A1
B2

B
G
A2

Millimeters

V2

* FLAT ZONE NO LESS THAN 2mm

Max.

Inches
Min.

Max.

4.40

4.60

0.173

0.181

A1

2.49

2.69

0.098

0.106

A2

0.03

0.23

0.001

0.009

0.70

0.93

0.027

0.037

B2

1.14

1.70

0.045

0.067

0.45

0.60

0.017

0.024

C2

1.23

1.36

0.048

0.054

8.95

9.35

0.352

0.368

10.00

10.40

0.393

0.409

4.88

5.28

0.192

0.208

15.00

15.85

0.590

0.624

L2

1.27

1.40

0.050

0.055

L3

1.40

1.75

0.055

0.069

2.40

3.20

0.094

0.126

R
V2

0.40 typ.
0

0.016 typ.
0

FOOTPRINT DIMENSIONS (in millimeters)


16.90

10.30

5.08
1.30

3.70
8.90

5/7

STPS2045CT/CF/CG/CFP
PACKAGE MECHANICAL DATA
TO-220AB
REF.
H2

L5
L7
Dia

OPTIONAL

L6

L2

L9
D

F2
F1(x2)
L4

F
E

G1
G

A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Dia.

DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.30
4.60
0.169
0.181
1.22
1.32
0.048
0.052
2.40
2.72
0.094
0.107
0.33
0.70
0.013
0.028
0.61
0.93
0.024
0.037
1.14
1.70
0.045
0.067
1.14
1.70
0.045
0.067
4.95
5.15
0.195
0.202
2.40
2.70
0.094
0.106
10.00
10.40
0.394
0.409
16.00 Typ.
0.630 Typ.
13.00
14.00
0.512
0.551
2.65
2.95
0.104
0.116
14.80
15.75
0.583
0.620
6.20
6.60
0.244
0.260
3.40
3.94
0.134
0.155
2.60 Typ.
0.102 Typ.
3.75
3.89
0.148
0.153

PACKAGE MECHANICAL DATA


TO-220FPAB
REF.

A
B

Dia
L6
L2

L7

L3
L5
D
F1
L4
F2

F
G1
G

6/7

A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.

DIMENSIONS
Millimeters

Inches

Min.
Max.
4.4
4.6
2.5
2.7
2.5
2.75
0.45
0.70
0.75
1
1.15
1.70
1.15
1.70
4.95
5.20
2.4
2.7
10
10.4
16 Typ.
28.6
30.6
9.8
10.6
2.9
3.6
15.9
16.4
9.00
9.30
3.00
3.20

Min.
Max.
0.173
0.181
0.098
0.106
0.098
0.108
0.018
0.027
0.030
0.039
0.045
0.067
0.045
0.067
0.195
0.205
0.094
0.106
0.393
0.409
0.63 Typ.
1.126
1.205
0.386
0.417
0.114
0.142
0.626
0.646
0.354
0.366
0.118
0.126

STPS2045CT/CF/CG/CFP
PACKAGE MECHANICAL DATA
ISOWATT220AB
DIMENSIONS
REF.

Millimeters
Min.

A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Diam

Max.

0.173
0.181
0.098
0.106
0.098
0.108
0.016
0.028
0.030
0.039
0.045
0.067
0.045
0.067
0.195
0.205
0.094
0.106
0.394
0.409
0.630 typ.
1.125
1.205
0.386
0.417
0.626
0.646
0.354
0.366
0.118
0.126

Marking

Package

Weight

Base qty

Delivery mode

STPS2045CT

STPS2045CT

TO-220AB

2.25 g.

50

Tube

STPS2045CF

STPS2045CF

ISOWATT220AB

2.08 g.

50

Tube

STPS2045CFP

STPS2045CFP

TO-220FPAB

STPS2045CG-TR

4.40
4.60
2.50
2.70
2.50
2.75
0.40
0.70
0.75
1.00
1.15
1.70
1.15
1.70
4.95
5.20
2.40
2.70
10.00
10.40
16.00 typ.
28.60
30.60
9.80
10.60
15.90
16.40
9.00
9.30
3.00
3.20

Min.

Type

STPS2045CG

Max.

Inches

STPS2045CG
STPS2045CG

2.0 g

50

Tube

1.48 g.

50

Tube

1.48 g.

1000

Tape & reel

D PAK
D PAK

Cooling method: by conduction (C)


Recommended torque value: 0.55 N.m.
Maximum torque value: 0.7 N.m.
Epoxy meets UL94,V0

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics


2002 STMicroelectronics - Printed in Italy - All rights reserved.
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7/7

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